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Global Plating for Microelectronics Market Research Report 2024
Synopsis
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The global Plating for Microelectronics market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
This report aims to provide a comprehensive presentation of the global market for Plating for Microelectronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plating for Microelectronics.
Report Scope
The Plating for Microelectronics market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Plating for Microelectronics market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Plating for Microelectronics companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segment by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Plating for Microelectronics companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The global Plating for Microelectronics market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
This report aims to provide a comprehensive presentation of the global market for Plating for Microelectronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plating for Microelectronics.
Report Scope
The Plating for Microelectronics market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Plating for Microelectronics market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Plating for Microelectronics companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segment by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Plating for Microelectronics companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Plating for Microelectronics Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Gold
1.2.3 Zinc
1.2.4 Nickel
1.2.5 Bronze
1.2.6 Tin
1.2.7 Copper
1.2.8 Others
1.3 Market by Application
1.3.1 Global Plating for Microelectronics Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 MEMS
1.3.3 PCB
1.3.4 IC
1.3.5 Photoelectron
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Plating for Microelectronics Market Perspective (2019-2030)
2.2 Plating for Microelectronics Growth Trends by Region
2.2.1 Global Plating for Microelectronics Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Plating for Microelectronics Historic Market Size by Region (2019-2024)
2.2.3 Plating for Microelectronics Forecasted Market Size by Region (2025-2030)
2.3 Plating for Microelectronics Market Dynamics
2.3.1 Plating for Microelectronics Industry Trends
2.3.2 Plating for Microelectronics Market Drivers
2.3.3 Plating for Microelectronics Market Challenges
2.3.4 Plating for Microelectronics Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Plating for Microelectronics Players by Revenue
3.1.1 Global Top Plating for Microelectronics Players by Revenue (2019-2024)
3.1.2 Global Plating for Microelectronics Revenue Market Share by Players (2019-2024)
3.2 Global Plating for Microelectronics Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Plating for Microelectronics Revenue
3.4 Global Plating for Microelectronics Market Concentration Ratio
3.4.1 Global Plating for Microelectronics Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Plating for Microelectronics Revenue in 2023
3.5 Plating for Microelectronics Key Players Head office and Area Served
3.6 Key Players Plating for Microelectronics Product Solution and Service
3.7 Date of Enter into Plating for Microelectronics Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Plating for Microelectronics Breakdown Data by Type
4.1 Global Plating for Microelectronics Historic Market Size by Type (2019-2024)
4.2 Global Plating for Microelectronics Forecasted Market Size by Type (2025-2030)
5 Plating for Microelectronics Breakdown Data by Application
5.1 Global Plating for Microelectronics Historic Market Size by Application (2019-2024)
5.2 Global Plating for Microelectronics Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Plating for Microelectronics Market Size (2019-2030)
6.2 North America Plating for Microelectronics Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Plating for Microelectronics Market Size by Country (2019-2024)
6.4 North America Plating for Microelectronics Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Plating for Microelectronics Market Size (2019-2030)
7.2 Europe Plating for Microelectronics Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Plating for Microelectronics Market Size by Country (2019-2024)
7.4 Europe Plating for Microelectronics Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Plating for Microelectronics Market Size (2019-2030)
8.2 Asia-Pacific Plating for Microelectronics Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Plating for Microelectronics Market Size by Region (2019-2024)
8.4 Asia-Pacific Plating for Microelectronics Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Plating for Microelectronics Market Size (2019-2030)
