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Global High Layer Count PCB Market Research Report 2024
Synopsis
High Layer Count PCB with Three or more copper layers, this is achieved by manufacturing the desired number of double sided boards (called inner layers) and bonding them together with glue (pre-preg), standard processes are then followed to complete the board.
The global High Layer Count PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for High Layer Count PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Layer Count PCB.
Report Scope
The High Layer Count PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Layer Count PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Layer Count PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TTM Technologies
Meiko
PW Circuits
Tripod Technoloigy
KingBoard
AT&S
Nippon Mektron
Ellington Electronic Technology
Schweizer
Bomin Electronics
Ibiden
ZDT
Compeq
Segment by Type
3-layer High Layer Count PCB
14-layer High Layer Count PCB
32-layer High Layer Count PCB
Others
Segment by Application
Consumer Electronics
Computer
Communications
Industrial/Medical
Automotive
Military/Aerospace
Others
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High Layer Count PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High Layer Count PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High Layer Count PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
High Layer Count PCB with Three or more copper layers, this is achieved by manufacturing the desired number of double sided boards (called inner layers) and bonding them together with glue (pre-preg), standard processes are then followed to complete the board.
The global High Layer Count PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for High Layer Count PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Layer Count PCB.
Report Scope
The High Layer Count PCB market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global High Layer Count PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the High Layer Count PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TTM Technologies
Meiko
PW Circuits
Tripod Technoloigy
KingBoard
AT&S
Nippon Mektron
Ellington Electronic Technology
Schweizer
Bomin Electronics
Ibiden
ZDT
Compeq
Segment by Type
3-layer High Layer Count PCB
14-layer High Layer Count PCB
32-layer High Layer Count PCB
Others
Segment by Application
Consumer Electronics
Computer
Communications
Industrial/Medical
Automotive
Military/Aerospace
Others
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of High Layer Count PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of High Layer Count PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of High Layer Count PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 High Layer Count PCB Market Overview
1.1 Product Definition
1.2 High Layer Count PCB Segment by Type
1.2.1 Global High Layer Count PCB Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 3-layer High Layer Count PCB
1.2.3 14-layer High Layer Count PCB
1.2.4 32-layer High Layer Count PCB
1.2.5 Others
1.3 High Layer Count PCB Segment by Application
1.3.1 Global High Layer Count PCB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Computer
1.3.4 Communications
1.3.5 Industrial/Medical
1.3.6 Automotive
1.3.7 Military/Aerospace
1.3.8 Others
1.4 Global Market Growth Prospects
1.4.1 Global High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global High Layer Count PCB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global High Layer Count PCB Production Estimates and Forecasts (2019-2030)
1.4.4 Global High Layer Count PCB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global High Layer Count PCB Production Market Share by Manufacturers (2019-2024)
2.2 Global High Layer Count PCB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of High Layer Count PCB, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global High Layer Count PCB Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global High Layer Count PCB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of High Layer Count PCB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of High Layer Count PCB, Product Offered and Application
2.8 Global Key Manufacturers of High Layer Count PCB, Date of Enter into This Industry
2.9 High Layer Count PCB Market Competitive Situation and Trends
2.9.1 High Layer Count PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest High Layer Count PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 High Layer Count PCB Production by Region
3.1 Global High Layer Count PCB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global High Layer Count PCB Production Value by Region (2019-2030)
3.2.1 Global High Layer Count PCB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of High Layer Count PCB by Region (2025-2030)
3.3 Global High Layer Count PCB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global High Layer Count PCB Production by Region (2019-2030)
3.4.1 Global High Layer Count PCB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of High Layer Count PCB by Region (2025-2030)
3.5 Global High Layer Count PCB Market Price Analysis by Region (2019-2024)
3.6 Global High Layer Count PCB Production and Value, Year-over-Year Growth
3.6.1 North America High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan High Layer Count PCB Production Value Estimates and Forecasts (2019-2030)
4 High Layer Count PCB Consumption by Region
4.1 Global High Layer Count PCB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global High Layer Count PCB Consumption by Region (2019-2030)
4.2.1 Global High Layer Count PCB Consumption by Region (2019-2024)
4.2.2 Global High Layer Count PCB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America High Layer Count PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America High Layer Count PCB Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe High Layer Count PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe High Layer Count PCB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific High Layer Count PCB Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific High Layer Count PCB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa High Layer Count PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa High Layer Count PCB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global High Layer Count PCB Production by Type (2019-2030)
