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Synopsis
High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
The global High Density Interconnect market was valued at US$ 13200 million in 2023 and is anticipated to reach US$ 26120 million by 2030, witnessing a CAGR of 10.1% during the forecast period 2024-2030.
North American market for High Density Interconnect is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for High Density Interconnect is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of High Density Interconnect include IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq and Unitech Printed Circuit Board Corp., etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for High Density Interconnect, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Density Interconnect.
Report Scope
The High Density Interconnect market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Density Interconnect market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Density Interconnect manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
- IBIDEN Group
- Unimicron
- AT&S
- SEMCO
- NCAB Group
- Young Poong Group
- ZDT
- Compeq
- Unitech Printed Circuit Board Corp.
- LG Innotek
- Tripod Technology
- TTM Technologies
- Daeduck
- HannStar Board
- Nan Ya PCB
- CMK Corporation
- Kingboard
- Ellington
- CCTC
- Wuzhu Technology
- Kinwong
- Aoshikang
- Sierra Circuits
- Bittele Electronics
- Epec
- Würth Elektronik
- NOD Electronics
- San Francisco Circuits
- PCBCart
- Advanced Circuits
Segment by Type
- Single Panel
- Double Panel
- Others
Segment by Application
- Automotive Electronics
- Consumer Electronics
- Other Electronic Products
Production by Region
- North America
- Europe
- China
- Japan
- South Korea
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Netherlands)
- Asia-Pacific (China, Japan, South Korea, China Taiwan, Southeast Asia, India)
- Latin America, Middle East & Africa (Latin America, Mexico, Brazil, Turkey)
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High Density Interconnect manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High Density Interconnect by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High Density Interconnect in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 High Density Interconnect Market Overview
1.1 Product Definition
1.2 High Density Interconnect Segment by Type
1.2.1 Global High Density Interconnect Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Single Panel
1.2.3 Double Panel
1.2.4 Others
1.3 High Density Interconnect Segment by Application
1.3.1 Global High Density Interconnect Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automotive Electronics
1.3.3 Consumer Electronics
1.3.4 Other Electronic Products
1.4 Global Market Growth Prospects
1.4.1 Global High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global High Density Interconnect Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global High Density Interconnect Production Estimates and Forecasts (2019-2030)
1.4.4 Global High Density Interconnect Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global High Density Interconnect Production Market Share by Manufacturers (2019-2024)
2.2 Global High Density Interconnect Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of High Density Interconnect, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global High Density Interconnect Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global High Density Interconnect Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of High Density Interconnect, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of High Density Interconnect, Product Offered and Application
2.8 Global Key Manufacturers of High Density Interconnect, Date of Enter into This Industry
2.9 High Density Interconnect Market Competitive Situation and Trends
2.9.1 High Density Interconnect Market Concentration Rate
2.9.2 Global 5 and 10 Largest High Density Interconnect Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 High Density Interconnect Production by Region
3.1 Global High Density Interconnect Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global High Density Interconnect Production Value by Region (2019-2030)
3.2.1 Global High Density Interconnect Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of High Density Interconnect by Region (2025-2030)
3.3 Global High Density Interconnect Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global High Density Interconnect Production by Region (2019-2030)
