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Global Mobile Device Substrate-Like PCBs Market Research Report 2024
Synopsis
The global Mobile Device Substrate-Like PCBs market was valued at US$ 844 million in 2023 and is anticipated to reach US$ 1415.8 million by 2030, witnessing a CAGR of 8.6% during the forecast period 2024-2030.
North American market for Mobile Device Substrate-Like PCBs is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Mobile Device Substrate-Like PCBs is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Mobile Device Substrate-Like PCBs include AT&S, Samsung Electro-Mechanics, Korea Circuit, Daeduck, ISU Petasys, Tripod Technology Corporation, Ibiden, LG Innotek and Kinsus Interconnect Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Mobile Device Substrate-Like PCBs, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Mobile Device Substrate-Like PCBs.
Report Scope
The Mobile Device Substrate-Like PCBs market size, estimations, and forecasts are provided in terms of output/shipments (square meters) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Mobile Device Substrate-Like PCBs market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Mobile Device Substrate-Like PCBs manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
AT&S
Samsung Electro-Mechanics
Korea Circuit
Daeduck
ISU Petasys
Tripod Technology Corporation
Ibiden
LG Innotek
Kinsus Interconnect Technology
Zhen Ding Technology
TTM Technologies
Unimicron
Segment by Type
25/25µm and 30/30µm Line/Space
Less Than 25/25 µm Line/Space
Segment by Application
Smart Phone
Smart Watch
Production by Region
Japan
South Korea
China
China Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Mobile Device Substrate-Like PCBs manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Mobile Device Substrate-Like PCBs by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Mobile Device Substrate-Like PCBs in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Mobile Device Substrate-Like PCBs market was valued at US$ 844 million in 2023 and is anticipated to reach US$ 1415.8 million by 2030, witnessing a CAGR of 8.6% during the forecast period 2024-2030.
North American market for Mobile Device Substrate-Like PCBs is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Mobile Device Substrate-Like PCBs is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Mobile Device Substrate-Like PCBs include AT&S, Samsung Electro-Mechanics, Korea Circuit, Daeduck, ISU Petasys, Tripod Technology Corporation, Ibiden, LG Innotek and Kinsus Interconnect Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Mobile Device Substrate-Like PCBs, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Mobile Device Substrate-Like PCBs.
Report Scope
The Mobile Device Substrate-Like PCBs market size, estimations, and forecasts are provided in terms of output/shipments (square meters) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Mobile Device Substrate-Like PCBs market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Mobile Device Substrate-Like PCBs manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
AT&S
Samsung Electro-Mechanics
Korea Circuit
Daeduck
ISU Petasys
Tripod Technology Corporation
Ibiden
LG Innotek
Kinsus Interconnect Technology
Zhen Ding Technology
TTM Technologies
Unimicron
Segment by Type
25/25µm and 30/30µm Line/Space
Less Than 25/25 µm Line/Space
Segment by Application
Smart Phone
Smart Watch
Production by Region
Japan
South Korea
China
China Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Mobile Device Substrate-Like PCBs manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Mobile Device Substrate-Like PCBs by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Mobile Device Substrate-Like PCBs in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Mobile Device Substrate-Like PCBs Market Overview
1.1 Product Definition
1.2 Mobile Device Substrate-Like PCBs Segment by Type
1.2.1 Global Mobile Device Substrate-Like PCBs Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 25/25µm and 30/30µm Line/Space
1.2.3 Less Than 25/25 µm Line/Space
1.3 Mobile Device Substrate-Like PCBs Segment by Application
1.3.1 Global Mobile Device Substrate-Like PCBs Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smart Phone
1.3.3 Smart Watch
1.4 Global Market Growth Prospects
1.4.1 Global Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Mobile Device Substrate-Like PCBs Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Mobile Device Substrate-Like PCBs Production Estimates and Forecasts (2019-2030)
1.4.4 Global Mobile Device Substrate-Like PCBs Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Mobile Device Substrate-Like PCBs Production Market Share by Manufacturers (2019-2024)
