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Global Photosensitive Solder Resist for Package Substrate Market Research Report 2025
Synopsis
The global market for Photosensitive Solder Resist for Package Substrate was valued at US$ 566 million in the year 2024 and is projected to reach a revised size of US$ 786 million by 2031, growing at a CAGR of 4.8% during the forecast period.
Photosensitive solder resist for packaging substrates is a photosensitive chemical material specially used in the manufacture of integrated circuit (IC) carriers. A permanent protective layer is formed on the surface of the substrate by photolithography. Its main functions include preventing solder short circuit, protecting copper circuits from corrosion, maintaining electrical insulation, and meeting the stringent requirements of high density packaging on material properties.
North American market for Photosensitive Solder Resist for Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Photosensitive Solder Resist for Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Photosensitive Solder Resist for Package Substrate include Resonac, Taiyo Holdings, Technic, Electra Polymers, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Photosensitive Solder Resist for Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Photosensitive Solder Resist for Package Substrate.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Photosensitive Solder Resist for Package Substrate competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
The Photosensitive Solder Resist for Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Photosensitive Solder Resist for Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Photosensitive Solder Resist for Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Company
Resonac
Taiyo Holdings
Technic
Electra Polymers
Segment by Type
Liquid Photoresist
Dry Film Photoresist
Segment by Application
Advanced Packaging Substrate
High Density Interconnect Substrate
OLED Display
Power Module
Others
Production by Region
North America
Europe
China
Japan
India
Southeast Asia
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East and Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Photosensitive Solder Resist for Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Photosensitive Solder Resist for Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Photosensitive Solder Resist for Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global market for Photosensitive Solder Resist for Package Substrate was valued at US$ 566 million in the year 2024 and is projected to reach a revised size of US$ 786 million by 2031, growing at a CAGR of 4.8% during the forecast period.
Photosensitive solder resist for packaging substrates is a photosensitive chemical material specially used in the manufacture of integrated circuit (IC) carriers. A permanent protective layer is formed on the surface of the substrate by photolithography. Its main functions include preventing solder short circuit, protecting copper circuits from corrosion, maintaining electrical insulation, and meeting the stringent requirements of high density packaging on material properties.
North American market for Photosensitive Solder Resist for Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Photosensitive Solder Resist for Package Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Photosensitive Solder Resist for Package Substrate include Resonac, Taiyo Holdings, Technic, Electra Polymers, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Photosensitive Solder Resist for Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Photosensitive Solder Resist for Package Substrate.
The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Photosensitive Solder Resist for Package Substrate competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
The Photosensitive Solder Resist for Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Photosensitive Solder Resist for Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Photosensitive Solder Resist for Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Company
Resonac
Taiyo Holdings
Technic
Electra Polymers
Segment by Type
Liquid Photoresist
Dry Film Photoresist
Segment by Application
Advanced Packaging Substrate
High Density Interconnect Substrate
OLED Display
Power Module
Others
Production by Region
North America
Europe
China
Japan
India
Southeast Asia
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East and Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Photosensitive Solder Resist for Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Photosensitive Solder Resist for Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Photosensitive Solder Resist for Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Photosensitive Solder Resist for Package Substrate Market Overview
1.1 Product Definition
1.2 Photosensitive Solder Resist for Package Substrate by Type
1.2.1 Global Photosensitive Solder Resist for Package Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Liquid Photoresist
1.2.3 Dry Film Photoresist
1.3 Photosensitive Solder Resist for Package Substrate by Application
1.3.1 Global Photosensitive Solder Resist for Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Advanced Packaging Substrate
