The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global Microelectronics Packaging Materials Market Research Report 2024
Synopsis
Microelectronics packaging materials play a crucial role in protecting and enhancing the performance of microelectronic devices.
Global Microelectronics Packaging Materials market is projected to reach US$ 10960 million in 2029, increasing from US$ 6450 million in 2022, with the CAGR of 7.6% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Microelectronics Packaging Materials market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Microelectronics Packaging Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Materion
AMETEK
Shin-Etsu Chemical
Kyocera
Hermetic Solutions Group
DuPont
Henkel
Sumitomo Bakelite
Proterial
TANAKA Precious Metals
Hebei Sinopack Electronic
Ningbo Kangqiang Electronics
Changsha Saneway Electronic Materials
Tianjin Kaihua Insulation Material
Zhejiang Gpilot Technology
Segment by Type
Plastic
Ceramics
Metal
Other
Segment by Application
Semiconductor Packaging
MEMS Packaging
Optoelectronic Packaging
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Microelectronics Packaging Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Microelectronics packaging materials play a crucial role in protecting and enhancing the performance of microelectronic devices.
Global Microelectronics Packaging Materials market is projected to reach US$ 10960 million in 2029, increasing from US$ 6450 million in 2022, with the CAGR of 7.6% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Microelectronics Packaging Materials market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Microelectronics Packaging Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Materion
AMETEK
Shin-Etsu Chemical
Kyocera
Hermetic Solutions Group
DuPont
Henkel
Sumitomo Bakelite
Proterial
TANAKA Precious Metals
Hebei Sinopack Electronic
Ningbo Kangqiang Electronics
Changsha Saneway Electronic Materials
Tianjin Kaihua Insulation Material
Zhejiang Gpilot Technology
Segment by Type
Plastic
Ceramics
Metal
Other
Segment by Application
Semiconductor Packaging
MEMS Packaging
Optoelectronic Packaging
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Microelectronics Packaging Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Microelectronics Packaging Materials Market Overview
1.1 Product Definition
1.2 Microelectronics Packaging Materials Segment by Type
1.2.1 Global Microelectronics Packaging Materials Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Plastic
1.2.3 Ceramics
1.2.4 Metal
1.2.5 Other
1.3 Microelectronics Packaging Materials Segment by Application
1.3.1 Global Microelectronics Packaging Materials Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Packaging
1.3.3 MEMS Packaging
1.3.4 Optoelectronic Packaging
1.3.5 Other
1.4 Global Market Growth Prospects
1.4.1 Global Microelectronics Packaging Materials Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Microelectronics Packaging Materials Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Microelectronics Packaging Materials Production Estimates and Forecasts (2018-2029)
1.4.4 Global Microelectronics Packaging Materials Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Microelectronics Packaging Materials Production Market Share by Manufacturers (2018-2023)
2.2 Global Microelectronics Packaging Materials Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Microelectronics Packaging Materials, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Microelectronics Packaging Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Microelectronics Packaging Materials Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Microelectronics Packaging Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Microelectronics Packaging Materials, Product Offered and Application
2.8 Global Key Manufacturers of Microelectronics Packaging Materials, Date of Enter into This Industry
2.9 Microelectronics Packaging Materials Market Competitive Situation and Trends
2.9.1 Microelectronics Packaging Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Microelectronics Packaging Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Microelectronics Packaging Materials Production by Region
3.1 Global Microelectronics Packaging Materials Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Microelectronics Packaging Materials Production Value by Region (2018-2029)
3.2.1 Global Microelectronics Packaging Materials Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Microelectronics Packaging Materials by Region (2024-2029)
3.3 Global Microelectronics Packaging Materials Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Microelectronics Packaging Materials Production by Region (2018-2029)
3.4.1 Global Microelectronics Packaging Materials Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Microelectronics Packaging Materials by Region (2024-2029)
