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Synopsis
Semiconductor & IC packaging materials are known to protect the electronic components such as semiconductors and ICs from external impact, corrosion, and so on.
The global Semiconductor and IC Packaging Materials market was valued at US$ 26480 million in 2023 and is anticipated to reach US$ 36570 million by 2030, witnessing a CAGR of 4.6% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Semiconductor and IC Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor and IC Packaging Materials.
Report Scope
The Semiconductor and IC Packaging Materials market size, estimations, and forecasts are provided in terms of output/shipments (MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor and IC Packaging Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor and IC Packaging Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
- Hitachi Chemical
- LG Chemical
- Mitsui High-Tec
- Kyocera Chemical
- Toppan Printing
- 3M
- Zhuhai ACCESS Semiconductor
- Veco Precision
- Precision Micro
- Toyo Adtec
- SHINKO
- NGK Electronics Devices
- He Bei SINOPACK Eletronic Tech
- Neo Tech
- TATSUTA Electric Wire & Cable
Segment by Type
- Organic Substrates
- Bonding Wires
- Leadframes
- Ceramic Packages
- Solder Balls
- Others
Segment by Application
- Electronics Industry
- Medical Electronics
- Automobiles
- Communication
- Others
Production by Region
- North America
- Europe
- China
- Japan
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Russia)
- Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
- Latin America (Mexico, Brazil, Argentina)
- Middle East & Africa (Turkey, Saudi Arabia, UAE)
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor and IC Packaging Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor and IC Packaging Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor and IC Packaging Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 Semiconductor and IC Packaging Materials Market Overview
1.1 Product Definition
1.2 Semiconductor and IC Packaging Materials Segment by Type
1.2.1 Global Semiconductor and IC Packaging Materials Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Organic Substrates
1.2.3 Bonding Wires
1.2.4 Leadframes
1.2.5 Ceramic Packages
1.2.6 Solder Balls
1.2.7 Others
1.3 Semiconductor and IC Packaging Materials Segment by Application
1.3.1 Global Semiconductor and IC Packaging Materials Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Electronics Industry
1.3.3 Medical Electronics
1.3.4 Automobiles
1.3.5 Communication
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor and IC Packaging Materials Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor and IC Packaging Materials Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor and IC Packaging Materials Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor and IC Packaging Materials Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor and IC Packaging Materials Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor and IC Packaging Materials, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor and IC Packaging Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor and IC Packaging Materials Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor and IC Packaging Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor and IC Packaging Materials, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor and IC Packaging Materials, Date of Enter into This Industry
2.9 Semiconductor and IC Packaging Materials Market Competitive Situation and Trends
2.9.1 Semiconductor and IC Packaging Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor and IC Packaging Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor and IC Packaging Materials Production by Region
3.1 Global Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor and IC Packaging Materials Production Value by Region (2019-2030)
3.2.1 Global Semiconductor and IC Packaging Materials Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor and IC Packaging Materials by Region (2025-2030)
3.3 Global Semiconductor and IC Packaging Materials Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor and IC Packaging Materials Production by Region (2019-2030)
3.4.1 Global Semiconductor and IC Packaging Materials Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor and IC Packaging Materials by Region (2025-2030)
3.5 Global Semiconductor and IC Packaging Materials Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor and IC Packaging Materials Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor and IC Packaging Materials Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor and IC Packaging Materials Consumption by Region
4.1 Global Semiconductor and IC Packaging Materials Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor and IC Packaging Materials Consumption by Region (2019-2030)
4.2.1 Global Semiconductor and IC Packaging Materials Consumption by Region (2019-2024)
4.2.2 Global Semiconductor and IC Packaging Materials Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor and IC Packaging Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor and IC Packaging Materials Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor and IC Packaging Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor and IC Packaging Materials Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor and IC Packaging Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor and IC Packaging Materials Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor and IC Packaging Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor and IC Packaging Materials Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor and IC Packaging Materials Production by Type (2019-2030)
5.1.1 Global Semiconductor and IC Packaging Materials Production by Type (2019-2024)
5.1.2 Global Semiconductor and IC Packaging Materials Production by Type (2025-2030)
5.1.3 Global Semiconductor and IC Packaging Materials Production Market Share by Type (2019-2030)
5.2 Global Semiconductor and IC Packaging Materials Production Value by Type (2019-2030)
5.2.1 Global Semiconductor and IC Packaging Materials Production Value by Type (2019-2024)
5.2.2 Global Semiconductor and IC Packaging Materials Production Value by Type (2025-2030)
5.2.3 Global Semiconductor and IC Packaging Materials Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor and IC Packaging Materials Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor and IC Packaging Materials Production by Application (2019-2030)
