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Global Integrated Circuit Packaging Market Research Report 2024
Synopsis
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits.
The global Integrated Circuit Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Integrated Circuit Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuit Packaging.
Report Scope
The Integrated Circuit Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Integrated Circuit Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Integrated Circuit Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
STATS ChipPAC
Linxens
Toppan Photomasks
AMKOR
ASE
Cadence Design Systems
Atotech Deutschland GmbH
SHINKO
Segment by Type
Metal
Ceramics
Glass
Segment by Application
Analog Circuits
Digital Circuits
RF Circuits
Sensors
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Integrated Circuit Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Integrated Circuit Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Integrated Circuit Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits.
The global Integrated Circuit Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Integrated Circuit Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuit Packaging.
Report Scope
The Integrated Circuit Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Integrated Circuit Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Integrated Circuit Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
STATS ChipPAC
Linxens
Toppan Photomasks
AMKOR
ASE
Cadence Design Systems
Atotech Deutschland GmbH
SHINKO
Segment by Type
Metal
Ceramics
Glass
Segment by Application
Analog Circuits
Digital Circuits
RF Circuits
Sensors
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Integrated Circuit Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Integrated Circuit Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Integrated Circuit Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Integrated Circuit Packaging Market Overview
1.1 Product Definition
1.2 Integrated Circuit Packaging Segment by Type
1.2.1 Global Integrated Circuit Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Metal
1.2.3 Ceramics
1.2.4 Glass
1.3 Integrated Circuit Packaging Segment by Application
1.3.1 Global Integrated Circuit Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Analog Circuits
1.3.3 Digital Circuits
1.3.4 RF Circuits
1.3.5 Sensors
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Integrated Circuit Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Integrated Circuit Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Integrated Circuit Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Integrated Circuit Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Integrated Circuit Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Integrated Circuit Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Integrated Circuit Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Integrated Circuit Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Integrated Circuit Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Integrated Circuit Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Integrated Circuit Packaging, Date of Enter into This Industry
2.9 Integrated Circuit Packaging Market Competitive Situation and Trends
2.9.1 Integrated Circuit Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Integrated Circuit Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Integrated Circuit Packaging Production by Region
3.1 Global Integrated Circuit Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Integrated Circuit Packaging Production Value by Region (2019-2030)
3.2.1 Global Integrated Circuit Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Integrated Circuit Packaging by Region (2025-2030)
3.3 Global Integrated Circuit Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Integrated Circuit Packaging Production by Region (2019-2030)
3.4.1 Global Integrated Circuit Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Integrated Circuit Packaging by Region (2025-2030)
3.5 Global Integrated Circuit Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Integrated Circuit Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Integrated Circuit Packaging Production Value Estimates and Forecasts (2019-2030)
4 Integrated Circuit Packaging Consumption by Region
4.1 Global Integrated Circuit Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Integrated Circuit Packaging Consumption by Region (2019-2030)
4.2.1 Global Integrated Circuit Packaging Consumption by Region (2019-2024)
4.2.2 Global Integrated Circuit Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Integrated Circuit Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Integrated Circuit Packaging Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Integrated Circuit Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Integrated Circuit Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 UK
