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Global Radiation Hardened Electronics and Semiconductors Market Research Report 2024
Synopsis
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.
The global Radiation Hardened Electronics and Semiconductors market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Radiation Hardened Electronics and Semiconductors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Radiation Hardened Electronics and Semiconductors.
Report Scope
The Radiation Hardened Electronics and Semiconductors market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Radiation Hardened Electronics and Semiconductors market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Radiation Hardened Electronics and Semiconductors companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Honeywell Aerospace
BAE Systems
Microchip Technology
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Analog Devices Corporation
ST Microelectronics
Segment by Type
Processors & Controllers
Power Management
ASICs
FPGAs
Other
Segment by Application
Aerospace & Defense
Space
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Radiation Hardened Electronics and Semiconductors companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.
The global Radiation Hardened Electronics and Semiconductors market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Radiation Hardened Electronics and Semiconductors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Radiation Hardened Electronics and Semiconductors.
Report Scope
The Radiation Hardened Electronics and Semiconductors market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Radiation Hardened Electronics and Semiconductors market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Radiation Hardened Electronics and Semiconductors companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Honeywell Aerospace
BAE Systems
Microchip Technology
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Analog Devices Corporation
ST Microelectronics
Segment by Type
Processors & Controllers
Power Management
ASICs
FPGAs
Other
Segment by Application
Aerospace & Defense
Space
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Radiation Hardened Electronics and Semiconductors companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Radiation Hardened Electronics and Semiconductors Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Processors & Controllers
1.2.3 Power Management
1.2.4 ASICs
1.2.5 FPGAs
1.2.6 Other
1.3 Market by Application
1.3.1 Global Radiation Hardened Electronics and Semiconductors Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Aerospace & Defense
1.3.3 Space
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Radiation Hardened Electronics and Semiconductors Market Perspective (2019-2030)
2.2 Radiation Hardened Electronics and Semiconductors Growth Trends by Region
2.2.1 Global Radiation Hardened Electronics and Semiconductors Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Radiation Hardened Electronics and Semiconductors Historic Market Size by Region (2019-2024)
2.2.3 Radiation Hardened Electronics and Semiconductors Forecasted Market Size by Region (2025-2030)
2.3 Radiation Hardened Electronics and Semiconductors Market Dynamics
2.3.1 Radiation Hardened Electronics and Semiconductors Industry Trends
2.3.2 Radiation Hardened Electronics and Semiconductors Market Drivers
2.3.3 Radiation Hardened Electronics and Semiconductors Market Challenges
2.3.4 Radiation Hardened Electronics and Semiconductors Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Radiation Hardened Electronics and Semiconductors Players by Revenue
3.1.1 Global Top Radiation Hardened Electronics and Semiconductors Players by Revenue (2019-2024)
3.1.2 Global Radiation Hardened Electronics and Semiconductors Revenue Market Share by Players (2019-2024)
3.2 Global Radiation Hardened Electronics and Semiconductors Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Radiation Hardened Electronics and Semiconductors Revenue
3.4 Global Radiation Hardened Electronics and Semiconductors Market Concentration Ratio
3.4.1 Global Radiation Hardened Electronics and Semiconductors Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Radiation Hardened Electronics and Semiconductors Revenue in 2023
3.5 Radiation Hardened Electronics and Semiconductors Key Players Head office and Area Served
3.6 Key Players Radiation Hardened Electronics and Semiconductors Product Solution and Service
3.7 Date of Enter into Radiation Hardened Electronics and Semiconductors Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Radiation Hardened Electronics and Semiconductors Breakdown Data by Type
4.1 Global Radiation Hardened Electronics and Semiconductors Historic Market Size by Type (2019-2024)
4.2 Global Radiation Hardened Electronics and Semiconductors Forecasted Market Size by Type (2025-2030)
5 Radiation Hardened Electronics and Semiconductors Breakdown Data by Application
5.1 Global Radiation Hardened Electronics and Semiconductors Historic Market Size by Application (2019-2024)
5.2 Global Radiation Hardened Electronics and Semiconductors Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Radiation Hardened Electronics and Semiconductors Market Size (2019-2030)
