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Global Power Module Packaging Market Research Report 2024

Global Power Module Packaging Market Research Report 2024

Publishing Date : Jan, 2024

License Type :
 

Report Code : 1383644

No of Pages : 112

Synopsis

A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor devices.

The global Power Module Packaging market was valued at US$ 2212 million in 2023 and is anticipated to reach US$ 3735 million by 2030, witnessing a CAGR of 7.8% during the forecast period 2024-2030.

The market growth is driven by reduction in wastage of energy, use of efficient distributed cooling schemes, reduction in footprint, and consequent increase in power density. 

This report aims to provide a comprehensive presentation of the global market for Power Module Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Power Module Packaging.

Report Scope

The Power Module Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Power Module Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Power Module Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company (Partial List)

  • Texas Instruments Incorporated
  • Star Automations
  • DyDac Controls
  • SEMIKRON
  • IXYS Corporation
  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • Fuji Electric
  • Sanken Electric
  • Sansha Electric
  • ON Semiconductor
  • STMicroelectronics
  • Hitachi Power Semiconductor Device
  • ROHM
  • Danfoss

Segment by Type

  • GaN Module
  • SiC Module
  • FET Module
  • IGBT Module
  • Others

Segment by Application

  • Electric Vehicles (EV)
  • Rail Tractions
  • Wind Turbines
  • Photovoltaic Equipment
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan
  • South Korea

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Netherlands)
  • Asia-Pacific (China, Japan, South Korea, China Taiwan, Southeast Asia, India)
  • Latin America, Middle East & Africa (Latin America, Mexico, Brazil, Turkey)

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Power Module Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Power Module Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Power Module Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Index

