The Market Reports

Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com

Global Precision Wafer Dicing Blade Market Research Report 2024

Global Precision Wafer Dicing Blade Market Research Report 2024

Publishing Date : Jul, 2023

License Type :
 

Report Code : 1763393

No of Pages : 99

Ask Your Query

Synopsis
Global Precision Wafer Dicing Blade market is projected to reach US$ 437.8 million in 2029, increasing from US$ 277 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Precision Wafer Dicing Blade market research.

Key manufacturers engaged in the Precision Wafer Dicing Blade industry include DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba and Shanghai Xiyue Machinery Technology Co., Ltd., etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Precision Wafer Dicing Blade production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Precision Wafer Dicing Blade were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Precision Wafer Dicing Blade market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Precision Wafer Dicing Blade market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

  • DISCO Corporation
  • Thermocarbon Inc.
  • Kulicke and Soffa
  • ADT
  • Shanghai Sinyang Semiconductor Materials
  • Shenzhen West Technology Co., Ltd.
  • UKAM
  • Ceiba
  • Shanghai Xiyue Machinery Technology Co., Ltd.
  • Zhengzhou Qisheng Precision Manufacturing Co., Ltd.

Segment by Type

  • Metal Wafer Dicing Blade
  • Resin Wafer Dicing Blade
  • Electroplated Wafer Dicing Blade

Segment by Application

  • IC
  • Discrete Devices
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan
  • South Korea