3.4.1 Global High Density Interconnect Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of High Density Interconnect by Region (2025-2030)
3.5 Global High Density Interconnect Market Price Analysis by Region (2019-2024)
3.6 Global High Density Interconnect Production and Value, Year-over-Year Growth
3.6.1 North America High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.3 China High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea High Density Interconnect Production Value Estimates and Forecasts (2019-2030)
4 High Density Interconnect Consumption by Region
4.1 Global High Density Interconnect Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global High Density Interconnect Consumption by Region (2019-2030)
4.2.1 Global High Density Interconnect Consumption by Region (2019-2024)
4.2.2 Global High Density Interconnect Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America High Density Interconnect Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe High Density Interconnect Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific High Density Interconnect Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific High Density Interconnect Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa High Density Interconnect Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa High Density Interconnect Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global High Density Interconnect Production by Type (2019-2030)
5.1.1 Global High Density Interconnect Production by Type (2019-2024)
5.1.2 Global High Density Interconnect Production by Type (2025-2030)
5.1.3 Global High Density Interconnect Production Market Share by Type (2019-2030)
5.2 Global High Density Interconnect Production Value by Type (2019-2030)
5.2.1 Global High Density Interconnect Production Value by Type (2019-2024)
5.2.2 Global High Density Interconnect Production Value by Type (2025-2030)
5.2.3 Global High Density Interconnect Production Value Market Share by Type (2019-2030)
5.3 Global High Density Interconnect Price by Type (2019-2030)
6 Segment by Application
6.1 Global High Density Interconnect Production by Application (2019-2030)
6.1.1 Global High Density Interconnect Production by Application (2019-2024)
6.1.2 Global High Density Interconnect Production by Application (2025-2030)
6.1.3 Global High Density Interconnect Production Market Share by Application (2019-2030)
6.2 Global High Density Interconnect Production Value by Application (2019-2030)
6.2.1 Global High Density Interconnect Production Value by Application (2019-2024)
6.2.2 Global High Density Interconnect Production Value by Application (2025-2030)
6.2.3 Global High Density Interconnect Production Value Market Share by Application (2019-2030)
6.3 Global High Density Interconnect Price by Application (2019-2030)
7 Key Companies Profiled
7.1 IBIDEN Group
7.1.1 IBIDEN Group High Density Interconnect Corporation Information
7.1.2 IBIDEN Group High Density Interconnect Product Portfolio
7.1.3 IBIDEN Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.1.4 IBIDEN Group Main Business and Markets Served
7.1.5 IBIDEN Group Recent Developments/Updates
7.2 Unimicron
7.2.1 Unimicron High Density Interconnect Corporation Information
7.2.2 Unimicron High Density Interconnect Product Portfolio
7.2.3 Unimicron High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Unimicron Main Business and Markets Served
7.2.5 Unimicron Recent Developments/Updates
7.3 AT&S
7.3.1 AT&S High Density Interconnect Corporation Information
7.3.2 AT&S High Density Interconnect Product Portfolio
7.3.3 AT&S High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.3.4 AT&S Main Business and Markets Served
7.3.5 AT&S Recent Developments/Updates
7.4 SEMCO
7.4.1 SEMCO High Density Interconnect Corporation Information
7.4.2 SEMCO High Density Interconnect Product Portfolio
7.4.3 SEMCO High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.4.4 SEMCO Main Business and Markets Served
7.4.5 SEMCO Recent Developments/Updates
7.5 NCAB Group
7.5.1 NCAB Group High Density Interconnect Corporation Information
7.5.2 NCAB Group High Density Interconnect Product Portfolio
7.5.3 NCAB Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.5.4 NCAB Group Main Business and Markets Served
7.5.5 NCAB Group Recent Developments/Updates
7.6 Young Poong Group
7.6.1 Young Poong Group High Density Interconnect Corporation Information
7.6.2 Young Poong Group High Density Interconnect Product Portfolio
7.6.3 Young Poong Group High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Young Poong Group Main Business and Markets Served