2.2 Global Mobile Device Substrate-Like PCBs Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Mobile Device Substrate-Like PCBs, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Mobile Device Substrate-Like PCBs Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Mobile Device Substrate-Like PCBs Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Mobile Device Substrate-Like PCBs, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Mobile Device Substrate-Like PCBs, Product Offered and Application
2.8 Global Key Manufacturers of Mobile Device Substrate-Like PCBs, Date of Enter into This Industry
2.9 Mobile Device Substrate-Like PCBs Market Competitive Situation and Trends
2.9.1 Mobile Device Substrate-Like PCBs Market Concentration Rate
2.9.2 Global 5 and 10 Largest Mobile Device Substrate-Like PCBs Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Mobile Device Substrate-Like PCBs Production by Region
3.1 Global Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Mobile Device Substrate-Like PCBs Production Value by Region (2019-2030)
3.2.1 Global Mobile Device Substrate-Like PCBs Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Mobile Device Substrate-Like PCBs by Region (2025-2030)
3.3 Global Mobile Device Substrate-Like PCBs Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Mobile Device Substrate-Like PCBs Production by Region (2019-2030)
3.4.1 Global Mobile Device Substrate-Like PCBs Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Mobile Device Substrate-Like PCBs by Region (2025-2030)
3.5 Global Mobile Device Substrate-Like PCBs Market Price Analysis by Region (2019-2024)
3.6 Global Mobile Device Substrate-Like PCBs Production and Value, Year-over-Year Growth
3.6.1 Japan Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts (2019-2030)
3.6.2 South Korea Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts (2019-2030)
3.6.4 China Taiwan Mobile Device Substrate-Like PCBs Production Value Estimates and Forecasts (2019-2030)
4 Mobile Device Substrate-Like PCBs Consumption by Region
4.1 Global Mobile Device Substrate-Like PCBs Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Mobile Device Substrate-Like PCBs Consumption by Region (2019-2030)
4.2.1 Global Mobile Device Substrate-Like PCBs Consumption by Region (2019-2024)
4.2.2 Global Mobile Device Substrate-Like PCBs Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Mobile Device Substrate-Like PCBs Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Mobile Device Substrate-Like PCBs Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Mobile Device Substrate-Like PCBs Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Mobile Device Substrate-Like PCBs Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Mobile Device Substrate-Like PCBs Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Mobile Device Substrate-Like PCBs Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Mobile Device Substrate-Like PCBs Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Mobile Device Substrate-Like PCBs Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Mobile Device Substrate-Like PCBs Production by Type (2019-2030)
5.1.1 Global Mobile Device Substrate-Like PCBs Production by Type (2019-2024)
5.1.2 Global Mobile Device Substrate-Like PCBs Production by Type (2025-2030)
5.1.3 Global Mobile Device Substrate-Like PCBs Production Market Share by Type (2019-2030)
5.2 Global Mobile Device Substrate-Like PCBs Production Value by Type (2019-2030)
5.2.1 Global Mobile Device Substrate-Like PCBs Production Value by Type (2019-2024)
5.2.2 Global Mobile Device Substrate-Like PCBs Production Value by Type (2025-2030)
5.2.3 Global Mobile Device Substrate-Like PCBs Production Value Market Share by Type (2019-2030)
5.3 Global Mobile Device Substrate-Like PCBs Price by Type (2019-2030)
6 Segment by Application
6.1 Global Mobile Device Substrate-Like PCBs Production by Application (2019-2030)
6.1.1 Global Mobile Device Substrate-Like PCBs Production by Application (2019-2024)
6.1.2 Global Mobile Device Substrate-Like PCBs Production by Application (2025-2030)
6.1.3 Global Mobile Device Substrate-Like PCBs Production Market Share by Application (2019-2030)
6.2 Global Mobile Device Substrate-Like PCBs Production Value by Application (2019-2030)
6.2.1 Global Mobile Device Substrate-Like PCBs Production Value by Application (2019-2024)
6.2.2 Global Mobile Device Substrate-Like PCBs Production Value by Application (2025-2030)
6.2.3 Global Mobile Device Substrate-Like PCBs Production Value Market Share by Application (2019-2030)
6.3 Global Mobile Device Substrate-Like PCBs Price by Application (2019-2030)
7 Key Companies Profiled
7.1 AT&S
7.1.1 AT&S Mobile Device Substrate-Like PCBs Corporation Information
7.1.2 AT&S Mobile Device Substrate-Like PCBs Product Portfolio
7.1.3 AT&S Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.1.4 AT&S Main Business and Markets Served