3.5 Global Microelectronics Packaging Materials Market Price Analysis by Region (2018-2023)
3.6 Global Microelectronics Packaging Materials Production and Value, Year-over-Year Growth
3.6.1 North America Microelectronics Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Microelectronics Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Microelectronics Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Microelectronics Packaging Materials Production Value Estimates and Forecasts (2018-2029)
4 Microelectronics Packaging Materials Consumption by Region
4.1 Global Microelectronics Packaging Materials Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Microelectronics Packaging Materials Consumption by Region (2018-2029)
4.2.1 Global Microelectronics Packaging Materials Consumption by Region (2018-2023)
4.2.2 Global Microelectronics Packaging Materials Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Microelectronics Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Microelectronics Packaging Materials Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Microelectronics Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Microelectronics Packaging Materials Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Microelectronics Packaging Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Microelectronics Packaging Materials Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Microelectronics Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Microelectronics Packaging Materials Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Microelectronics Packaging Materials Production by Type (2018-2029)
5.1.1 Global Microelectronics Packaging Materials Production by Type (2018-2023)
5.1.2 Global Microelectronics Packaging Materials Production by Type (2024-2029)
5.1.3 Global Microelectronics Packaging Materials Production Market Share by Type (2018-2029)
5.2 Global Microelectronics Packaging Materials Production Value by Type (2018-2029)
5.2.1 Global Microelectronics Packaging Materials Production Value by Type (2018-2023)
5.2.2 Global Microelectronics Packaging Materials Production Value by Type (2024-2029)
5.2.3 Global Microelectronics Packaging Materials Production Value Market Share by Type (2018-2029)
5.3 Global Microelectronics Packaging Materials Price by Type (2018-2029)
6 Segment by Application
6.1 Global Microelectronics Packaging Materials Production by Application (2018-2029)
6.1.1 Global Microelectronics Packaging Materials Production by Application (2018-2023)
6.1.2 Global Microelectronics Packaging Materials Production by Application (2024-2029)
6.1.3 Global Microelectronics Packaging Materials Production Market Share by Application (2018-2029)
6.2 Global Microelectronics Packaging Materials Production Value by Application (2018-2029)
6.2.1 Global Microelectronics Packaging Materials Production Value by Application (2018-2023)
6.2.2 Global Microelectronics Packaging Materials Production Value by Application (2024-2029)
6.2.3 Global Microelectronics Packaging Materials Production Value Market Share by Application (2018-2029)
6.3 Global Microelectronics Packaging Materials Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Materion
7.1.1 Materion Microelectronics Packaging Materials Corporation Information
7.1.2 Materion Microelectronics Packaging Materials Product Portfolio
7.1.3 Materion Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Materion Main Business and Markets Served
7.1.5 Materion Recent Developments/Updates
7.2 AMETEK
7.2.1 AMETEK Microelectronics Packaging Materials Corporation Information
7.2.2 AMETEK Microelectronics Packaging Materials Product Portfolio
7.2.3 AMETEK Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.2.4 AMETEK Main Business and Markets Served
7.2.5 AMETEK Recent Developments/Updates
7.3 Shin-Etsu Chemical
7.3.1 Shin-Etsu Chemical Microelectronics Packaging Materials Corporation Information
7.3.2 Shin-Etsu Chemical Microelectronics Packaging Materials Product Portfolio
7.3.3 Shin-Etsu Chemical Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Shin-Etsu Chemical Main Business and Markets Served
7.3.5 Shin-Etsu Chemical Recent Developments/Updates
7.4 Kyocera
7.4.1 Kyocera Microelectronics Packaging Materials Corporation Information
7.4.2 Kyocera Microelectronics Packaging Materials Product Portfolio
7.4.3 Kyocera Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Kyocera Main Business and Markets Served
7.4.5 Kyocera Recent Developments/Updates
7.5 Hermetic Solutions Group
7.5.1 Hermetic Solutions Group Microelectronics Packaging Materials Corporation Information
7.5.2 Hermetic Solutions Group Microelectronics Packaging Materials Product Portfolio
7.5.3 Hermetic Solutions Group Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Hermetic Solutions Group Main Business and Markets Served