7.6.5 Young Poong Group Recent Developments/Updates
7.7 ZDT
7.7.1 ZDT High Density Interconnect Corporation Information
7.7.2 ZDT High Density Interconnect Product Portfolio
7.7.3 ZDT High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ZDT Main Business and Markets Served
7.7.5 ZDT Recent Developments/Updates
7.8 Compeq
7.8.1 Compeq High Density Interconnect Corporation Information
7.8.2 Compeq High Density Interconnect Product Portfolio
7.8.3 Compeq High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Compeq Main Business and Markets Served
7.7.5 Compeq Recent Developments/Updates
7.9 Unitech Printed Circuit Board Corp.
7.9.1 Unitech Printed Circuit Board Corp. High Density Interconnect Corporation Information
7.9.2 Unitech Printed Circuit Board Corp. High Density Interconnect Product Portfolio
7.9.3 Unitech Printed Circuit Board Corp. High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Unitech Printed Circuit Board Corp. Main Business and Markets Served
7.9.5 Unitech Printed Circuit Board Corp. Recent Developments/Updates
7.10 LG Innotek
7.10.1 LG Innotek High Density Interconnect Corporation Information
7.10.2 LG Innotek High Density Interconnect Product Portfolio
7.10.3 LG Innotek High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.10.4 LG Innotek Main Business and Markets Served
7.10.5 LG Innotek Recent Developments/Updates
7.11 Tripod Technology
7.11.1 Tripod Technology High Density Interconnect Corporation Information
7.11.2 Tripod Technology High Density Interconnect Product Portfolio
7.11.3 Tripod Technology High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Tripod Technology Main Business and Markets Served
7.11.5 Tripod Technology Recent Developments/Updates
7.12 TTM Technologies
7.12.1 TTM Technologies High Density Interconnect Corporation Information
7.12.2 TTM Technologies High Density Interconnect Product Portfolio
7.12.3 TTM Technologies High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.12.4 TTM Technologies Main Business and Markets Served
7.12.5 TTM Technologies Recent Developments/Updates
7.13 Daeduck
7.13.1 Daeduck High Density Interconnect Corporation Information
7.13.2 Daeduck High Density Interconnect Product Portfolio
7.13.3 Daeduck High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Daeduck Main Business and Markets Served
7.13.5 Daeduck Recent Developments/Updates
7.14 HannStar Board
7.14.1 HannStar Board High Density Interconnect Corporation Information
7.14.2 HannStar Board High Density Interconnect Product Portfolio
7.14.3 HannStar Board High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.14.4 HannStar Board Main Business and Markets Served
7.14.5 HannStar Board Recent Developments/Updates
7.15 Nan Ya PCB
7.15.1 Nan Ya PCB High Density Interconnect Corporation Information
7.15.2 Nan Ya PCB High Density Interconnect Product Portfolio
7.15.3 Nan Ya PCB High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Nan Ya PCB Main Business and Markets Served
7.15.5 Nan Ya PCB Recent Developments/Updates
7.16 CMK Corporation
7.16.1 CMK Corporation High Density Interconnect Corporation Information
7.16.2 CMK Corporation High Density Interconnect Product Portfolio
7.16.3 CMK Corporation High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.16.4 CMK Corporation Main Business and Markets Served
7.16.5 CMK Corporation Recent Developments/Updates
7.17 Kingboard
7.17.1 Kingboard High Density Interconnect Corporation Information
7.17.2 Kingboard High Density Interconnect Product Portfolio
7.17.3 Kingboard High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.17.4 Kingboard Main Business and Markets Served
7.17.5 Kingboard Recent Developments/Updates
7.18 Ellington
7.18.1 Ellington High Density Interconnect Corporation Information
7.18.2 Ellington High Density Interconnect Product Portfolio
7.18.3 Ellington High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Ellington Main Business and Markets Served
7.18.5 Ellington Recent Developments/Updates
7.19 CCTC
7.19.1 CCTC High Density Interconnect Corporation Information
7.19.2 CCTC High Density Interconnect Product Portfolio
7.19.3 CCTC High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.19.4 CCTC Main Business and Markets Served
7.19.5 CCTC Recent Developments/Updates
7.20 Wuzhu Technology
7.20.1 Wuzhu Technology High Density Interconnect Corporation Information