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
  • Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Precision Wafer Dicing Blade report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Precision Wafer Dicing Blade Market Overview
1.1 Product Definition
1.2 Precision Wafer Dicing Blade Segment by Type
1.2.1 Global Precision Wafer Dicing Blade Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Metal Wafer Dicing Blade
1.2.3 Resin Wafer Dicing Blade
1.2.4 Electroplated Wafer Dicing Blade
1.3 Precision Wafer Dicing Blade Segment by Application
1.3.1 Global Precision Wafer Dicing Blade Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 IC
1.3.3 Discrete Devices
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Precision Wafer Dicing Blade Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Precision Wafer Dicing Blade Production Estimates and Forecasts (2018-2029)
1.4.4 Global Precision Wafer Dicing Blade Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Precision Wafer Dicing Blade Production Market Share by Manufacturers (2018-2023)
2.2 Global Precision Wafer Dicing Blade Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Precision Wafer Dicing Blade, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Precision Wafer Dicing Blade Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Precision Wafer Dicing Blade Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Precision Wafer Dicing Blade, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Precision Wafer Dicing Blade, Product Offered and Application
2.8 Global Key Manufacturers of Precision Wafer Dicing Blade, Date of Enter into This Industry
2.9 Precision Wafer Dicing Blade Market Competitive Situation and Trends
2.9.1 Precision Wafer Dicing Blade Market Concentration Rate
2.9.2 Global 5 and 10 Largest Precision Wafer Dicing Blade Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Precision Wafer Dicing Blade Production by Region
3.1 Global Precision Wafer Dicing Blade Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Precision Wafer Dicing Blade Production Value by Region (2018-2029)
3.2.1 Global Precision Wafer Dicing Blade Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Precision Wafer Dicing Blade by Region (2024-2029)
3.3 Global Precision Wafer Dicing Blade Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Precision Wafer Dicing Blade Production by Region (2018-2029)
3.4.1 Global Precision Wafer Dicing Blade Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Precision Wafer Dicing Blade by Region (2024-2029)
3.5 Global Precision Wafer Dicing Blade Market Price Analysis by Region (2018-2023)
3.6 Global Precision Wafer Dicing Blade Production and Value, Year-over-Year Growth
3.6.1 North America Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2018-2029)
4 Precision Wafer Dicing Blade Consumption by Region
4.1 Global Precision Wafer Dicing Blade Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Precision Wafer Dicing Blade Consumption by Region (2018-2029)
4.2.1 Global Precision Wafer Dicing Blade Consumption by Region (2018-2023)
4.2.2 Global Precision Wafer Dicing Blade Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Precision Wafer Dicing Blade Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Precision Wafer Dicing Blade Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Precision Wafer Dicing Blade Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Precision Wafer Dicing Blade Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Precision Wafer Dicing Blade Production by Type (2018-2029)
5.1.1 Global Precision Wafer Dicing Blade Production by Type (2018-2023)
5.1.2 Global Precision Wafer Dicing Blade Production by Type (2024-2029)
5.1.3 Global Precision Wafer Dicing Blade Production Market Share by Type (2018-2029)
5.2 Global Precision Wafer Dicing Blade Production Value by Type (2018-2029)
5.2.1 Global Precision Wafer Dicing Blade Production Value by Type (2018-2023)
5.2.2 Global Precision Wafer Dicing Blade Production Value by Type (2024-2029)
5.2.3 Global Precision Wafer Dicing Blade Production Value Market Share by Type (2018-2029)
5.3 Global Precision Wafer Dicing Blade Price by Type (2018-2029)
6 Segment by Application
6.1 Global Precision Wafer Dicing Blade Production by Application (2018-2029)
6.1.1 Global Precision Wafer Dicing Blade Production by Application (2018-2023)
6.1.2 Global Precision Wafer Dicing Blade Production by Application (2024-2029)
6.1.3 Global Precision Wafer Dicing Blade Production Market Share by Application (2018-2029)
6.2 Global Precision Wafer Dicing Blade Production Value by Application (2018-2029)
6.2.1 Global Precision Wafer Dicing Blade Production Value by Application (2018-2023)
6.2.2 Global Precision Wafer Dicing Blade Production Value by Application (2024-2029)
6.2.3 Global Precision Wafer Dicing Blade Production Value Market Share by Application (2018-2029)
6.3 Global Precision Wafer Dicing Blade Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO Corporation
7.1.1 DISCO Corporation Precision Wafer Dicing Blade Corporation Information
7.1.2 DISCO Corporation Precision Wafer Dicing Blade Product Portfolio
7.1.3 DISCO Corporation Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Corporation Main Business and Markets Served
7.1.5 DISCO Corporation Recent Developments/Updates
7.2 Thermocarbon Inc.
7.2.1 Thermocarbon Inc. Precision Wafer Dicing Blade Corporation Information
7.2.2 Thermocarbon Inc. Precision Wafer Dicing Blade Product Portfolio
7.2.3 Thermocarbon Inc. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Thermocarbon Inc. Main Business and Markets Served
7.2.5 Thermocarbon Inc. Recent Developments/Updates
7.3 Kulicke and Soffa
7.3.1 Kulicke and Soffa Precision Wafer Dicing Blade Corporation Information
7.3.2 Kulicke and Soffa Precision Wafer Dicing Blade Product Portfolio
7.3.3 Kulicke and Soffa Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Kulicke and Soffa Main Business and Markets Served
7.3.5 Kulicke and Soffa Recent Developments/Updates
7.4 ADT
7.4.1 ADT Precision Wafer Dicing Blade Corporation Information
7.4.2 ADT Precision Wafer Dicing Blade Product Portfolio
7.4.3 ADT Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.4.4 ADT Main Business and Markets Served
7.4.5 ADT Recent Developments/Updates
7.5 Shanghai Sinyang Semiconductor Materials
7.5.1 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Corporation Information
7.5.2 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Product Portfolio
7.5.3 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
7.5.5 Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
7.6 Shenzhen West Technology Co., Ltd.
7.6.1 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Corporation Information
7.6.2 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.6.3 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Shenzhen West Technology Co., Ltd. Main Business and Markets Served
7.6.5 Shenzhen West Technology Co., Ltd. Recent Developments/Updates
7.7 UKAM
7.7.1 UKAM Precision Wafer Dicing Blade Corporation Information
7.7.2 UKAM Precision Wafer Dicing Blade Product Portfolio
7.7.3 UKAM Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.7.4 UKAM Main Business and Markets Served
7.7.5 UKAM Recent Developments/Updates
7.8 Ceiba
7.8.1 Ceiba Precision Wafer Dicing Blade Corporation Information
7.8.2 Ceiba Precision Wafer Dicing Blade Product Portfolio
7.8.3 Ceiba Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ceiba Main Business and Markets Served
7.7.5 Ceiba Recent Developments/Updates
7.9 Shanghai Xiyue Machinery Technology Co., Ltd.
7.9.1 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Corporation Information
7.9.2 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.9.3 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Shanghai Xiyue Machinery Technology Co., Ltd. Main Business and Markets Served
7.9.5 Shanghai Xiyue Machinery Technology Co., Ltd. Recent Developments/Updates
7.10 Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
7.10.1 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Corporation Information
7.10.2 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.10.3 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Main Business and Markets Served
7.10.5 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Precision Wafer Dicing Blade Industry Chain Analysis
8.2 Precision Wafer Dicing Blade Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Precision Wafer Dicing Blade Production Mode & Process
8.4 Precision Wafer Dicing Blade Sales and Marketing
8.4.1 Precision Wafer Dicing Blade Sales Channels
8.4.2 Precision Wafer Dicing Blade Distributors
8.5 Precision Wafer Dicing Blade Customers
9 Precision Wafer Dicing Blade Market Dynamics
9.1 Precision Wafer Dicing Blade Industry Trends
9.2 Precision Wafer Dicing Blade Market Drivers
9.3 Precision Wafer Dicing Blade Market Challenges
9.4 Precision Wafer Dicing Blade Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

Why ‘The Market Reports’

In Business: Pre Sales Support: Post Sales Support: Turn Around Time: Clients Served: Clients Assisted: Client Types: Payment: Partners with: Number of reports: Custom Research: Report Availability: Report Delivery Format: Security:

Payments Accepted From

Connect with us at

Complete Secure Website

SiteLock