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Global Heat Spreaders for Semiconductor Packaging Market Research Report 2024
Synopsis
Heat spreaders for semiconductor devices play a crucial role in managing and dissipating heat generated by the electronic components. They help to improve the overall thermal performance and reliability of the devices.
The global Heat Spreaders for Semiconductor Packaging market was valued at US$ 116 million in 2023 and is anticipated to reach US$ 236.1 million by 2030, witnessing a CAGR of 10.6% during the forecast period 2024-2030.
North American market for Heat Spreaders for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Heat Spreaders for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Heat Spreaders for Semiconductor Packaging include Shinko Electric Industries, A.L.M.T. (Sumitomo Electric), Coherent (II-VI), Elmet Technologies, Parker Hannifin, Excel Cell Electronic (ECE), Element Six, Leo Da Vinci Group and Applied Diamond, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Heat Spreaders for Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Heat Spreaders for Semiconductor Packaging.
Report Scope
The Heat Spreaders for Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Heat Spreaders for Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Heat Spreaders for Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Shinko Electric Industries
A.L.M.T. (Sumitomo Electric)
Coherent (II-VI)
Elmet Technologies
Parker Hannifin
Excel Cell Electronic (ECE)
Element Six
Leo Da Vinci Group
Applied Diamond
AMT Advanced Materials
Segment by Type
Metal Heat Spreader
Graphite Heat Spreader
Diamond Heat Spreader
Composite Materials
Segment by Application
CPU
GPU
SoC FPGA
Processor
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Heat Spreaders for Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Heat Spreaders for Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Heat Spreaders for Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Heat spreaders for semiconductor devices play a crucial role in managing and dissipating heat generated by the electronic components. They help to improve the overall thermal performance and reliability of the devices.
The global Heat Spreaders for Semiconductor Packaging market was valued at US$ 116 million in 2023 and is anticipated to reach US$ 236.1 million by 2030, witnessing a CAGR of 10.6% during the forecast period 2024-2030.
North American market for Heat Spreaders for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Heat Spreaders for Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Heat Spreaders for Semiconductor Packaging include Shinko Electric Industries, A.L.M.T. (Sumitomo Electric), Coherent (II-VI), Elmet Technologies, Parker Hannifin, Excel Cell Electronic (ECE), Element Six, Leo Da Vinci Group and Applied Diamond, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Heat Spreaders for Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Heat Spreaders for Semiconductor Packaging.
Report Scope
The Heat Spreaders for Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Heat Spreaders for Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Heat Spreaders for Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Shinko Electric Industries
A.L.M.T. (Sumitomo Electric)
Coherent (II-VI)
Elmet Technologies
Parker Hannifin
Excel Cell Electronic (ECE)
Element Six
Leo Da Vinci Group
Applied Diamond
AMT Advanced Materials
Segment by Type
Metal Heat Spreader
Graphite Heat Spreader
Diamond Heat Spreader
Composite Materials
Segment by Application
CPU
GPU
SoC FPGA
Processor
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Heat Spreaders for Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Heat Spreaders for Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Heat Spreaders for Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Heat Spreaders for Semiconductor Packaging Market Overview
1.1 Product Definition
1.2 Heat Spreaders for Semiconductor Packaging Segment by Type
1.2.1 Global Heat Spreaders for Semiconductor Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Metal Heat Spreader
1.2.3 Graphite Heat Spreader
1.2.4 Diamond Heat Spreader
1.2.5 Composite Materials
1.3 Heat Spreaders for Semiconductor Packaging Segment by Application
1.3.1 Global Heat Spreaders for Semiconductor Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 CPU
1.3.3 GPU
1.3.4 SoC FPGA
1.3.5 Processor