1.3.3 High Density Interconnect Substrate
1.3.4 OLED Display
1.3.5 Power Module
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Photosensitive Solder Resist for Package Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Photosensitive Solder Resist for Package Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Photosensitive Solder Resist for Package Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Photosensitive Solder Resist for Package Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Photosensitive Solder Resist for Package Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Photosensitive Solder Resist for Package Substrate Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Photosensitive Solder Resist for Package Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Date of Enter into This Industry
2.9 Photosensitive Solder Resist for Package Substrate Market Competitive Situation and Trends
2.9.1 Photosensitive Solder Resist for Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Photosensitive Solder Resist for Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Photosensitive Solder Resist for Package Substrate Production by Region
3.1 Global Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Photosensitive Solder Resist for Package Substrate Production Value by Region (2020-2031)
3.2.1 Global Photosensitive Solder Resist for Package Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Photosensitive Solder Resist for Package Substrate by Region (2026-2031)
3.3 Global Photosensitive Solder Resist for Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Photosensitive Solder Resist for Package Substrate Production Volume by Region (2020-2031)
3.4.1 Global Photosensitive Solder Resist for Package Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Photosensitive Solder Resist for Package Substrate by Region (2026-2031)
3.5 Global Photosensitive Solder Resist for Package Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Photosensitive Solder Resist for Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 India Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.6 Southeast Asia Photosensitive Solder Resist for Package Substrate Production Value Estimates and Forecasts (2020-2031)
4 Photosensitive Solder Resist for Package Substrate Consumption by Region
4.1 Global Photosensitive Solder Resist for Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Photosensitive Solder Resist for Package Substrate Consumption by Region (2020-2031)
4.2.1 Global Photosensitive Solder Resist for Package Substrate Consumption by Region (2020-2025)
4.2.2 Global Photosensitive Solder Resist for Package Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Photosensitive Solder Resist for Package Substrate Production by Type (2020-2031)
5.1.1 Global Photosensitive Solder Resist for Package Substrate Production by Type (2020-2025)
5.1.2 Global Photosensitive Solder Resist for Package Substrate Production by Type (2026-2031)
5.1.3 Global Photosensitive Solder Resist for Package Substrate Production Market Share by Type (2020-2031)
5.2 Global Photosensitive Solder Resist for Package Substrate Production Value by Type (2020-2031)
5.2.1 Global Photosensitive Solder Resist for Package Substrate Production Value by Type (2020-2025)
5.2.2 Global Photosensitive Solder Resist for Package Substrate Production Value by Type (2026-2031)
5.2.3 Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Photosensitive Solder Resist for Package Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Photosensitive Solder Resist for Package Substrate Production by Application (2020-2031)
6.1.1 Global Photosensitive Solder Resist for Package Substrate Production by Application (2020-2025)
6.1.2 Global Photosensitive Solder Resist for Package Substrate Production by Application (2026-2031)
6.1.3 Global Photosensitive Solder Resist for Package Substrate Production Market Share by Application (2020-2031)
6.2 Global Photosensitive Solder Resist for Package Substrate Production Value by Application (2020-2031)
6.2.1 Global Photosensitive Solder Resist for Package Substrate Production Value by Application (2020-2025)
6.2.2 Global Photosensitive Solder Resist for Package Substrate Production Value by Application (2026-2031)
6.2.3 Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Photosensitive Solder Resist for Package Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Resonac
7.1.1 Resonac Photosensitive Solder Resist for Package Substrate Company Information
7.1.2 Resonac Photosensitive Solder Resist for Package Substrate Product Portfolio
7.1.3 Resonac Photosensitive Solder Resist for Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Resonac Main Business and Markets Served
7.1.5 Resonac Recent Developments/Updates
7.2 Taiyo Holdings
7.2.1 Taiyo Holdings Photosensitive Solder Resist for Package Substrate Company Information
7.2.2 Taiyo Holdings Photosensitive Solder Resist for Package Substrate Product Portfolio
7.2.3 Taiyo Holdings Photosensitive Solder Resist for Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Taiyo Holdings Main Business and Markets Served
7.2.5 Taiyo Holdings Recent Developments/Updates
7.3 Technic
7.3.1 Technic Photosensitive Solder Resist for Package Substrate Company Information