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Integrated Circuit Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Integrated Circuit Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Integrated Circuit Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Integrated Circuit Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Integrated Circuit Packaging Production by Type (2019-2030)
5.1.1 Global Integrated Circuit Packaging Production by Type (2019-2024)
5.1.2 Global Integrated Circuit Packaging Production by Type (2025-2030)
5.1.3 Global Integrated Circuit Packaging Production Market Share by Type (2019-2030)
5.2 Global Integrated Circuit Packaging Production Value by Type (2019-2030)
5.2.1 Global Integrated Circuit Packaging Production Value by Type (2019-2024)
5.2.2 Global Integrated Circuit Packaging Production Value by Type (2025-2030)
5.2.3 Global Integrated Circuit Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Integrated Circuit Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Integrated Circuit Packaging Production by Application (2019-2030)
6.1.1 Global Integrated Circuit Packaging Production by Application (2019-2024)
6.1.2 Global Integrated Circuit Packaging Production by Application (2025-2030)
6.1.3 Global Integrated Circuit Packaging Production Market Share by Application (2019-2030)
6.2 Global Integrated Circuit Packaging Production Value by Application (2019-2030)
6.2.1 Global Integrated Circuit Packaging Production Value by Application (2019-2024)
6.2.2 Global Integrated Circuit Packaging Production Value by Application (2025-2030)
6.2.3 Global Integrated Circuit Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Integrated Circuit Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden Integrated Circuit Packaging Corporation Information
7.1.2 Ibiden Integrated Circuit Packaging Product Portfolio
7.1.3 Ibiden Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 STATS ChipPAC
7.2.1 STATS ChipPAC Integrated Circuit Packaging Corporation Information
7.2.2 STATS ChipPAC Integrated Circuit Packaging Product Portfolio
7.2.3 STATS ChipPAC Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 STATS ChipPAC Main Business and Markets Served
7.2.5 STATS ChipPAC Recent Developments/Updates
7.3 Linxens
7.3.1 Linxens Integrated Circuit Packaging Corporation Information
7.3.2 Linxens Integrated Circuit Packaging Product Portfolio
7.3.3 Linxens Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Linxens Main Business and Markets Served
7.3.5 Linxens Recent Developments/Updates
7.4 Toppan Photomasks
7.4.1 Toppan Photomasks Integrated Circuit Packaging Corporation Information
7.4.2 Toppan Photomasks Integrated Circuit Packaging Product Portfolio
7.4.3 Toppan Photomasks Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Toppan Photomasks Main Business and Markets Served
7.4.5 Toppan Photomasks Recent Developments/Updates
7.5 AMKOR
7.5.1 AMKOR Integrated Circuit Packaging Corporation Information
7.5.2 AMKOR Integrated Circuit Packaging Product Portfolio
7.5.3 AMKOR Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 AMKOR Main Business and Markets Served
7.5.5 AMKOR Recent Developments/Updates
7.6 ASE
7.6.1 ASE Integrated Circuit Packaging Corporation Information
7.6.2 ASE Integrated Circuit Packaging Product Portfolio
7.6.3 ASE Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 ASE Main Business and Markets Served
7.6.5 ASE Recent Developments/Updates
7.7 Cadence Design Systems
7.7.1 Cadence Design Systems Integrated Circuit Packaging Corporation Information
7.7.2 Cadence Design Systems Integrated Circuit Packaging Product Portfolio
7.7.3 Cadence Design Systems Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Cadence Design Systems Main Business and Markets Served
7.7.5 Cadence Design Systems Recent Developments/Updates
7.8 Atotech Deutschland GmbH
7.8.1 Atotech Deutschland GmbH Integrated Circuit Packaging Corporation Information
7.8.2 Atotech Deutschland GmbH Integrated Circuit Packaging Product Portfolio
7.8.3 Atotech Deutschland GmbH Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Atotech Deutschland GmbH Main Business and Markets Served
7.7.5 Atotech Deutschland GmbH Recent Developments/Updates
7.9 SHINKO
7.9.1 SHINKO Integrated Circuit Packaging Corporation Information
7.9.2 SHINKO Integrated Circuit Packaging Product Portfolio
7.9.3 SHINKO Integrated Circuit Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 SHINKO Main Business and Markets Served
7.9.5 SHINKO Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Integrated Circuit Packaging Industry Chain Analysis
8.2 Integrated Circuit Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Integrated Circuit Packaging Production Mode & Process
8.4 Integrated Circuit Packaging Sales and Marketing
8.4.1 Integrated Circuit Packaging Sales Channels
8.4.2 Integrated Circuit Packaging Distributors
8.5 Integrated Circuit Packaging Customers
9 Integrated Circuit Packaging Market Dynamics
9.1 Integrated Circuit Packaging Industry Trends
9.2 Integrated Circuit Packaging Market Drivers
9.3 Integrated Circuit Packaging Market Challenges
9.4 Integrated Circuit Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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