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Global High Density Interconnect PCB Market Research Report 2024

Global High Density Interconnect PCB Market Research Report 2024

Publishing Date : Jan, 2024

License Type :
 

Report Code : 1549317

No of Pages : 103

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Synopsis
A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
The global High Density Interconnect PCB market was valued at US$ 8203.5 million in 2023 and is anticipated to reach US$ 13600 million by 2030, witnessing a CAGR of 7.0% during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for High Density Interconnect PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Density Interconnect PCB.
Report Scope
The High Density Interconnect PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Density Interconnect PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Density Interconnect PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TTM Technologies (US)
PCBCART (China)
Millennium Circuits Limited (US)
RAYMING (China)
Mistral Solutions Pvt. Ltd. (India)
SIERRA CIRCUITS INC. (US)
Advanced Circuits (US)
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
FINELINE Ltd. (Israel)
Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
Segment by Type
Smartphone & Tablet
Laptop & PC
Smart Wearables
Others
Segment by Application
Consumer Electronics
Military And Defense
Telecom And IT
Automotive
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High Density Interconnect PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High Density Interconnect PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High Density Interconnect PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 High Density Interconnect PCB Market Overview
1.1 Product Definition
1.2 High Density Interconnect PCB Segment by Type
1.2.1 Global High Density Interconnect PCB Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Smartphone & Tablet
1.2.3 Laptop & PC
1.2.4 Smart Wearables
1.2.5 Others
1.3 High Density Interconnect PCB Segment by Application
1.3.1 Global High Density Interconnect PCB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Military And Defense
1.3.4 Telecom And IT
1.3.5 Automotive
1.4 Global Market Growth Prospects
1.4.1 Global High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global High Density Interconnect PCB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global High Density Interconnect PCB Production Estimates and Forecasts (2019-2030)
1.4.4 Global High Density Interconnect PCB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global High Density Interconnect PCB Production Market Share by Manufacturers (2019-2024)
2.2 Global High Density Interconnect PCB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of High Density Interconnect PCB, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global High Density Interconnect PCB Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global High Density Interconnect PCB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of High Density Interconnect PCB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of High Density Interconnect PCB, Product Offered and Application
2.8 Global Key Manufacturers of High Density Interconnect PCB, Date of Enter into This Industry
2.9 High Density Interconnect PCB Market Competitive Situation and Trends
2.9.1 High Density Interconnect PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest High Density Interconnect PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 High Density Interconnect PCB Production by Region
3.1 Global High Density Interconnect PCB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global High Density Interconnect PCB Production Value by Region (2019-2030)
3.2.1 Global High Density Interconnect PCB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of High Density Interconnect PCB by Region (2025-2030)
3.3 Global High Density Interconnect PCB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global High Density Interconnect PCB Production by Region (2019-2030)
3.4.1 Global High Density Interconnect PCB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of High Density Interconnect PCB by Region (2025-2030)
3.5 Global High Density Interconnect PCB Market Price Analysis by Region (2019-2024)
3.6 Global High Density Interconnect PCB Production and Value, Year-over-Year Growth
3.6.1 North America High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea High Density Interconnect PCB Production Value Estimates and Forecasts (2019-2030)
4 High Density Interconnect PCB Consumption by Region
4.1 Global High Density Interconnect PCB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global High Density Interconnect PCB Consumption by Region (2019-2030)
4.2.1 Global High Density Interconnect PCB Consumption by Region (2019-2024)
4.2.2 Global High Density Interconnect PCB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America High Density Interconnect PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America High Density Interconnect PCB Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe High Density Interconnect PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe High Density Interconnect PCB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific High Density Interconnect PCB Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific High Density Interconnect PCB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa High Density Interconnect PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa High Density Interconnect PCB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global High Density Interconnect PCB Production by Type (2019-2030)
5.1.1 Global High Density Interconnect PCB Production by Type (2019-2024)
5.1.2 Global High Density Interconnect PCB Production by Type (2025-2030)
5.1.3 Global High Density Interconnect PCB Production Market Share by Type (2019-2030)