7.3.2 Technic Photosensitive Solder Resist for Package Substrate Product Portfolio
7.3.3 Technic Photosensitive Solder Resist for Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Technic Main Business and Markets Served
7.3.5 Technic Recent Developments/Updates
7.4 Electra Polymers
7.4.1 Electra Polymers Photosensitive Solder Resist for Package Substrate Company Information
7.4.2 Electra Polymers Photosensitive Solder Resist for Package Substrate Product Portfolio
7.4.3 Electra Polymers Photosensitive Solder Resist for Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Electra Polymers Main Business and Markets Served
7.4.5 Electra Polymers Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Photosensitive Solder Resist for Package Substrate Industry Chain Analysis
8.2 Photosensitive Solder Resist for Package Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Photosensitive Solder Resist for Package Substrate Production Mode & Process Analysis
8.4 Photosensitive Solder Resist for Package Substrate Sales and Marketing
8.4.1 Photosensitive Solder Resist for Package Substrate Sales Channels
8.4.2 Photosensitive Solder Resist for Package Substrate Distributors
8.5 Photosensitive Solder Resist for Package Substrate Customer Analysis
9 Photosensitive Solder Resist for Package Substrate Market Dynamics
9.1 Photosensitive Solder Resist for Package Substrate Industry Trends
9.2 Photosensitive Solder Resist for Package Substrate Market Drivers
9.3 Photosensitive Solder Resist for Package Substrate Market Challenges
9.4 Photosensitive Solder Resist for Package Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Photosensitive Solder Resist for Package Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
Table 2. Global Photosensitive Solder Resist for Package Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
Table 3. Global Photosensitive Solder Resist for Package Substrate Production Capacity (Tons) by Manufacturers in 2024
Table 4. Global Photosensitive Solder Resist for Package Substrate Production by Manufacturers (2020-2025) & (Tons)
Table 5. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Manufacturers (2020-2025)
Table 6. Global Photosensitive Solder Resist for Package Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
Table 7. Global Photosensitive Solder Resist for Package Substrate Production Value Share by Manufacturers (2020-2025)
Table 8. Global Key Players of Photosensitive Solder Resist for Package Substrate, Industry Ranking, 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Photosensitive Solder Resist for Package Substrate as of 2024)
Table 10. Global Market Photosensitive Solder Resist for Package Substrate Average Price by Manufacturers (US$/Ton) & (2020-2025)
Table 11. Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Manufacturing Base Distribution and Headquarters
Table 12. Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Product Offered and Application
Table 13. Global Key Manufacturers of Photosensitive Solder Resist for Package Substrate, Date of Enter into This Industry
Table 14. Global Photosensitive Solder Resist for Package Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Photosensitive Solder Resist for Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Table 17. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) by Region (2020-2025)
Table 18. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Region (2020-2025)
Table 19. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
Table 20. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share Forecast by Region (2026-2031)
Table 21. Global Photosensitive Solder Resist for Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Table 22. Global Photosensitive Solder Resist for Package Substrate Production (Tons) by Region (2020-2025)
Table 23. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Region (2020-2025)
Table 24. Global Photosensitive Solder Resist for Package Substrate Production (Tons) Forecast by Region (2026-2031)
Table 25. Global Photosensitive Solder Resist for Package Substrate Production Market Share Forecast by Region (2026-2031)
Table 26. Global Photosensitive Solder Resist for Package Substrate Market Average Price (US$/Ton) by Region (2020-2025)
Table 27. Global Photosensitive Solder Resist for Package Substrate Market Average Price (US$/Ton) by Region (2026-2031)
Table 28. Global Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 29. Global Photosensitive Solder Resist for Package Substrate Consumption by Region (2020-2025) & (Tons)
Table 30. Global Photosensitive Solder Resist for Package Substrate Consumption Market Share by Region (2020-2025)
Table 31. Global Photosensitive Solder Resist for Package Substrate Forecasted Consumption by Region (2026-2031) & (Tons)
Table 32. Global Photosensitive Solder Resist for Package Substrate Forecasted Consumption Market Share by Region (2026-2031)
Table 33. North America Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 34. North America Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2025) & (Tons)
Table 35. North America Photosensitive Solder Resist for Package Substrate Consumption by Country (2026-2031) & (Tons)
Table 36. Europe Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 37. Europe Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2025) & (Tons)
