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Global Printed Circuit Board Laminate Market Research Report 2024
Synopsis
Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
The global Printed Circuit Board Laminate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for Printed Circuit Board Laminate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Printed Circuit Board Laminate.
Report Scope
The Printed Circuit Board Laminate market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Printed Circuit Board Laminate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Printed Circuit Board Laminate companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
Segment by Type
FR-4
High Tg Epoxy
BT Epoxy
Polyimide
Copper Clad
Teflon
Other
Segment by Application
Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Printed Circuit Board Laminate companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
The global Printed Circuit Board Laminate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
This report aims to provide a comprehensive presentation of the global market for Printed Circuit Board Laminate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Printed Circuit Board Laminate.
Report Scope
The Printed Circuit Board Laminate market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Printed Circuit Board Laminate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Printed Circuit Board Laminate companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
Segment by Type
FR-4
High Tg Epoxy
BT Epoxy
Polyimide
Copper Clad
Teflon
Other
Segment by Application
Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Printed Circuit Board Laminate companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Printed Circuit Board Laminate Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 FR-4
1.2.3 High Tg Epoxy
1.2.4 BT Epoxy
1.2.5 Polyimide
1.2.6 Copper Clad
1.2.7 Teflon
1.2.8 Other
1.3 Market by Application
1.3.1 Global Printed Circuit Board Laminate Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive
1.3.3 Communications
1.3.4 Industrial Electronics
1.3.5 Consumer Electronics
1.3.6 Aerospace & Defense
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Printed Circuit Board Laminate Market Perspective (2019-2030)
2.2 Printed Circuit Board Laminate Growth Trends by Region
2.2.1 Global Printed Circuit Board Laminate Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Printed Circuit Board Laminate Historic Market Size by Region (2019-2024)
2.2.3 Printed Circuit Board Laminate Forecasted Market Size by Region (2025-2030)
2.3 Printed Circuit Board Laminate Market Dynamics
2.3.1 Printed Circuit Board Laminate Industry Trends
2.3.2 Printed Circuit Board Laminate Market Drivers
2.3.3 Printed Circuit Board Laminate Market Challenges
2.3.4 Printed Circuit Board Laminate Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Printed Circuit Board Laminate Players by Revenue
3.1.1 Global Top Printed Circuit Board Laminate Players by Revenue (2019-2024)
3.1.2 Global Printed Circuit Board Laminate Revenue Market Share by Players (2019-2024)
3.2 Global Printed Circuit Board Laminate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Printed Circuit Board Laminate Revenue
3.4 Global Printed Circuit Board Laminate Market Concentration Ratio
3.4.1 Global Printed Circuit Board Laminate Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Printed Circuit Board Laminate Revenue in 2023
3.5 Printed Circuit Board Laminate Key Players Head office and Area Served
3.6 Key Players Printed Circuit Board Laminate Product Solution and Service
3.7 Date of Enter into Printed Circuit Board Laminate Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Printed Circuit Board Laminate Breakdown Data by Type
4.1 Global Printed Circuit Board Laminate Historic Market Size by Type (2019-2024)
4.2 Global Printed Circuit Board Laminate Forecasted Market Size by Type (2025-2030)
5 Printed Circuit Board Laminate Breakdown Data by Application
5.1 Global Printed Circuit Board Laminate Historic Market Size by Application (2019-2024)
5.2 Global Printed Circuit Board Laminate Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Printed Circuit Board Laminate Market Size (2019-2030)
6.2 North America Printed Circuit Board Laminate Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Printed Circuit Board Laminate Market Size by Country (2019-2024)
6.4 North America Printed Circuit Board Laminate Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Printed Circuit Board Laminate Market Size (2019-2030)
7.2 Europe Printed Circuit Board Laminate Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Printed Circuit Board Laminate Market Size by Country (2019-2024)
7.4 Europe Printed Circuit Board Laminate Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Printed Circuit Board Laminate Market Size (2019-2030)
8.2 Asia-Pacific Printed Circuit Board Laminate Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Printed Circuit Board Laminate Market Size by Region (2019-2024)
8.4 Asia-Pacific Printed Circuit Board Laminate Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Printed Circuit Board Laminate Market Size (2019-2030)
9.2 Latin America Printed Circuit Board Laminate Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Printed Circuit Board Laminate Market Size by Country (2019-2024)
9.4 Latin America Printed Circuit Board Laminate Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Printed Circuit Board Laminate Market Size (2019-2030)
10.2 Middle East & Africa Printed Circuit Board Laminate Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Printed Circuit Board Laminate Market Size by Country (2019-2024)
10.4 Middle East & Africa Printed Circuit Board Laminate Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Unimicron Technology Corp.