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Heat Spreaders for Semiconductor Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Heat Spreaders for Semiconductor Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Heat Spreaders for Semiconductor Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Heat Spreaders for Semiconductor Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Heat Spreaders for Semiconductor Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Heat Spreaders for Semiconductor Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Heat Spreaders for Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Heat Spreaders for Semiconductor Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Heat Spreaders for Semiconductor Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Heat Spreaders for Semiconductor Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Heat Spreaders for Semiconductor Packaging, Date of Enter into This Industry
2.9 Heat Spreaders for Semiconductor Packaging Market Competitive Situation and Trends
2.9.1 Heat Spreaders for Semiconductor Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Heat Spreaders for Semiconductor Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Heat Spreaders for Semiconductor Packaging Production by Region
3.1 Global Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Heat Spreaders for Semiconductor Packaging Production Value by Region (2019-2030)
3.2.1 Global Heat Spreaders for Semiconductor Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Heat Spreaders for Semiconductor Packaging by Region (2025-2030)
3.3 Global Heat Spreaders for Semiconductor Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Heat Spreaders for Semiconductor Packaging Production by Region (2019-2030)
3.4.1 Global Heat Spreaders for Semiconductor Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Heat Spreaders for Semiconductor Packaging by Region (2025-2030)
3.5 Global Heat Spreaders for Semiconductor Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Heat Spreaders for Semiconductor Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Heat Spreaders for Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
4 Heat Spreaders for Semiconductor Packaging Consumption by Region
4.1 Global Heat Spreaders for Semiconductor Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Heat Spreaders for Semiconductor Packaging Consumption by Region (2019-2030)
4.2.1 Global Heat Spreaders for Semiconductor Packaging Consumption by Region (2019-2024)
4.2.2 Global Heat Spreaders for Semiconductor Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Heat Spreaders for Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Heat Spreaders for Semiconductor Packaging Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Heat Spreaders for Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Heat Spreaders for Semiconductor Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Heat Spreaders for Semiconductor Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Heat Spreaders for Semiconductor Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Heat Spreaders for Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Heat Spreaders for Semiconductor Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Heat Spreaders for Semiconductor Packaging Production by Type (2019-2030)
5.1.1 Global Heat Spreaders for Semiconductor Packaging Production by Type (2019-2024)
5.1.2 Global Heat Spreaders for Semiconductor Packaging Production by Type (2025-2030)
5.1.3 Global Heat Spreaders for Semiconductor Packaging Production Market Share by Type (2019-2030)
5.2 Global Heat Spreaders for Semiconductor Packaging Production Value by Type (2019-2030)
5.2.1 Global Heat Spreaders for Semiconductor Packaging Production Value by Type (2019-2024)
5.2.2 Global Heat Spreaders for Semiconductor Packaging Production Value by Type (2025-2030)
5.2.3 Global Heat Spreaders for Semiconductor Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Heat Spreaders for Semiconductor Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Heat Spreaders for Semiconductor Packaging Production by Application (2019-2030)
6.1.1 Global Heat Spreaders for Semiconductor Packaging Production by Application (2019-2024)
6.1.2 Global Heat Spreaders for Semiconductor Packaging Production by Application (2025-2030)
6.1.3 Global Heat Spreaders for Semiconductor Packaging Production Market Share by Application (2019-2030)
6.2 Global Heat Spreaders for Semiconductor Packaging Production Value by Application (2019-2030)
6.2.1 Global Heat Spreaders for Semiconductor Packaging Production Value by Application (2019-2024)
6.2.2 Global Heat Spreaders for Semiconductor Packaging Production Value by Application (2025-2030)
6.2.3 Global Heat Spreaders for Semiconductor Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Heat Spreaders for Semiconductor Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Shinko Electric Industries
7.1.1 Shinko Electric Industries Heat Spreaders for Semiconductor Packaging Corporation Information