9.2 Latin America Plating for Microelectronics Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Plating for Microelectronics Market Size by Country (2019-2024)
9.4 Latin America Plating for Microelectronics Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Plating for Microelectronics Market Size (2019-2030)
10.2 Middle East & Africa Plating for Microelectronics Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Plating for Microelectronics Market Size by Country (2019-2024)
10.4 Middle East & Africa Plating for Microelectronics Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 DOW
11.1.1 DOW Company Detail
11.1.2 DOW Business Overview
11.1.3 DOW Plating for Microelectronics Introduction
11.1.4 DOW Revenue in Plating for Microelectronics Business (2019-2024)
11.1.5 DOW Recent Development
11.2 Mitsubishi Materials Corporation
11.2.1 Mitsubishi Materials Corporation Company Detail
11.2.2 Mitsubishi Materials Corporation Business Overview
11.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Introduction
11.2.4 Mitsubishi Materials Corporation Revenue in Plating for Microelectronics Business (2019-2024)
11.2.5 Mitsubishi Materials Corporation Recent Development
11.3 Heraeus
11.3.1 Heraeus Company Detail
11.3.2 Heraeus Business Overview
11.3.3 Heraeus Plating for Microelectronics Introduction
11.3.4 Heraeus Revenue in Plating for Microelectronics Business (2019-2024)
11.3.5 Heraeus Recent Development
11.4 XiLong Scientific
11.4.1 XiLong Scientific Company Detail
11.4.2 XiLong Scientific Business Overview
11.4.3 XiLong Scientific Plating for Microelectronics Introduction
11.4.4 XiLong Scientific Revenue in Plating for Microelectronics Business (2019-2024)
11.4.5 XiLong Scientific Recent Development
11.5 Atotech
11.5.1 Atotech Company Detail
11.5.2 Atotech Business Overview
11.5.3 Atotech Plating for Microelectronics Introduction
11.5.4 Atotech Revenue in Plating for Microelectronics Business (2019-2024)
11.5.5 Atotech Recent Development
11.6 Yamato Denki
11.6.1 Yamato Denki Company Detail
11.6.2 Yamato Denki Business Overview
11.6.3 Yamato Denki Plating for Microelectronics Introduction
11.6.4 Yamato Denki Revenue in Plating for Microelectronics Business (2019-2024)
11.6.5 Yamato Denki Recent Development
11.7 Meltex
11.7.1 Meltex Company Detail
11.7.2 Meltex Business Overview
11.7.3 Meltex Plating for Microelectronics Introduction
11.7.4 Meltex Revenue in Plating for Microelectronics Business (2019-2024)
11.7.5 Meltex Recent Development
11.8 Ishihara Chemical
11.8.1 Ishihara Chemical Company Detail
11.8.2 Ishihara Chemical Business Overview
11.8.3 Ishihara Chemical Plating for Microelectronics Introduction
11.8.4 Ishihara Chemical Revenue in Plating for Microelectronics Business (2019-2024)
11.8.5 Ishihara Chemical Recent Development
11.9 Raschig GmbH
11.9.1 Raschig GmbH Company Detail
11.9.2 Raschig GmbH Business Overview
11.9.3 Raschig GmbH Plating for Microelectronics Introduction
11.9.4 Raschig GmbH Revenue in Plating for Microelectronics Business (2019-2024)
11.9.5 Raschig GmbH Recent Development
11.10 Japan Pure Chemical
11.10.1 Japan Pure Chemical Company Detail
11.10.2 Japan Pure Chemical Business Overview
11.10.3 Japan Pure Chemical Plating for Microelectronics Introduction
11.10.4 Japan Pure Chemical Revenue in Plating for Microelectronics Business (2019-2024)
11.10.5 Japan Pure Chemical Recent Development
11.11 Coatech
11.11.1 Coatech Company Detail
11.11.2 Coatech Business Overview
11.11.3 Coatech Plating for Microelectronics Introduction
11.11.4 Coatech Revenue in Plating for Microelectronics Business (2019-2024)
11.11.5 Coatech Recent Development
11.12 MAGNETO special anodes
11.12.1 MAGNETO special anodes Company Detail
11.12.2 MAGNETO special anodes Business Overview
11.12.3 MAGNETO special anodes Plating for Microelectronics Introduction
11.12.4 MAGNETO special anodes Revenue in Plating for Microelectronics Business (2019-2024)
11.12.5 MAGNETO special anodes Recent Development
11.13 Vopelius Chemie AG
11.13.1 Vopelius Chemie AG Company Detail
11.13.2 Vopelius Chemie AG Business Overview
11.13.3 Vopelius Chemie AG Plating for Microelectronics Introduction
11.13.4 Vopelius Chemie AG Revenue in Plating for Microelectronics Business (2019-2024)
11.13.5 Vopelius Chemie AG Recent Development
11.14 Moses Lake Industries
11.14.1 Moses Lake Industries Company Detail
11.14.2 Moses Lake Industries Business Overview
11.14.3 Moses Lake Industries Plating for Microelectronics Introduction
11.14.4 Moses Lake Industries Revenue in Plating for Microelectronics Business (2019-2024)
11.14.5 Moses Lake Industries Recent Development
11.15 JCU International
11.15.1 JCU International Company Detail
11.15.2 JCU International Business Overview
11.15.3 JCU International Plating for Microelectronics Introduction
11.15.4 JCU International Revenue in Plating for Microelectronics Business (2019-2024)
11.15.5 JCU International Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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