11.1.1 Unimicron Technology Corp. Company Detail
11.1.2 Unimicron Technology Corp. Business Overview
11.1.3 Unimicron Technology Corp. Printed Circuit Board Laminate Introduction
11.1.4 Unimicron Technology Corp. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.1.5 Unimicron Technology Corp. Recent Development
11.2 Nippon Mektron
11.2.1 Nippon Mektron Company Detail
11.2.2 Nippon Mektron Business Overview
11.2.3 Nippon Mektron Printed Circuit Board Laminate Introduction
11.2.4 Nippon Mektron Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.2.5 Nippon Mektron Recent Development
11.3 Samsung Electro-Mechanics
11.3.1 Samsung Electro-Mechanics Company Detail
11.3.2 Samsung Electro-Mechanics Business Overview
11.3.3 Samsung Electro-Mechanics Printed Circuit Board Laminate Introduction
11.3.4 Samsung Electro-Mechanics Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.3.5 Samsung Electro-Mechanics Recent Development
11.4 Zhen Ding Technology Holding Limited
11.4.1 Zhen Ding Technology Holding Limited Company Detail
11.4.2 Zhen Ding Technology Holding Limited Business Overview
11.4.3 Zhen Ding Technology Holding Limited Printed Circuit Board Laminate Introduction
11.4.4 Zhen Ding Technology Holding Limited Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.4.5 Zhen Ding Technology Holding Limited Recent Development
11.5 Young Poong Electronics Co., Ltd.
11.5.1 Young Poong Electronics Co., Ltd. Company Detail
11.5.2 Young Poong Electronics Co., Ltd. Business Overview
11.5.3 Young Poong Electronics Co., Ltd. Printed Circuit Board Laminate Introduction
11.5.4 Young Poong Electronics Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.5.5 Young Poong Electronics Co., Ltd. Recent Development
11.6 Daeduck Electronics Co., Ltd.
11.6.1 Daeduck Electronics Co., Ltd. Company Detail
11.6.2 Daeduck Electronics Co., Ltd. Business Overview
11.6.3 Daeduck Electronics Co., Ltd. Printed Circuit Board Laminate Introduction
11.6.4 Daeduck Electronics Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.6.5 Daeduck Electronics Co., Ltd. Recent Development
11.7 Ibiden Co., Ltd.
11.7.1 Ibiden Co., Ltd. Company Detail
11.7.2 Ibiden Co., Ltd. Business Overview
11.7.3 Ibiden Co., Ltd. Printed Circuit Board Laminate Introduction
11.7.4 Ibiden Co., Ltd. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.7.5 Ibiden Co., Ltd. Recent Development
11.8 Tripod Technology Corporation
11.8.1 Tripod Technology Corporation Company Detail
11.8.2 Tripod Technology Corporation Business Overview
11.8.3 Tripod Technology Corporation Printed Circuit Board Laminate Introduction
11.8.4 Tripod Technology Corporation Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.8.5 Tripod Technology Corporation Recent Development
11.9 TTM Technologies, Inc.
11.9.1 TTM Technologies, Inc. Company Detail
11.9.2 TTM Technologies, Inc. Business Overview
11.9.3 TTM Technologies, Inc. Printed Circuit Board Laminate Introduction
11.9.4 TTM Technologies, Inc. Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.9.5 TTM Technologies, Inc. Recent Development
11.10 Austria Technologie & Systemtechnik AG
11.10.1 Austria Technologie & Systemtechnik AG Company Detail
11.10.2 Austria Technologie & Systemtechnik AG Business Overview
11.10.3 Austria Technologie & Systemtechnik AG Printed Circuit Board Laminate Introduction
11.10.4 Austria Technologie & Systemtechnik AG Revenue in Printed Circuit Board Laminate Business (2019-2024)
11.10.5 Austria Technologie & Systemtechnik AG Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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