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Global IC Packaging Market Research Report 2024
Synopsis
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
The global IC Packaging market was valued at US$ 37960 million in 2023 and is anticipated to reach US$ 49440 million by 2030, witnessing a CAGR of 3.8% during the forecast period 2024-2030.
Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.
China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.
This report aims to provide a comprehensive presentation of the global market for IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging.
Report Scope
The IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Unisem
NantongFujitsu Microelectronics
Hana Micron
Signetics
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
Segment by Application
CIS
MEMS
Others
Production by Region
North America
Europe
China
China Taiwan
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
The global IC Packaging market was valued at US$ 37960 million in 2023 and is anticipated to reach US$ 49440 million by 2030, witnessing a CAGR of 3.8% during the forecast period 2024-2030.
Global IC Packaging key players include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, etc. Global top five manufacturers hold a share over 45%.
China Taiwan is the largest market, with a share over 40%, followed by China and South Korea, both have a share over 45%.
This report aims to provide a comprehensive presentation of the global market for IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging.
Report Scope
The IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Unisem
NantongFujitsu Microelectronics
Hana Micron
Signetics
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
Segment by Application
CIS
MEMS
Others
Production by Region
North America
Europe
China
China Taiwan
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 IC Packaging Market Overview
1.1 Product Definition
1.2 IC Packaging Segment by Type
1.2.1 Global IC Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 DIP
1.2.3 SOP
1.2.4 QFP
1.2.5 QFN
1.2.6 BGA
1.2.7 CSP
1.2.8 LGA
1.2.9 WLP
1.2.10 FC
1.2.11 Others
1.3 IC Packaging Segment by Application
1.3.1 Global IC Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 CIS
1.3.3 MEMS
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global IC Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global IC Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global IC Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global IC Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of IC Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging, Date of Enter into This Industry
2.9 IC Packaging Market Competitive Situation and Trends
2.9.1 IC Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Production by Region
3.1 Global IC Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global IC Packaging Production Value by Region (2019-2030)
3.2.1 Global IC Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of IC Packaging by Region (2025-2030)
3.3 Global IC Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global IC Packaging Production by Region (2019-2030)
3.4.1 Global IC Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of IC Packaging by Region (2025-2030)
3.5 Global IC Packaging Market Price Analysis by Region (2019-2024)
3.6 Global IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 China Taiwan IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 Japan IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.6 South Korea IC Packaging Production Value Estimates and Forecasts (2019-2030)
4 IC Packaging Consumption by Region
4.1 Global IC Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global IC Packaging Consumption by Region (2019-2030)
4.2.1 Global IC Packaging Consumption by Region (2019-2024)
4.2.2 Global IC Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America IC Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe IC Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific IC Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa IC Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Packaging Production by Type (2019-2030)
5.1.1 Global IC Packaging Production by Type (2019-2024)
5.1.2 Global IC Packaging Production by Type (2025-2030)
5.1.3 Global IC Packaging Production Market Share by Type (2019-2030)
5.2 Global IC Packaging Production Value by Type (2019-2030)
5.2.1 Global IC Packaging Production Value by Type (2019-2024)
5.2.2 Global IC Packaging Production Value by Type (2025-2030)
5.2.3 Global IC Packaging Production Value Market Share by Type (2019-2030)
5.3 Global IC Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global IC Packaging Production by Application (2019-2030)
6.1.1 Global IC Packaging Production by Application (2019-2024)
6.1.2 Global IC Packaging Production by Application (2025-2030)
6.1.3 Global IC Packaging Production Market Share by Application (2019-2030)
6.2 Global IC Packaging Production Value by Application (2019-2030)
6.2.1 Global IC Packaging Production Value by Application (2019-2024)
6.2.2 Global IC Packaging Production Value by Application (2025-2030)
6.2.3 Global IC Packaging Production Value Market Share by Application (2019-2030)
6.3 Global IC Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 ASE
7.1.1 ASE IC Packaging Corporation Information
7.1.2 ASE IC Packaging Product Portfolio
7.1.3 ASE IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 ASE Main Business and Markets Served
7.1.5 ASE Recent Developments/Updates
7.2 Amkor
7.2.1 Amkor IC Packaging Corporation Information
7.2.2 Amkor IC Packaging Product Portfolio
7.2.3 Amkor IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Amkor Main Business and Markets Served
7.2.5 Amkor Recent Developments/Updates
7.3 SPIL
7.3.1 SPIL IC Packaging Corporation Information
7.3.2 SPIL IC Packaging Product Portfolio