1 Power Module Packaging Market Overview
1.1 Product Definition
1.2 Power Module Packaging Segment by Type
1.2.1 Global Power Module Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 GaN Module
1.2.3 SiC Module
1.2.4 FET Module
1.2.5 IGBT Module
1.2.6 Others
1.3 Power Module Packaging Segment by Application
1.3.1 Global Power Module Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Electric Vehicles (EV)
1.3.3 Rail Tractions
1.3.4 Wind Turbines
1.3.5 Photovoltaic Equipment
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Power Module Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Power Module Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Power Module Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Power Module Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Power Module Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Power Module Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Power Module Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Power Module Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Power Module Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Power Module Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Power Module Packaging, Date of Enter into This Industry
2.9 Power Module Packaging Market Competitive Situation and Trends
2.9.1 Power Module Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Power Module Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Power Module Packaging Production by Region
3.1 Global Power Module Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Power Module Packaging Production Value by Region (2019-2030)
3.2.1 Global Power Module Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Power Module Packaging by Region (2025-2030)
3.3 Global Power Module Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Power Module Packaging Production by Region (2019-2030)
3.4.1 Global Power Module Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Power Module Packaging by Region (2025-2030)
3.5 Global Power Module Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Power Module Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Power Module Packaging Production Value Estimates and Forecasts (2019-2030)
4 Power Module Packaging Consumption by Region
4.1 Global Power Module Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Power Module Packaging Consumption by Region (2019-2030)
4.2.1 Global Power Module Packaging Consumption by Region (2019-2024)
4.2.2 Global Power Module Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Power Module Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Power Module Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Power Module Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Power Module Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Power Module Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Power Module Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Power Module Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Power Module Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Power Module Packaging Production by Type (2019-2030)
5.1.1 Global Power Module Packaging Production by Type (2019-2024)
5.1.2 Global Power Module Packaging Production by Type (2025-2030)
5.1.3 Global Power Module Packaging Production Market Share by Type (2019-2030)
5.2 Global Power Module Packaging Production Value by Type (2019-2030)
5.2.1 Global Power Module Packaging Production Value by Type (2019-2024)
5.2.2 Global Power Module Packaging Production Value by Type (2025-2030)
5.2.3 Global Power Module Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Power Module Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Power Module Packaging Production by Application (2019-2030)
6.1.1 Global Power Module Packaging Production by Application (2019-2024)
6.1.2 Global Power Module Packaging Production by Application (2025-2030)
6.1.3 Global Power Module Packaging Production Market Share by Application (2019-2030)
6.2 Global Power Module Packaging Production Value by Application (2019-2030)
6.2.1 Global Power Module Packaging Production Value by Application (2019-2024)
6.2.2 Global Power Module Packaging Production Value by Application (2025-2030)
6.2.3 Global Power Module Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Power Module Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Texas Instruments Incorporated
7.1.1 Texas Instruments Incorporated Power Module Packaging Corporation Information
7.1.2 Texas Instruments Incorporated Power Module Packaging Product Portfolio
7.1.3 Texas Instruments Incorporated Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Texas Instruments Incorporated Main Business and Markets Served
7.1.5 Texas Instruments Incorporated Recent Developments/Updates
7.2 Star Automations
7.2.1 Star Automations Power Module Packaging Corporation Information
7.2.2 Star Automations Power Module Packaging Product Portfolio
7.2.3 Star Automations Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Star Automations Main Business and Markets Served
7.2.5 Star Automations Recent Developments/Updates
7.3 DyDac Controls
7.3.1 DyDac Controls Power Module Packaging Corporation Information
7.3.2 DyDac Controls Power Module Packaging Product Portfolio
7.3.3 DyDac Controls Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 DyDac Controls Main Business and Markets Served
7.3.5 DyDac Controls Recent Developments/Updates
7.4 SEMIKRON
7.4.1 SEMIKRON Power Module Packaging Corporation Information
7.4.2 SEMIKRON Power Module Packaging Product Portfolio
7.4.3 SEMIKRON Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 SEMIKRON Main Business and Markets Served
7.4.5 SEMIKRON Recent Developments/Updates
7.5 IXYS Corporation
7.5.1 IXYS Corporation Power Module Packaging Corporation Information
7.5.2 IXYS Corporation Power Module Packaging Product Portfolio
7.5.3 IXYS Corporation Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 IXYS Corporation Main Business and Markets Served
7.5.5 IXYS Corporation Recent Developments/Updates
7.6 Infineon Technologies AG
7.6.1 Infineon Technologies AG Power Module Packaging Corporation Information
7.6.2 Infineon Technologies AG Power Module Packaging Product Portfolio
7.6.3 Infineon Technologies AG Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Infineon Technologies AG Main Business and Markets Served
7.6.5 Infineon Technologies AG Recent Developments/Updates
7.7 Mitsubishi Electric Corporation
7.7.1 Mitsubishi Electric Corporation Power Module Packaging Corporation Information
7.7.2 Mitsubishi Electric Corporation Power Module Packaging Product Portfolio
7.7.3 Mitsubishi Electric Corporation Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Mitsubishi Electric Corporation Main Business and Markets Served
7.7.5 Mitsubishi Electric Corporation Recent Developments/Updates
7.8 Fuji Electric
7.8.1 Fuji Electric Power Module Packaging Corporation Information
7.8.2 Fuji Electric Power Module Packaging Product Portfolio
7.8.3 Fuji Electric Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Fuji Electric Main Business and Markets Served
7.7.5 Fuji Electric Recent Developments/Updates
7.9 Sanken Electric
7.9.1 Sanken Electric Power Module Packaging Corporation Information
7.9.2 Sanken Electric Power Module Packaging Product Portfolio
7.9.3 Sanken Electric Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Sanken Electric Main Business and Markets Served
7.9.5 Sanken Electric Recent Developments/Updates
7.10 Sansha Electric
7.10.1 Sansha Electric Power Module Packaging Corporation Information
7.10.2 Sansha Electric Power Module Packaging Product Portfolio
7.10.3 Sansha Electric Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Sansha Electric Main Business and Markets Served
7.10.5 Sansha Electric Recent Developments/Updates
7.11 ON Semiconductor
7.11.1 ON Semiconductor Power Module Packaging Corporation Information
7.11.2 ON Semiconductor Power Module Packaging Product Portfolio
7.11.3 ON Semiconductor Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.11.4 ON Semiconductor Main Business and Markets Served
7.11.5 ON Semiconductor Recent Developments/Updates
7.12 STMicroelectronics
7.12.1 STMicroelectronics Power Module Packaging Corporation Information
7.12.2 STMicroelectronics Power Module Packaging Product Portfolio
7.12.3 STMicroelectronics Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.12.4 STMicroelectronics Main Business and Markets Served
7.12.5 STMicroelectronics Recent Developments/Updates
7.13 Hitachi Power Semiconductor Device
7.13.1 Hitachi Power Semiconductor Device Power Module Packaging Corporation Information
7.13.2 Hitachi Power Semiconductor Device Power Module Packaging Product Portfolio
7.13.3 Hitachi Power Semiconductor Device Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Hitachi Power Semiconductor Device Main Business and Markets Served
7.13.5 Hitachi Power Semiconductor Device Recent Developments/Updates
7.14 ROHM
7.14.1 ROHM Power Module Packaging Corporation Information
7.14.2 ROHM Power Module Packaging Product Portfolio
7.14.3 ROHM Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.14.4 ROHM Main Business and Markets Served
7.14.5 ROHM Recent Developments/Updates
7.15 Danfoss
7.15.1 Danfoss Power Module Packaging Corporation Information
7.15.2 Danfoss Power Module Packaging Product Portfolio
7.15.3 Danfoss Power Module Packaging Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Danfoss Main Business and Markets Served
7.15.5 Danfoss Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Power Module Packaging Industry Chain Analysis
8.2 Power Module Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Power Module Packaging Production Mode & Process
8.4 Power Module Packaging Sales and Marketing
8.4.1 Power Module Packaging Sales Channels
8.4.2 Power Module Packaging Distributors
8.5 Power Module Packaging Customers
9 Power Module Packaging Market Dynamics
9.1 Power Module Packaging Industry Trends
9.2 Power Module Packaging Market Drivers
9.3 Power Module Packaging Market Challenges
9.4 Power Module Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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