7.20.2 Wuzhu Technology High Density Interconnect Product Portfolio
7.20.3 Wuzhu Technology High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Wuzhu Technology Main Business and Markets Served
7.20.5 Wuzhu Technology Recent Developments/Updates
7.21 Kinwong
7.21.1 Kinwong High Density Interconnect Corporation Information
7.21.2 Kinwong High Density Interconnect Product Portfolio
7.21.3 Kinwong High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.21.4 Kinwong Main Business and Markets Served
7.21.5 Kinwong Recent Developments/Updates
7.22 Aoshikang
7.22.1 Aoshikang High Density Interconnect Corporation Information
7.22.2 Aoshikang High Density Interconnect Product Portfolio
7.22.3 Aoshikang High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.22.4 Aoshikang Main Business and Markets Served
7.22.5 Aoshikang Recent Developments/Updates
7.23 Sierra Circuits
7.23.1 Sierra Circuits High Density Interconnect Corporation Information
7.23.2 Sierra Circuits High Density Interconnect Product Portfolio
7.23.3 Sierra Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.23.4 Sierra Circuits Main Business and Markets Served
7.23.5 Sierra Circuits Recent Developments/Updates
7.24 Bittele Electronics
7.24.1 Bittele Electronics High Density Interconnect Corporation Information
7.24.2 Bittele Electronics High Density Interconnect Product Portfolio
7.24.3 Bittele Electronics High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.24.4 Bittele Electronics Main Business and Markets Served
7.24.5 Bittele Electronics Recent Developments/Updates
7.25 Epec
7.25.1 Epec High Density Interconnect Corporation Information
7.25.2 Epec High Density Interconnect Product Portfolio
7.25.3 Epec High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.25.4 Epec Main Business and Markets Served
7.25.5 Epec Recent Developments/Updates
7.26 Würth Elektronik
7.26.1 Würth Elektronik High Density Interconnect Corporation Information
7.26.2 Würth Elektronik High Density Interconnect Product Portfolio
7.26.3 Würth Elektronik High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.26.4 Würth Elektronik Main Business and Markets Served
7.26.5 Würth Elektronik Recent Developments/Updates
7.27 NOD Electronics
7.27.1 NOD Electronics High Density Interconnect Corporation Information
7.27.2 NOD Electronics High Density Interconnect Product Portfolio
7.27.3 NOD Electronics High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.27.4 NOD Electronics Main Business and Markets Served
7.27.5 NOD Electronics Recent Developments/Updates
7.28 San Francisco Circuits
7.28.1 San Francisco Circuits High Density Interconnect Corporation Information
7.28.2 San Francisco Circuits High Density Interconnect Product Portfolio
7.28.3 San Francisco Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.28.4 San Francisco Circuits Main Business and Markets Served
7.28.5 San Francisco Circuits Recent Developments/Updates
7.29 PCBCart
7.29.1 PCBCart High Density Interconnect Corporation Information
7.29.2 PCBCart High Density Interconnect Product Portfolio
7.29.3 PCBCart High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.29.4 PCBCart Main Business and Markets Served
7.29.5 PCBCart Recent Developments/Updates
7.30 Advanced Circuits
7.30.1 Advanced Circuits High Density Interconnect Corporation Information
7.30.2 Advanced Circuits High Density Interconnect Product Portfolio
7.30.3 Advanced Circuits High Density Interconnect Production, Value, Price and Gross Margin (2019-2024)
7.30.4 Advanced Circuits Main Business and Markets Served
7.30.5 Advanced Circuits Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 High Density Interconnect Industry Chain Analysis
8.2 High Density Interconnect Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 High Density Interconnect Production Mode & Process
8.4 High Density Interconnect Sales and Marketing
8.4.1 High Density Interconnect Sales Channels
8.4.2 High Density Interconnect Distributors
8.5 High Density Interconnect Customers
9 High Density Interconnect Market Dynamics
9.1 High Density Interconnect Industry Trends
9.2 High Density Interconnect Market Drivers
9.3 High Density Interconnect Market Challenges
9.4 High Density Interconnect Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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