7.1.2 Shinko Electric Industries Heat Spreaders for Semiconductor Packaging Product Portfolio
7.1.3 Shinko Electric Industries Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Shinko Electric Industries Main Business and Markets Served
7.1.5 Shinko Electric Industries Recent Developments/Updates
7.2 A.L.M.T. (Sumitomo Electric)
7.2.1 A.L.M.T. (Sumitomo Electric) Heat Spreaders for Semiconductor Packaging Corporation Information
7.2.2 A.L.M.T. (Sumitomo Electric) Heat Spreaders for Semiconductor Packaging Product Portfolio
7.2.3 A.L.M.T. (Sumitomo Electric) Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 A.L.M.T. (Sumitomo Electric) Main Business and Markets Served
7.2.5 A.L.M.T. (Sumitomo Electric) Recent Developments/Updates
7.3 Coherent (II-VI)
7.3.1 Coherent (II-VI) Heat Spreaders for Semiconductor Packaging Corporation Information
7.3.2 Coherent (II-VI) Heat Spreaders for Semiconductor Packaging Product Portfolio
7.3.3 Coherent (II-VI) Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Coherent (II-VI) Main Business and Markets Served
7.3.5 Coherent (II-VI) Recent Developments/Updates
7.4 Elmet Technologies
7.4.1 Elmet Technologies Heat Spreaders for Semiconductor Packaging Corporation Information
7.4.2 Elmet Technologies Heat Spreaders for Semiconductor Packaging Product Portfolio
7.4.3 Elmet Technologies Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Elmet Technologies Main Business and Markets Served
7.4.5 Elmet Technologies Recent Developments/Updates
7.5 Parker Hannifin
7.5.1 Parker Hannifin Heat Spreaders for Semiconductor Packaging Corporation Information
7.5.2 Parker Hannifin Heat Spreaders for Semiconductor Packaging Product Portfolio
7.5.3 Parker Hannifin Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Parker Hannifin Main Business and Markets Served
7.5.5 Parker Hannifin Recent Developments/Updates
7.6 Excel Cell Electronic (ECE)
7.6.1 Excel Cell Electronic (ECE) Heat Spreaders for Semiconductor Packaging Corporation Information
7.6.2 Excel Cell Electronic (ECE) Heat Spreaders for Semiconductor Packaging Product Portfolio
7.6.3 Excel Cell Electronic (ECE) Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Excel Cell Electronic (ECE) Main Business and Markets Served
7.6.5 Excel Cell Electronic (ECE) Recent Developments/Updates
7.7 Element Six
7.7.1 Element Six Heat Spreaders for Semiconductor Packaging Corporation Information
7.7.2 Element Six Heat Spreaders for Semiconductor Packaging Product Portfolio
7.7.3 Element Six Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Element Six Main Business and Markets Served
7.7.5 Element Six Recent Developments/Updates
7.8 Leo Da Vinci Group
7.8.1 Leo Da Vinci Group Heat Spreaders for Semiconductor Packaging Corporation Information
7.8.2 Leo Da Vinci Group Heat Spreaders for Semiconductor Packaging Product Portfolio
7.8.3 Leo Da Vinci Group Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Leo Da Vinci Group Main Business and Markets Served
7.7.5 Leo Da Vinci Group Recent Developments/Updates
7.9 Applied Diamond
7.9.1 Applied Diamond Heat Spreaders for Semiconductor Packaging Corporation Information
7.9.2 Applied Diamond Heat Spreaders for Semiconductor Packaging Product Portfolio
7.9.3 Applied Diamond Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Applied Diamond Main Business and Markets Served
7.9.5 Applied Diamond Recent Developments/Updates
7.10 AMT Advanced Materials
7.10.1 AMT Advanced Materials Heat Spreaders for Semiconductor Packaging Corporation Information
7.10.2 AMT Advanced Materials Heat Spreaders for Semiconductor Packaging Product Portfolio
7.10.3 AMT Advanced Materials Heat Spreaders for Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 AMT Advanced Materials Main Business and Markets Served
7.10.5 AMT Advanced Materials Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Heat Spreaders for Semiconductor Packaging Industry Chain Analysis
8.2 Heat Spreaders for Semiconductor Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Heat Spreaders for Semiconductor Packaging Production Mode & Process
8.4 Heat Spreaders for Semiconductor Packaging Sales and Marketing
8.4.1 Heat Spreaders for Semiconductor Packaging Sales Channels
8.4.2 Heat Spreaders for Semiconductor Packaging Distributors
8.5 Heat Spreaders for Semiconductor Packaging Customers
9 Heat Spreaders for Semiconductor Packaging Market Dynamics
9.1 Heat Spreaders for Semiconductor Packaging Industry Trends
9.2 Heat Spreaders for Semiconductor Packaging Market Drivers
9.3 Heat Spreaders for Semiconductor Packaging Market Challenges
9.4 Heat Spreaders for Semiconductor Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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