7.1.5 AT&S Recent Developments/Updates
7.2 Samsung Electro-Mechanics
7.2.1 Samsung Electro-Mechanics Mobile Device Substrate-Like PCBs Corporation Information
7.2.2 Samsung Electro-Mechanics Mobile Device Substrate-Like PCBs Product Portfolio
7.2.3 Samsung Electro-Mechanics Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samsung Electro-Mechanics Main Business and Markets Served
7.2.5 Samsung Electro-Mechanics Recent Developments/Updates
7.3 Korea Circuit
7.3.1 Korea Circuit Mobile Device Substrate-Like PCBs Corporation Information
7.3.2 Korea Circuit Mobile Device Substrate-Like PCBs Product Portfolio
7.3.3 Korea Circuit Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Korea Circuit Main Business and Markets Served
7.3.5 Korea Circuit Recent Developments/Updates
7.4 Daeduck
7.4.1 Daeduck Mobile Device Substrate-Like PCBs Corporation Information
7.4.2 Daeduck Mobile Device Substrate-Like PCBs Product Portfolio
7.4.3 Daeduck Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Daeduck Main Business and Markets Served
7.4.5 Daeduck Recent Developments/Updates
7.5 ISU Petasys
7.5.1 ISU Petasys Mobile Device Substrate-Like PCBs Corporation Information
7.5.2 ISU Petasys Mobile Device Substrate-Like PCBs Product Portfolio
7.5.3 ISU Petasys Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.5.4 ISU Petasys Main Business and Markets Served
7.5.5 ISU Petasys Recent Developments/Updates
7.6 Tripod Technology Corporation
7.6.1 Tripod Technology Corporation Mobile Device Substrate-Like PCBs Corporation Information
7.6.2 Tripod Technology Corporation Mobile Device Substrate-Like PCBs Product Portfolio
7.6.3 Tripod Technology Corporation Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Tripod Technology Corporation Main Business and Markets Served
7.6.5 Tripod Technology Corporation Recent Developments/Updates
7.7 Ibiden
7.7.1 Ibiden Mobile Device Substrate-Like PCBs Corporation Information
7.7.2 Ibiden Mobile Device Substrate-Like PCBs Product Portfolio
7.7.3 Ibiden Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Ibiden Main Business and Markets Served
7.7.5 Ibiden Recent Developments/Updates
7.8 LG Innotek
7.8.1 LG Innotek Mobile Device Substrate-Like PCBs Corporation Information
7.8.2 LG Innotek Mobile Device Substrate-Like PCBs Product Portfolio
7.8.3 LG Innotek Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.8.4 LG Innotek Main Business and Markets Served
7.7.5 LG Innotek Recent Developments/Updates
7.9 Kinsus Interconnect Technology
7.9.1 Kinsus Interconnect Technology Mobile Device Substrate-Like PCBs Corporation Information
7.9.2 Kinsus Interconnect Technology Mobile Device Substrate-Like PCBs Product Portfolio
7.9.3 Kinsus Interconnect Technology Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Kinsus Interconnect Technology Main Business and Markets Served
7.9.5 Kinsus Interconnect Technology Recent Developments/Updates
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology Mobile Device Substrate-Like PCBs Corporation Information
7.10.2 Zhen Ding Technology Mobile Device Substrate-Like PCBs Product Portfolio
7.10.3 Zhen Ding Technology Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Zhen Ding Technology Main Business and Markets Served
7.10.5 Zhen Ding Technology Recent Developments/Updates
7.11 TTM Technologies
7.11.1 TTM Technologies Mobile Device Substrate-Like PCBs Corporation Information
7.11.2 TTM Technologies Mobile Device Substrate-Like PCBs Product Portfolio
7.11.3 TTM Technologies Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.11.4 TTM Technologies Main Business and Markets Served
7.11.5 TTM Technologies Recent Developments/Updates
7.12 Unimicron
7.12.1 Unimicron Mobile Device Substrate-Like PCBs Corporation Information
7.12.2 Unimicron Mobile Device Substrate-Like PCBs Product Portfolio
7.12.3 Unimicron Mobile Device Substrate-Like PCBs Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Unimicron Main Business and Markets Served
7.12.5 Unimicron Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Mobile Device Substrate-Like PCBs Industry Chain Analysis
8.2 Mobile Device Substrate-Like PCBs Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Mobile Device Substrate-Like PCBs Production Mode & Process
8.4 Mobile Device Substrate-Like PCBs Sales and Marketing
8.4.1 Mobile Device Substrate-Like PCBs Sales Channels
8.4.2 Mobile Device Substrate-Like PCBs Distributors
8.5 Mobile Device Substrate-Like PCBs Customers
9 Mobile Device Substrate-Like PCBs Market Dynamics
9.1 Mobile Device Substrate-Like PCBs Industry Trends
9.2 Mobile Device Substrate-Like PCBs Market Drivers
9.3 Mobile Device Substrate-Like PCBs Market Challenges
9.4 Mobile Device Substrate-Like PCBs Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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