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Global IC Advanced Packaging Market Research Report 2024
Synopsis
Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.
The global IC Advanced Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for IC Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Advanced Packaging.
Report Scope
The IC Advanced Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Advanced Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Abel
Samsung
Toshiba
Intel
Amkor
MAK
Optocap
ASE
Changing Electronics Technology
STMicroelectronics
EKSS Microelectronics
Segment by Type
3D
2.5D
Segment by Application
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Advanced Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.
The global IC Advanced Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for IC Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Advanced Packaging.
Report Scope
The IC Advanced Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Advanced Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Abel
Samsung
Toshiba
Intel
Amkor
MAK
Optocap
ASE
Changing Electronics Technology
STMicroelectronics
EKSS Microelectronics
Segment by Type
3D
2.5D
Segment by Application
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of IC Advanced Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global IC Advanced Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 3D
1.2.3 2.5D
1.3 Market by Application
1.3.1 Global IC Advanced Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Logic
1.3.3 Imaging and Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global IC Advanced Packaging Market Perspective (2019-2030)
2.2 IC Advanced Packaging Growth Trends by Region
2.2.1 Global IC Advanced Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 IC Advanced Packaging Historic Market Size by Region (2019-2024)
2.2.3 IC Advanced Packaging Forecasted Market Size by Region (2025-2030)
2.3 IC Advanced Packaging Market Dynamics
2.3.1 IC Advanced Packaging Industry Trends
2.3.2 IC Advanced Packaging Market Drivers
2.3.3 IC Advanced Packaging Market Challenges
2.3.4 IC Advanced Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top IC Advanced Packaging Players by Revenue
3.1.1 Global Top IC Advanced Packaging Players by Revenue (2019-2024)
3.1.2 Global IC Advanced Packaging Revenue Market Share by Players (2019-2024)
3.2 Global IC Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by IC Advanced Packaging Revenue
3.4 Global IC Advanced Packaging Market Concentration Ratio
3.4.1 Global IC Advanced Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by IC Advanced Packaging Revenue in 2023
3.5 IC Advanced Packaging Key Players Head office and Area Served
3.6 Key Players IC Advanced Packaging Product Solution and Service
3.7 Date of Enter into IC Advanced Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 IC Advanced Packaging Breakdown Data by Type
4.1 Global IC Advanced Packaging Historic Market Size by Type (2019-2024)
4.2 Global IC Advanced Packaging Forecasted Market Size by Type (2025-2030)
5 IC Advanced Packaging Breakdown Data by Application
5.1 Global IC Advanced Packaging Historic Market Size by Application (2019-2024)
5.2 Global IC Advanced Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America IC Advanced Packaging Market Size (2019-2030)
6.2 North America IC Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America IC Advanced Packaging Market Size by Country (2019-2024)
6.4 North America IC Advanced Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe IC Advanced Packaging Market Size (2019-2030)
7.2 Europe IC Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe IC Advanced Packaging Market Size by Country (2019-2024)
7.4 Europe IC Advanced Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific IC Advanced Packaging Market Size (2019-2030)
8.2 Asia-Pacific IC Advanced Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific IC Advanced Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific IC Advanced Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America IC Advanced Packaging Market Size (2019-2030)
9.2 Latin America IC Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America IC Advanced Packaging Market Size by Country (2019-2024)
9.4 Latin America IC Advanced Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa IC Advanced Packaging Market Size (2019-2030)
10.2 Middle East & Africa IC Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa IC Advanced Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa IC Advanced Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Abel
11.1.1 Abel Company Detail
11.1.2 Abel Business Overview
11.1.3 Abel IC Advanced Packaging Introduction
11.1.4 Abel Revenue in IC Advanced Packaging Business (2019-2024)
11.1.5 Abel Recent Development
11.2 Samsung
11.2.1 Samsung Company Detail
11.2.2 Samsung Business Overview
11.2.3 Samsung IC Advanced Packaging Introduction
11.2.4 Samsung Revenue in IC Advanced Packaging Business (2019-2024)
11.2.5 Samsung Recent Development
11.3 Toshiba
11.3.1 Toshiba Company Detail
11.3.2 Toshiba Business Overview
11.3.3 Toshiba IC Advanced Packaging Introduction
11.3.4 Toshiba Revenue in IC Advanced Packaging Business (2019-2024)
11.3.5 Toshiba Recent Development
11.4 Intel
11.4.1 Intel Company Detail
11.4.2 Intel Business Overview
11.4.3 Intel IC Advanced Packaging Introduction
11.4.4 Intel Revenue in IC Advanced Packaging Business (2019-2024)
11.4.5 Intel Recent Development
11.5 Amkor
11.5.1 Amkor Company Detail
11.5.2 Amkor Business Overview
11.5.3 Amkor IC Advanced Packaging Introduction
11.5.4 Amkor Revenue in IC Advanced Packaging Business (2019-2024)
11.5.5 Amkor Recent Development
11.6 MAK
11.6.1 MAK Company Detail
11.6.2 MAK Business Overview
11.6.3 MAK IC Advanced Packaging Introduction
11.6.4 MAK Revenue in IC Advanced Packaging Business (2019-2024)
11.6.5 MAK Recent Development
11.7 Optocap
11.7.1 Optocap Company Detail
11.7.2 Optocap Business Overview
11.7.3 Optocap IC Advanced Packaging Introduction
11.7.4 Optocap Revenue in IC Advanced Packaging Business (2019-2024)
11.7.5 Optocap Recent Development
11.8 ASE
11.8.1 ASE Company Detail
11.8.2 ASE Business Overview
11.8.3 ASE IC Advanced Packaging Introduction
11.8.4 ASE Revenue in IC Advanced Packaging Business (2019-2024)
11.8.5 ASE Recent Development
11.9 Changing Electronics Technology
11.9.1 Changing Electronics Technology Company Detail
11.9.2 Changing Electronics Technology Business Overview
11.9.3 Changing Electronics Technology IC Advanced Packaging Introduction
11.9.4 Changing Electronics Technology Revenue in IC Advanced Packaging Business (2019-2024)
11.9.5 Changing Electronics Technology Recent Development
11.10 STMicroelectronics
11.10.1 STMicroelectronics Company Detail
11.10.2 STMicroelectronics Business Overview
11.10.3 STMicroelectronics IC Advanced Packaging Introduction
11.10.4 STMicroelectronics Revenue in IC Advanced Packaging Business (2019-2024)
11.10.5 STMicroelectronics Recent Development
11.11 EKSS Microelectronics
11.11.1 EKSS Microelectronics Company Detail
11.11.2 EKSS Microelectronics Business Overview
11.11.3 EKSS Microelectronics IC Advanced Packaging Introduction
11.11.4 EKSS Microelectronics Revenue in IC Advanced Packaging Business (2019-2024)
11.11.5 EKSS Microelectronics Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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