6.2 North America Radiation Hardened Electronics and Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Radiation Hardened Electronics and Semiconductors Market Size by Country (2019-2024)
6.4 North America Radiation Hardened Electronics and Semiconductors Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Radiation Hardened Electronics and Semiconductors Market Size (2019-2030)
7.2 Europe Radiation Hardened Electronics and Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Radiation Hardened Electronics and Semiconductors Market Size by Country (2019-2024)
7.4 Europe Radiation Hardened Electronics and Semiconductors Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Radiation Hardened Electronics and Semiconductors Market Size (2019-2030)
8.2 Asia-Pacific Radiation Hardened Electronics and Semiconductors Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Radiation Hardened Electronics and Semiconductors Market Size by Region (2019-2024)
8.4 Asia-Pacific Radiation Hardened Electronics and Semiconductors Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Radiation Hardened Electronics and Semiconductors Market Size (2019-2030)
9.2 Latin America Radiation Hardened Electronics and Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Radiation Hardened Electronics and Semiconductors Market Size by Country (2019-2024)
9.4 Latin America Radiation Hardened Electronics and Semiconductors Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Radiation Hardened Electronics and Semiconductors Market Size (2019-2030)
10.2 Middle East & Africa Radiation Hardened Electronics and Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Radiation Hardened Electronics and Semiconductors Market Size by Country (2019-2024)
10.4 Middle East & Africa Radiation Hardened Electronics and Semiconductors Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Honeywell Aerospace
11.1.1 Honeywell Aerospace Company Detail
11.1.2 Honeywell Aerospace Business Overview
11.1.3 Honeywell Aerospace Radiation Hardened Electronics and Semiconductors Introduction
11.1.4 Honeywell Aerospace Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.1.5 Honeywell Aerospace Recent Development
11.2 BAE Systems
11.2.1 BAE Systems Company Detail
11.2.2 BAE Systems Business Overview
11.2.3 BAE Systems Radiation Hardened Electronics and Semiconductors Introduction
11.2.4 BAE Systems Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.2.5 BAE Systems Recent Development
11.3 Microchip Technology
11.3.1 Microchip Technology Company Detail
11.3.2 Microchip Technology Business Overview
11.3.3 Microchip Technology Radiation Hardened Electronics and Semiconductors Introduction
11.3.4 Microchip Technology Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.3.5 Microchip Technology Recent Development
11.4 Xilinx Incorporation
11.4.1 Xilinx Incorporation Company Detail
11.4.2 Xilinx Incorporation Business Overview
11.4.3 Xilinx Incorporation Radiation Hardened Electronics and Semiconductors Introduction
11.4.4 Xilinx Incorporation Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.4.5 Xilinx Incorporation Recent Development
11.5 Texas Instruments
11.5.1 Texas Instruments Company Detail
11.5.2 Texas Instruments Business Overview
11.5.3 Texas Instruments Radiation Hardened Electronics and Semiconductors Introduction
11.5.4 Texas Instruments Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.5.5 Texas Instruments Recent Development
11.6 Maxwell Technologies
11.6.1 Maxwell Technologies Company Detail
11.6.2 Maxwell Technologies Business Overview
11.6.3 Maxwell Technologies Radiation Hardened Electronics and Semiconductors Introduction
11.6.4 Maxwell Technologies Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.6.5 Maxwell Technologies Recent Development
11.7 Intersil Corporation
11.7.1 Intersil Corporation Company Detail
11.7.2 Intersil Corporation Business Overview
11.7.3 Intersil Corporation Radiation Hardened Electronics and Semiconductors Introduction
11.7.4 Intersil Corporation Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.7.5 Intersil Corporation Recent Development
11.8 Atmel Corporation
11.8.1 Atmel Corporation Company Detail
11.8.2 Atmel Corporation Business Overview
11.8.3 Atmel Corporation Radiation Hardened Electronics and Semiconductors Introduction
11.8.4 Atmel Corporation Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.8.5 Atmel Corporation Recent Development
11.9 Analog Devices Corporation
11.9.1 Analog Devices Corporation Company Detail
11.9.2 Analog Devices Corporation Business Overview
11.9.3 Analog Devices Corporation Radiation Hardened Electronics and Semiconductors Introduction
11.9.4 Analog Devices Corporation Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.9.5 Analog Devices Corporation Recent Development
11.10 ST Microelectronics
11.10.1 ST Microelectronics Company Detail
11.10.2 ST Microelectronics Business Overview
11.10.3 ST Microelectronics Radiation Hardened Electronics and Semiconductors Introduction
11.10.4 ST Microelectronics Revenue in Radiation Hardened Electronics and Semiconductors Business (2019-2024)
11.10.5 ST Microelectronics Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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