5.1.1 Global High Layer Count PCB Production by Type (2019-2024)
5.1.2 Global High Layer Count PCB Production by Type (2025-2030)
5.1.3 Global High Layer Count PCB Production Market Share by Type (2019-2030)
5.2 Global High Layer Count PCB Production Value by Type (2019-2030)
5.2.1 Global High Layer Count PCB Production Value by Type (2019-2024)
5.2.2 Global High Layer Count PCB Production Value by Type (2025-2030)
5.2.3 Global High Layer Count PCB Production Value Market Share by Type (2019-2030)
5.3 Global High Layer Count PCB Price by Type (2019-2030)
6 Segment by Application
6.1 Global High Layer Count PCB Production by Application (2019-2030)
6.1.1 Global High Layer Count PCB Production by Application (2019-2024)
6.1.2 Global High Layer Count PCB Production by Application (2025-2030)
6.1.3 Global High Layer Count PCB Production Market Share by Application (2019-2030)
6.2 Global High Layer Count PCB Production Value by Application (2019-2030)
6.2.1 Global High Layer Count PCB Production Value by Application (2019-2024)
6.2.2 Global High Layer Count PCB Production Value by Application (2025-2030)
6.2.3 Global High Layer Count PCB Production Value Market Share by Application (2019-2030)
6.3 Global High Layer Count PCB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 TTM Technologies
7.1.1 TTM Technologies High Layer Count PCB Corporation Information
7.1.2 TTM Technologies High Layer Count PCB Product Portfolio
7.1.3 TTM Technologies High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 TTM Technologies Main Business and Markets Served
7.1.5 TTM Technologies Recent Developments/Updates
7.2 Meiko
7.2.1 Meiko High Layer Count PCB Corporation Information
7.2.2 Meiko High Layer Count PCB Product Portfolio
7.2.3 Meiko High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Meiko Main Business and Markets Served
7.2.5 Meiko Recent Developments/Updates
7.3 PW Circuits
7.3.1 PW Circuits High Layer Count PCB Corporation Information
7.3.2 PW Circuits High Layer Count PCB Product Portfolio
7.3.3 PW Circuits High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 PW Circuits Main Business and Markets Served
7.3.5 PW Circuits Recent Developments/Updates
7.4 Tripod Technoloigy
7.4.1 Tripod Technoloigy High Layer Count PCB Corporation Information
7.4.2 Tripod Technoloigy High Layer Count PCB Product Portfolio
7.4.3 Tripod Technoloigy High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Tripod Technoloigy Main Business and Markets Served
7.4.5 Tripod Technoloigy Recent Developments/Updates
7.5 KingBoard
7.5.1 KingBoard High Layer Count PCB Corporation Information
7.5.2 KingBoard High Layer Count PCB Product Portfolio
7.5.3 KingBoard High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 KingBoard Main Business and Markets Served
7.5.5 KingBoard Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S High Layer Count PCB Corporation Information
7.6.2 AT&S High Layer Count PCB Product Portfolio
7.6.3 AT&S High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 Nippon Mektron
7.7.1 Nippon Mektron High Layer Count PCB Corporation Information
7.7.2 Nippon Mektron High Layer Count PCB Product Portfolio
7.7.3 Nippon Mektron High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Nippon Mektron Main Business and Markets Served
7.7.5 Nippon Mektron Recent Developments/Updates
7.8 Ellington Electronic Technology
7.8.1 Ellington Electronic Technology High Layer Count PCB Corporation Information
7.8.2 Ellington Electronic Technology High Layer Count PCB Product Portfolio
7.8.3 Ellington Electronic Technology High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Ellington Electronic Technology Main Business and Markets Served
7.7.5 Ellington Electronic Technology Recent Developments/Updates
7.9 Schweizer
7.9.1 Schweizer High Layer Count PCB Corporation Information
7.9.2 Schweizer High Layer Count PCB Product Portfolio
7.9.3 Schweizer High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Schweizer Main Business and Markets Served
7.9.5 Schweizer Recent Developments/Updates
7.10 Bomin Electronics
7.10.1 Bomin Electronics High Layer Count PCB Corporation Information
7.10.2 Bomin Electronics High Layer Count PCB Product Portfolio
7.10.3 Bomin Electronics High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Bomin Electronics Main Business and Markets Served
7.10.5 Bomin Electronics Recent Developments/Updates
7.11 Ibiden
7.11.1 Ibiden High Layer Count PCB Corporation Information
7.11.2 Ibiden High Layer Count PCB Product Portfolio
7.11.3 Ibiden High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Ibiden Main Business and Markets Served
7.11.5 Ibiden Recent Developments/Updates
7.12 ZDT
7.12.1 ZDT High Layer Count PCB Corporation Information
7.12.2 ZDT High Layer Count PCB Product Portfolio
7.12.3 ZDT High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.12.4 ZDT Main Business and Markets Served
7.12.5 ZDT Recent Developments/Updates
7.13 Compeq
7.13.1 Compeq High Layer Count PCB Corporation Information
7.13.2 Compeq High Layer Count PCB Product Portfolio
7.13.3 Compeq High Layer Count PCB Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Compeq Main Business and Markets Served
7.13.5 Compeq Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 High Layer Count PCB Industry Chain Analysis
8.2 High Layer Count PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 High Layer Count PCB Production Mode & Process
8.4 High Layer Count PCB Sales and Marketing
8.4.1 High Layer Count PCB Sales Channels
8.4.2 High Layer Count PCB Distributors
8.5 High Layer Count PCB Customers
9 High Layer Count PCB Market Dynamics
9.1 High Layer Count PCB Industry Trends
9.2 High Layer Count PCB Market Drivers
9.3 High Layer Count PCB Market Challenges
9.4 High Layer Count PCB Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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