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Global Semiconductor Advanced Packaging Market Research Report 2024
Synopsis
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
The global Semiconductor Advanced Packaging market was valued at US$ 15670 million in 2023 and is anticipated to reach US$ 26270 million by 2030, witnessing a CAGR of 7.5% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Advanced Packaging.
Report Scope
The Semiconductor Advanced Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Advanced Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Samsung
TSMC (Taiwan Semiconductor Manufacturing Company)
China Wafer Level CSP
ChipMOS Technologies
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics Technology (JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology (PTI)
Signetics
Tianshui Huatian
Veeco/CNT
UTAC Group
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Advanced Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
The global Semiconductor Advanced Packaging market was valued at US$ 15670 million in 2023 and is anticipated to reach US$ 26270 million by 2030, witnessing a CAGR of 7.5% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Advanced Packaging.
Report Scope
The Semiconductor Advanced Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Advanced Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Samsung
TSMC (Taiwan Semiconductor Manufacturing Company)
China Wafer Level CSP
ChipMOS Technologies
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics Technology (JCET)
King Yuan Electronics
Tongfu Microelectronics
Nepes
Powertech Technology (PTI)
Signetics
Tianshui Huatian
Veeco/CNT
UTAC Group
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Advanced Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Advanced Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.3 Fan-In Wafer-Level Packaging (FI WLP)
1.2.4 Flip Chip (FC)
1.2.5 2.5D/3D
1.3 Market by Application
1.3.1 Global Semiconductor Advanced Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Advanced Packaging Market Perspective (2019-2030)
2.2 Semiconductor Advanced Packaging Growth Trends by Region
2.2.1 Global Semiconductor Advanced Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Advanced Packaging Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Advanced Packaging Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Advanced Packaging Market Dynamics
2.3.1 Semiconductor Advanced Packaging Industry Trends
2.3.2 Semiconductor Advanced Packaging Market Drivers
2.3.3 Semiconductor Advanced Packaging Market Challenges
2.3.4 Semiconductor Advanced Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Advanced Packaging Players by Revenue
3.1.1 Global Top Semiconductor Advanced Packaging Players by Revenue (2019-2024)
3.1.2 Global Semiconductor Advanced Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Semiconductor Advanced Packaging Revenue
3.4 Global Semiconductor Advanced Packaging Market Concentration Ratio
3.4.1 Global Semiconductor Advanced Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Advanced Packaging Revenue in 2023
3.5 Semiconductor Advanced Packaging Key Players Head office and Area Served
3.6 Key Players Semiconductor Advanced Packaging Product Solution and Service
3.7 Date of Enter into Semiconductor Advanced Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Advanced Packaging Breakdown Data by Type
4.1 Global Semiconductor Advanced Packaging Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Advanced Packaging Forecasted Market Size by Type (2025-2030)
5 Semiconductor Advanced Packaging Breakdown Data by Application
5.1 Global Semiconductor Advanced Packaging Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Advanced Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Advanced Packaging Market Size (2019-2030)
6.2 North America Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor Advanced Packaging Market Size by Country (2019-2024)
6.4 North America Semiconductor Advanced Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor Advanced Packaging Market Size (2019-2030)
7.2 Europe Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor Advanced Packaging Market Size by Country (2019-2024)
7.4 Europe Semiconductor Advanced Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Advanced Packaging Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor Advanced Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor Advanced Packaging Market Size (2019-2030)
9.2 Latin America Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor Advanced Packaging Market Size by Country (2019-2024)
9.4 Latin America Semiconductor Advanced Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Advanced Packaging Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Advanced Semiconductor Engineering (ASE)
11.1.1 Advanced Semiconductor Engineering (ASE) Company Detail
11.1.2 Advanced Semiconductor Engineering (ASE) Business Overview
11.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Introduction
11.1.4 Advanced Semiconductor Engineering (ASE) Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.1.5 Advanced Semiconductor Engineering (ASE) Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Semiconductor Advanced Packaging Introduction