7.3.3 SPIL IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 SPIL Main Business and Markets Served
7.3.5 SPIL Recent Developments/Updates
7.4 STATS ChipPac
7.4.1 STATS ChipPac IC Packaging Corporation Information
7.4.2 STATS ChipPac IC Packaging Product Portfolio
7.4.3 STATS ChipPac IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 STATS ChipPac Main Business and Markets Served
7.4.5 STATS ChipPac Recent Developments/Updates
7.5 Powertech Technology
7.5.1 Powertech Technology IC Packaging Corporation Information
7.5.2 Powertech Technology IC Packaging Product Portfolio
7.5.3 Powertech Technology IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Powertech Technology Main Business and Markets Served
7.5.5 Powertech Technology Recent Developments/Updates
7.6 J-devices
7.6.1 J-devices IC Packaging Corporation Information
7.6.2 J-devices IC Packaging Product Portfolio
7.6.3 J-devices IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 J-devices Main Business and Markets Served
7.6.5 J-devices Recent Developments/Updates
7.7 UTAC
7.7.1 UTAC IC Packaging Corporation Information
7.7.2 UTAC IC Packaging Product Portfolio
7.7.3 UTAC IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 UTAC Main Business and Markets Served
7.7.5 UTAC Recent Developments/Updates
7.8 JECT
7.8.1 JECT IC Packaging Corporation Information
7.8.2 JECT IC Packaging Product Portfolio
7.8.3 JECT IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 JECT Main Business and Markets Served
7.7.5 JECT Recent Developments/Updates
7.9 ChipMOS
7.9.1 ChipMOS IC Packaging Corporation Information
7.9.2 ChipMOS IC Packaging Product Portfolio
7.9.3 ChipMOS IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 ChipMOS Main Business and Markets Served
7.9.5 ChipMOS Recent Developments/Updates
7.10 Chipbond
7.10.1 Chipbond IC Packaging Corporation Information
7.10.2 Chipbond IC Packaging Product Portfolio
7.10.3 Chipbond IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Chipbond Main Business and Markets Served
7.10.5 Chipbond Recent Developments/Updates
7.11 KYEC
7.11.1 KYEC IC Packaging Corporation Information
7.11.2 KYEC IC Packaging Product Portfolio
7.11.3 KYEC IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.11.4 KYEC Main Business and Markets Served
7.11.5 KYEC Recent Developments/Updates
7.12 STS Semiconductor
7.12.1 STS Semiconductor IC Packaging Corporation Information
7.12.2 STS Semiconductor IC Packaging Product Portfolio
7.12.3 STS Semiconductor IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.12.4 STS Semiconductor Main Business and Markets Served
7.12.5 STS Semiconductor Recent Developments/Updates
7.13 Huatian
7.13.1 Huatian IC Packaging Corporation Information
7.13.2 Huatian IC Packaging Product Portfolio
7.13.3 Huatian IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Huatian Main Business and Markets Served
7.13.5 Huatian Recent Developments/Updates
7.14 MPl(Carsem)
7.14.1 MPl(Carsem) IC Packaging Corporation Information
7.14.2 MPl(Carsem) IC Packaging Product Portfolio
7.14.3 MPl(Carsem) IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.14.4 MPl(Carsem) Main Business and Markets Served
7.14.5 MPl(Carsem) Recent Developments/Updates
7.15 Nepes
7.15.1 Nepes IC Packaging Corporation Information
7.15.2 Nepes IC Packaging Product Portfolio
7.15.3 Nepes IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Nepes Main Business and Markets Served
7.15.5 Nepes Recent Developments/Updates
7.16 FATC
7.16.1 FATC IC Packaging Corporation Information
7.16.2 FATC IC Packaging Product Portfolio
7.16.3 FATC IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.16.4 FATC Main Business and Markets Served
7.16.5 FATC Recent Developments/Updates
7.17 Walton
7.17.1 Walton IC Packaging Corporation Information
7.17.2 Walton IC Packaging Product Portfolio
7.17.3 Walton IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.17.4 Walton Main Business and Markets Served
7.17.5 Walton Recent Developments/Updates
7.18 Unisem
7.18.1 Unisem IC Packaging Corporation Information
7.18.2 Unisem IC Packaging Product Portfolio
7.18.3 Unisem IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Unisem Main Business and Markets Served
7.18.5 Unisem Recent Developments/Updates
7.19 NantongFujitsu Microelectronics
7.19.1 NantongFujitsu Microelectronics IC Packaging Corporation Information
7.19.2 NantongFujitsu Microelectronics IC Packaging Product Portfolio
7.19.3 NantongFujitsu Microelectronics IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.19.4 NantongFujitsu Microelectronics Main Business and Markets Served
7.19.5 NantongFujitsu Microelectronics Recent Developments/Updates
7.20 Hana Micron
7.20.1 Hana Micron IC Packaging Corporation Information
7.20.2 Hana Micron IC Packaging Product Portfolio
7.20.3 Hana Micron IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Hana Micron Main Business and Markets Served
7.20.5 Hana Micron Recent Developments/Updates
7.21 Signetics
7.21.1 Signetics IC Packaging Corporation Information
7.21.2 Signetics IC Packaging Product Portfolio
7.21.3 Signetics IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.21.4 Signetics Main Business and Markets Served
7.21.5 Signetics Recent Developments/Updates
7.22 LINGSEN
7.22.1 LINGSEN IC Packaging Corporation Information
7.22.2 LINGSEN IC Packaging Product Portfolio
7.22.3 LINGSEN IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.22.4 LINGSEN Main Business and Markets Served
7.22.5 LINGSEN Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Industry Chain Analysis
8.2 IC Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Production Mode & Process
8.4 IC Packaging Sales and Marketing
8.4.1 IC Packaging Sales Channels
8.4.2 IC Packaging Distributors
8.5 IC Packaging Customers
9 IC Packaging Market Dynamics
9.1 IC Packaging Industry Trends
9.2 IC Packaging Market Drivers
9.3 IC Packaging Market Challenges
9.4 IC Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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