5.2 Global High Density Interconnect PCB Production Value by Type (2019-2030)
5.2.1 Global High Density Interconnect PCB Production Value by Type (2019-2024)
5.2.2 Global High Density Interconnect PCB Production Value by Type (2025-2030)
5.2.3 Global High Density Interconnect PCB Production Value Market Share by Type (2019-2030)
5.3 Global High Density Interconnect PCB Price by Type (2019-2030)
6 Segment by Application
6.1 Global High Density Interconnect PCB Production by Application (2019-2030)
6.1.1 Global High Density Interconnect PCB Production by Application (2019-2024)
6.1.2 Global High Density Interconnect PCB Production by Application (2025-2030)
6.1.3 Global High Density Interconnect PCB Production Market Share by Application (2019-2030)
6.2 Global High Density Interconnect PCB Production Value by Application (2019-2030)
6.2.1 Global High Density Interconnect PCB Production Value by Application (2019-2024)
6.2.2 Global High Density Interconnect PCB Production Value by Application (2025-2030)
6.2.3 Global High Density Interconnect PCB Production Value Market Share by Application (2019-2030)
6.3 Global High Density Interconnect PCB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 TTM Technologies (US)
7.1.1 TTM Technologies (US) High Density Interconnect PCB Corporation Information
7.1.2 TTM Technologies (US) High Density Interconnect PCB Product Portfolio
7.1.3 TTM Technologies (US) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 TTM Technologies (US) Main Business and Markets Served
7.1.5 TTM Technologies (US) Recent Developments/Updates
7.2 PCBCART (China)
7.2.1 PCBCART (China) High Density Interconnect PCB Corporation Information
7.2.2 PCBCART (China) High Density Interconnect PCB Product Portfolio
7.2.3 PCBCART (China) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 PCBCART (China) Main Business and Markets Served
7.2.5 PCBCART (China) Recent Developments/Updates
7.3 Millennium Circuits Limited (US)
7.3.1 Millennium Circuits Limited (US) High Density Interconnect PCB Corporation Information
7.3.2 Millennium Circuits Limited (US) High Density Interconnect PCB Product Portfolio
7.3.3 Millennium Circuits Limited (US) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Millennium Circuits Limited (US) Main Business and Markets Served
7.3.5 Millennium Circuits Limited (US) Recent Developments/Updates
7.4 RAYMING (China)
7.4.1 RAYMING (China) High Density Interconnect PCB Corporation Information
7.4.2 RAYMING (China) High Density Interconnect PCB Product Portfolio
7.4.3 RAYMING (China) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 RAYMING (China) Main Business and Markets Served
7.4.5 RAYMING (China) Recent Developments/Updates
7.5 Mistral Solutions Pvt. Ltd. (India)
7.5.1 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Corporation Information
7.5.2 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Product Portfolio
7.5.3 Mistral Solutions Pvt. Ltd. (India) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Mistral Solutions Pvt. Ltd. (India) Main Business and Markets Served
7.5.5 Mistral Solutions Pvt. Ltd. (India) Recent Developments/Updates
7.6 SIERRA CIRCUITS INC. (US)
7.6.1 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Corporation Information
7.6.2 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Product Portfolio
7.6.3 SIERRA CIRCUITS INC. (US) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 SIERRA CIRCUITS INC. (US) Main Business and Markets Served
7.6.5 SIERRA CIRCUITS INC. (US) Recent Developments/Updates
7.7 Advanced Circuits (US)
7.7.1 Advanced Circuits (US) High Density Interconnect PCB Corporation Information
7.7.2 Advanced Circuits (US) High Density Interconnect PCB Product Portfolio
7.7.3 Advanced Circuits (US) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Advanced Circuits (US) Main Business and Markets Served
7.7.5 Advanced Circuits (US) Recent Developments/Updates
7.8 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan)
7.8.1 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Corporation Information
7.8.2 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Product Portfolio
7.8.3 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.8.4 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Main Business and Markets Served
7.7.5 FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan) Recent Developments/Updates
7.9 FINELINE Ltd. (Israel)
7.9.1 FINELINE Ltd. (Israel) High Density Interconnect PCB Corporation Information
7.9.2 FINELINE Ltd. (Israel) High Density Interconnect PCB Product Portfolio
7.9.3 FINELINE Ltd. (Israel) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.9.4 FINELINE Ltd. (Israel) Main Business and Markets Served
7.9.5 FINELINE Ltd. (Israel) Recent Developments/Updates
7.10 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
7.10.1 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Corporation Information
7.10.2 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Product Portfolio
7.10.3 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) High Density Interconnect PCB Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Main Business and Markets Served
7.10.5 Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 High Density Interconnect PCB Industry Chain Analysis
8.2 High Density Interconnect PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 High Density Interconnect PCB Production Mode & Process
8.4 High Density Interconnect PCB Sales and Marketing
8.4.1 High Density Interconnect PCB Sales Channels
8.4.2 High Density Interconnect PCB Distributors
8.5 High Density Interconnect PCB Customers
9 High Density Interconnect PCB Market Dynamics
9.1 High Density Interconnect PCB Industry Trends
9.2 High Density Interconnect PCB Market Drivers
9.3 High Density Interconnect PCB Market Challenges
9.4 High Density Interconnect PCB Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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