11.2.4 Amkor Technology Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 Samsung
11.3.1 Samsung Company Detail
11.3.2 Samsung Business Overview
11.3.3 Samsung Semiconductor Advanced Packaging Introduction
11.3.4 Samsung Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.3.5 Samsung Recent Development
11.4 TSMC (Taiwan Semiconductor Manufacturing Company)
11.4.1 TSMC (Taiwan Semiconductor Manufacturing Company) Company Detail
11.4.2 TSMC (Taiwan Semiconductor Manufacturing Company) Business Overview
11.4.3 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Introduction
11.4.4 TSMC (Taiwan Semiconductor Manufacturing Company) Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.4.5 TSMC (Taiwan Semiconductor Manufacturing Company) Recent Development
11.5 China Wafer Level CSP
11.5.1 China Wafer Level CSP Company Detail
11.5.2 China Wafer Level CSP Business Overview
11.5.3 China Wafer Level CSP Semiconductor Advanced Packaging Introduction
11.5.4 China Wafer Level CSP Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.5.5 China Wafer Level CSP Recent Development
11.6 ChipMOS Technologies
11.6.1 ChipMOS Technologies Company Detail
11.6.2 ChipMOS Technologies Business Overview
11.6.3 ChipMOS Technologies Semiconductor Advanced Packaging Introduction
11.6.4 ChipMOS Technologies Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.6.5 ChipMOS Technologies Recent Development
11.7 FlipChip International
11.7.1 FlipChip International Company Detail
11.7.2 FlipChip International Business Overview
11.7.3 FlipChip International Semiconductor Advanced Packaging Introduction
11.7.4 FlipChip International Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.7.5 FlipChip International Recent Development
11.8 HANA Micron
11.8.1 HANA Micron Company Detail
11.8.2 HANA Micron Business Overview
11.8.3 HANA Micron Semiconductor Advanced Packaging Introduction
11.8.4 HANA Micron Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.8.5 HANA Micron Recent Development
11.9 Interconnect Systems (Molex)
11.9.1 Interconnect Systems (Molex) Company Detail
11.9.2 Interconnect Systems (Molex) Business Overview
11.9.3 Interconnect Systems (Molex) Semiconductor Advanced Packaging Introduction
11.9.4 Interconnect Systems (Molex) Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.9.5 Interconnect Systems (Molex) Recent Development
11.10 Jiangsu Changjiang Electronics Technology (JCET)
11.10.1 Jiangsu Changjiang Electronics Technology (JCET) Company Detail
11.10.2 Jiangsu Changjiang Electronics Technology (JCET) Business Overview
11.10.3 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Introduction
11.10.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.10.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Development
11.11 King Yuan Electronics
11.11.1 King Yuan Electronics Company Detail
11.11.2 King Yuan Electronics Business Overview
11.11.3 King Yuan Electronics Semiconductor Advanced Packaging Introduction
11.11.4 King Yuan Electronics Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.11.5 King Yuan Electronics Recent Development
11.12 Tongfu Microelectronics
11.12.1 Tongfu Microelectronics Company Detail
11.12.2 Tongfu Microelectronics Business Overview
11.12.3 Tongfu Microelectronics Semiconductor Advanced Packaging Introduction
11.12.4 Tongfu Microelectronics Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.12.5 Tongfu Microelectronics Recent Development
11.13 Nepes
11.13.1 Nepes Company Detail
11.13.2 Nepes Business Overview
11.13.3 Nepes Semiconductor Advanced Packaging Introduction
11.13.4 Nepes Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.13.5 Nepes Recent Development
11.14 Powertech Technology (PTI)
11.14.1 Powertech Technology (PTI) Company Detail
11.14.2 Powertech Technology (PTI) Business Overview
11.14.3 Powertech Technology (PTI) Semiconductor Advanced Packaging Introduction
11.14.4 Powertech Technology (PTI) Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.14.5 Powertech Technology (PTI) Recent Development
11.15 Signetics
11.15.1 Signetics Company Detail
11.15.2 Signetics Business Overview
11.15.3 Signetics Semiconductor Advanced Packaging Introduction
11.15.4 Signetics Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.15.5 Signetics Recent Development
11.16 Tianshui Huatian
11.16.1 Tianshui Huatian Company Detail
11.16.2 Tianshui Huatian Business Overview
11.16.3 Tianshui Huatian Semiconductor Advanced Packaging Introduction
11.16.4 Tianshui Huatian Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.16.5 Tianshui Huatian Recent Development
11.17 Veeco/CNT
11.17.1 Veeco/CNT Company Detail
11.17.2 Veeco/CNT Business Overview
11.17.3 Veeco/CNT Semiconductor Advanced Packaging Introduction
11.17.4 Veeco/CNT Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.17.5 Veeco/CNT Recent Development
11.18 UTAC Group
11.18.1 UTAC Group Company Detail
11.18.2 UTAC Group Business Overview
11.18.3 UTAC Group Semiconductor Advanced Packaging Introduction
11.18.4 UTAC Group Revenue in Semiconductor Advanced Packaging Business (2019-2024)
11.18.5 UTAC Group Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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