7.5.5 Hermetic Solutions Group Recent Developments/Updates
7.6 DuPont
7.6.1 DuPont Microelectronics Packaging Materials Corporation Information
7.6.2 DuPont Microelectronics Packaging Materials Product Portfolio
7.6.3 DuPont Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.6.4 DuPont Main Business and Markets Served
7.6.5 DuPont Recent Developments/Updates
7.7 Henkel
7.7.1 Henkel Microelectronics Packaging Materials Corporation Information
7.7.2 Henkel Microelectronics Packaging Materials Product Portfolio
7.7.3 Henkel Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Henkel Main Business and Markets Served
7.7.5 Henkel Recent Developments/Updates
7.8 Sumitomo Bakelite
7.8.1 Sumitomo Bakelite Microelectronics Packaging Materials Corporation Information
7.8.2 Sumitomo Bakelite Microelectronics Packaging Materials Product Portfolio
7.8.3 Sumitomo Bakelite Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Sumitomo Bakelite Main Business and Markets Served
7.7.5 Sumitomo Bakelite Recent Developments/Updates
7.9 Proterial
7.9.1 Proterial Microelectronics Packaging Materials Corporation Information
7.9.2 Proterial Microelectronics Packaging Materials Product Portfolio
7.9.3 Proterial Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Proterial Main Business and Markets Served
7.9.5 Proterial Recent Developments/Updates
7.10 TANAKA Precious Metals
7.10.1 TANAKA Precious Metals Microelectronics Packaging Materials Corporation Information
7.10.2 TANAKA Precious Metals Microelectronics Packaging Materials Product Portfolio
7.10.3 TANAKA Precious Metals Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.10.4 TANAKA Precious Metals Main Business and Markets Served
7.10.5 TANAKA Precious Metals Recent Developments/Updates
7.11 Hebei Sinopack Electronic
7.11.1 Hebei Sinopack Electronic Microelectronics Packaging Materials Corporation Information
7.11.2 Hebei Sinopack Electronic Microelectronics Packaging Materials Product Portfolio
7.11.3 Hebei Sinopack Electronic Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Hebei Sinopack Electronic Main Business and Markets Served
7.11.5 Hebei Sinopack Electronic Recent Developments/Updates
7.12 Ningbo Kangqiang Electronics
7.12.1 Ningbo Kangqiang Electronics Microelectronics Packaging Materials Corporation Information
7.12.2 Ningbo Kangqiang Electronics Microelectronics Packaging Materials Product Portfolio
7.12.3 Ningbo Kangqiang Electronics Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Ningbo Kangqiang Electronics Main Business and Markets Served
7.12.5 Ningbo Kangqiang Electronics Recent Developments/Updates
7.13 Changsha Saneway Electronic Materials
7.13.1 Changsha Saneway Electronic Materials Microelectronics Packaging Materials Corporation Information
7.13.2 Changsha Saneway Electronic Materials Microelectronics Packaging Materials Product Portfolio
7.13.3 Changsha Saneway Electronic Materials Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Changsha Saneway Electronic Materials Main Business and Markets Served
7.13.5 Changsha Saneway Electronic Materials Recent Developments/Updates
7.14 Tianjin Kaihua Insulation Material
7.14.1 Tianjin Kaihua Insulation Material Microelectronics Packaging Materials Corporation Information
7.14.2 Tianjin Kaihua Insulation Material Microelectronics Packaging Materials Product Portfolio
7.14.3 Tianjin Kaihua Insulation Material Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Tianjin Kaihua Insulation Material Main Business and Markets Served
7.14.5 Tianjin Kaihua Insulation Material Recent Developments/Updates
7.15 Zhejiang Gpilot Technology
7.15.1 Zhejiang Gpilot Technology Microelectronics Packaging Materials Corporation Information
7.15.2 Zhejiang Gpilot Technology Microelectronics Packaging Materials Product Portfolio
7.15.3 Zhejiang Gpilot Technology Microelectronics Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Zhejiang Gpilot Technology Main Business and Markets Served
7.15.5 Zhejiang Gpilot Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Microelectronics Packaging Materials Industry Chain Analysis
8.2 Microelectronics Packaging Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Microelectronics Packaging Materials Production Mode & Process
8.4 Microelectronics Packaging Materials Sales and Marketing
8.4.1 Microelectronics Packaging Materials Sales Channels
8.4.2 Microelectronics Packaging Materials Distributors
8.5 Microelectronics Packaging Materials Customers
9 Microelectronics Packaging Materials Market Dynamics
9.1 Microelectronics Packaging Materials Industry Trends
9.2 Microelectronics Packaging Materials Market Drivers
9.3 Microelectronics Packaging Materials Market Challenges
9.4 Microelectronics Packaging Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