Table 38. Europe Photosensitive Solder Resist for Package Substrate Consumption by Country (2026-2031) & (Tons)
Table 39. Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 40. Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption by Region (2020-2025) & (Tons)
Table 41. Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption by Region (2026-2031) & (Tons)
Table 42. Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 43. Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption by Country (2020-2025) & (Tons)
Table 44. Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption by Country (2026-2031) & (Tons)
Table 45. Global Photosensitive Solder Resist for Package Substrate Production (Tons) by Type (2020-2025)
Table 46. Global Photosensitive Solder Resist for Package Substrate Production (Tons) by Type (2026-2031)
Table 47. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Type (2020-2025)
Table 48. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Type (2026-2031)
Table 49. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) by Type (2020-2025)
Table 50. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) by Type (2026-2031)
Table 51. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Type (2020-2025)
Table 52. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Type (2026-2031)
Table 53. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Type (2020-2025)
Table 54. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Type (2026-2031)
Table 55. Global Photosensitive Solder Resist for Package Substrate Production (Tons) by Application (2020-2025)
Table 56. Global Photosensitive Solder Resist for Package Substrate Production (Tons) by Application (2026-2031)
Table 57. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Application (2020-2025)
Table 58. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Application (2026-2031)
Table 59. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) by Application (2020-2025)
Table 60. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) by Application (2026-2031)
Table 61. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Application (2020-2025)
Table 62. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Application (2026-2031)
Table 63. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Application (2020-2025)
Table 64. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Application (2026-2031)
Table 65. Resonac Photosensitive Solder Resist for Package Substrate Company Information
Table 66. Resonac Photosensitive Solder Resist for Package Substrate Specification and Application
Table 67. Resonac Photosensitive Solder Resist for Package Substrate Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 68. Resonac Main Business and Markets Served
Table 69. Resonac Recent Developments/Updates
Table 70. Taiyo Holdings Photosensitive Solder Resist for Package Substrate Company Information
Table 71. Taiyo Holdings Photosensitive Solder Resist for Package Substrate Specification and Application
Table 72. Taiyo Holdings Photosensitive Solder Resist for Package Substrate Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 73. Taiyo Holdings Main Business and Markets Served
Table 74. Taiyo Holdings Recent Developments/Updates
Table 75. Technic Photosensitive Solder Resist for Package Substrate Company Information
Table 76. Technic Photosensitive Solder Resist for Package Substrate Specification and Application
Table 77. Technic Photosensitive Solder Resist for Package Substrate Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 78. Technic Main Business and Markets Served
Table 79. Technic Recent Developments/Updates
Table 80. Electra Polymers Photosensitive Solder Resist for Package Substrate Company Information
Table 81. Electra Polymers Photosensitive Solder Resist for Package Substrate Specification and Application
Table 82. Electra Polymers Photosensitive Solder Resist for Package Substrate Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 83. Electra Polymers Main Business and Markets Served
Table 84. Electra Polymers Recent Developments/Updates
Table 85. Key Raw Materials Lists
Table 86. Raw Materials Key Suppliers Lists
Table 87. Photosensitive Solder Resist for Package Substrate Distributors List
Table 88. Photosensitive Solder Resist for Package Substrate Customers List
Table 89. Photosensitive Solder Resist for Package Substrate Market Trends
Table 90. Photosensitive Solder Resist for Package Substrate Market Drivers
Table 91. Photosensitive Solder Resist for Package Substrate Market Challenges
Table 92. Photosensitive Solder Resist for Package Substrate Market Restraints
Table 93. Research Programs/Design for This Report
Table 94. Key Data Information from Secondary Sources
Table 95. Key Data Information from Primary Sources
Table 96. Authors List of This Report
List of Figures
Figure 1. Product Picture of Photosensitive Solder Resist for Package Substrate
Figure 2. Global Photosensitive Solder Resist for Package Substrate Market Value by Type, (US$ Million) & (2020-2031)
Figure 3. Global Photosensitive Solder Resist for Package Substrate Market Share by Type: 2024 VS 2031
Figure 4. Liquid Photoresist Product Picture
Figure 5. Dry Film Photoresist Product Picture
Figure 6. Global Photosensitive Solder Resist for Package Substrate Market Value by Application, (US$ Million) & (2020-2031)
Figure 7. Global Photosensitive Solder Resist for Package Substrate Market Share by Application: 2024 VS 2031
Figure 8. Advanced Packaging Substrate
Figure 9. High Density Interconnect Substrate
Figure 10. OLED Display
Figure 11. Power Module
Figure 12. Others
Figure 13. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
Figure 14. Global Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) & (2020-2031)
Figure 15. Global Photosensitive Solder Resist for Package Substrate Production Capacity (Tons) & (2020-2031)
Figure 16. Global Photosensitive Solder Resist for Package Substrate Production (Tons) & (2020-2031)
Figure 17. Global Photosensitive Solder Resist for Package Substrate Average Price (US$/Ton) & (2020-2031)
Figure 18. Photosensitive Solder Resist for Package Substrate Report Years Considered
Figure 19. Photosensitive Solder Resist for Package Substrate Production Share by Manufacturers in 2024
Figure 20. Global Photosensitive Solder Resist for Package Substrate Production Value Share by Manufacturers (2024)
Figure 21. Photosensitive Solder Resist for Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
Figure 22. The Global 5 and 10 Largest Players: Market Share by Photosensitive Solder Resist for Package Substrate Revenue in 2024
Figure 23. Global Photosensitive Solder Resist for Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Figure 24. Global Photosensitive Solder Resist for Package Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
Figure 25. Global Photosensitive Solder Resist for Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 26. Global Photosensitive Solder Resist for Package Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
Figure 27. North America Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 28. Europe Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 29. China Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 30. Japan Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 31. India Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 32. Southeast Asia Photosensitive Solder Resist for Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 33. Global Photosensitive Solder Resist for Package Substrate Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 34. Global Photosensitive Solder Resist for Package Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
Figure 35. North America Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 36. North America Photosensitive Solder Resist for Package Substrate Consumption Market Share by Country (2020-2031)
Figure 37. U.S. Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 38. Canada Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 39. Europe Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 40. Europe Photosensitive Solder Resist for Package Substrate Consumption Market Share by Country (2020-2031)
Figure 41. Germany Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 42. France Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 43. U.K. Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 44. Italy Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 45. Russia Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 46. Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 47. Asia Pacific Photosensitive Solder Resist for Package Substrate Consumption Market Share by Region (2020-2031)
Figure 48. China Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 49. Japan Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 50. South Korea Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 51. China Taiwan Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 52. Southeast Asia Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 53. India Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 54. Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 55. Latin America, Middle East & Africa Photosensitive Solder Resist for Package Substrate Consumption Market Share by Country (2020-2031)
Figure 56. Mexico Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 57. Brazil Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 58. Turkey Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 59. GCC Countries Photosensitive Solder Resist for Package Substrate Consumption and Growth Rate (2020-2031) & (Tons)
Figure 60. Global Production Market Share of Photosensitive Solder Resist for Package Substrate by Type (2020-2031)
Figure 61. Global Production Value Market Share of Photosensitive Solder Resist for Package Substrate by Type (2020-2031)
Figure 62. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Type (2020-2031)
Figure 63. Global Production Market Share of Photosensitive Solder Resist for Package Substrate by Application (2020-2031)
Figure 64. Global Production Value Market Share of Photosensitive Solder Resist for Package Substrate by Application (2020-2031)
Figure 65. Global Photosensitive Solder Resist for Package Substrate Price (US$/Ton) by Application (2020-2031)
Figure 66. Photosensitive Solder Resist for Package Substrate Value Chain
Figure 67. Channels of Distribution (Direct Vs Distribution)
Figure 68. Bottom-up and Top-down Approaches for This Report
Figure 69. Data Triangulation
Published By : QY Research
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