6.1.1 Global Semiconductor and IC Packaging Materials Production by Application (2019-2024)
6.1.2 Global Semiconductor and IC Packaging Materials Production by Application (2025-2030)
6.1.3 Global Semiconductor and IC Packaging Materials Production Market Share by Application (2019-2030)
6.2 Global Semiconductor and IC Packaging Materials Production Value by Application (2019-2030)
6.2.1 Global Semiconductor and IC Packaging Materials Production Value by Application (2019-2024)
6.2.2 Global Semiconductor and IC Packaging Materials Production Value by Application (2025-2030)
6.2.3 Global Semiconductor and IC Packaging Materials Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor and IC Packaging Materials Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Hitachi Chemical
7.1.1 Hitachi Chemical Semiconductor and IC Packaging Materials Corporation Information
7.1.2 Hitachi Chemical Semiconductor and IC Packaging Materials Product Portfolio
7.1.3 Hitachi Chemical Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Hitachi Chemical Main Business and Markets Served
7.1.5 Hitachi Chemical Recent Developments/Updates
7.2 LG Chemical
7.2.1 LG Chemical Semiconductor and IC Packaging Materials Corporation Information
7.2.2 LG Chemical Semiconductor and IC Packaging Materials Product Portfolio
7.2.3 LG Chemical Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.2.4 LG Chemical Main Business and Markets Served
7.2.5 LG Chemical Recent Developments/Updates
7.3 Mitsui High-Tec
7.3.1 Mitsui High-Tec Semiconductor and IC Packaging Materials Corporation Information
7.3.2 Mitsui High-Tec Semiconductor and IC Packaging Materials Product Portfolio
7.3.3 Mitsui High-Tec Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Mitsui High-Tec Main Business and Markets Served
7.3.5 Mitsui High-Tec Recent Developments/Updates
7.4 Kyocera Chemical
7.4.1 Kyocera Chemical Semiconductor and IC Packaging Materials Corporation Information
7.4.2 Kyocera Chemical Semiconductor and IC Packaging Materials Product Portfolio
7.4.3 Kyocera Chemical Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Kyocera Chemical Main Business and Markets Served
7.4.5 Kyocera Chemical Recent Developments/Updates
7.5 Toppan Printing
7.5.1 Toppan Printing Semiconductor and IC Packaging Materials Corporation Information
7.5.2 Toppan Printing Semiconductor and IC Packaging Materials Product Portfolio
7.5.3 Toppan Printing Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Toppan Printing Main Business and Markets Served
7.5.5 Toppan Printing Recent Developments/Updates
7.6 3M
7.6.1 3M Semiconductor and IC Packaging Materials Corporation Information
7.6.2 3M Semiconductor and IC Packaging Materials Product Portfolio
7.6.3 3M Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.6.4 3M Main Business and Markets Served
7.6.5 3M Recent Developments/Updates
7.7 Zhuhai ACCESS Semiconductor
7.7.1 Zhuhai ACCESS Semiconductor Semiconductor and IC Packaging Materials Corporation Information
7.7.2 Zhuhai ACCESS Semiconductor Semiconductor and IC Packaging Materials Product Portfolio
7.7.3 Zhuhai ACCESS Semiconductor Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Zhuhai ACCESS Semiconductor Main Business and Markets Served
7.7.5 Zhuhai ACCESS Semiconductor Recent Developments/Updates
7.8 Veco Precision
7.8.1 Veco Precision Semiconductor and IC Packaging Materials Corporation Information
7.8.2 Veco Precision Semiconductor and IC Packaging Materials Product Portfolio
7.8.3 Veco Precision Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Veco Precision Main Business and Markets Served
7.7.5 Veco Precision Recent Developments/Updates
7.9 Precision Micro
7.9.1 Precision Micro Semiconductor and IC Packaging Materials Corporation Information
7.9.2 Precision Micro Semiconductor and IC Packaging Materials Product Portfolio
7.9.3 Precision Micro Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Precision Micro Main Business and Markets Served
7.9.5 Precision Micro Recent Developments/Updates
7.10 Toyo Adtec
7.10.1 Toyo Adtec Semiconductor and IC Packaging Materials Corporation Information
7.10.2 Toyo Adtec Semiconductor and IC Packaging Materials Product Portfolio
7.10.3 Toyo Adtec Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Toyo Adtec Main Business and Markets Served
7.10.5 Toyo Adtec Recent Developments/Updates
7.11 SHINKO
7.11.1 SHINKO Semiconductor and IC Packaging Materials Corporation Information
7.11.2 SHINKO Semiconductor and IC Packaging Materials Product Portfolio
7.11.3 SHINKO Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.11.4 SHINKO Main Business and Markets Served
7.11.5 SHINKO Recent Developments/Updates
7.12 NGK Electronics Devices
7.12.1 NGK Electronics Devices Semiconductor and IC Packaging Materials Corporation Information
7.12.2 NGK Electronics Devices Semiconductor and IC Packaging Materials Product Portfolio
7.12.3 NGK Electronics Devices Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.12.4 NGK Electronics Devices Main Business and Markets Served
7.12.5 NGK Electronics Devices Recent Developments/Updates
7.13 He Bei SINOPACK Eletronic Tech
7.13.1 He Bei SINOPACK Eletronic Tech Semiconductor and IC Packaging Materials Corporation Information
7.13.2 He Bei SINOPACK Eletronic Tech Semiconductor and IC Packaging Materials Product Portfolio
7.13.3 He Bei SINOPACK Eletronic Tech Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.13.4 He Bei SINOPACK Eletronic Tech Main Business and Markets Served
7.13.5 He Bei SINOPACK Eletronic Tech Recent Developments/Updates
7.14 Neo Tech
7.14.1 Neo Tech Semiconductor and IC Packaging Materials Corporation Information
7.14.2 Neo Tech Semiconductor and IC Packaging Materials Product Portfolio
7.14.3 Neo Tech Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Neo Tech Main Business and Markets Served
7.14.5 Neo Tech Recent Developments/Updates
7.15 TATSUTA Electric Wire & Cable
7.15.1 TATSUTA Electric Wire & Cable Semiconductor and IC Packaging Materials Corporation Information
7.15.2 TATSUTA Electric Wire & Cable Semiconductor and IC Packaging Materials Product Portfolio
7.15.3 TATSUTA Electric Wire & Cable Semiconductor and IC Packaging Materials Production, Value, Price and Gross Margin (2019-2024)
7.15.4 TATSUTA Electric Wire & Cable Main Business and Markets Served
7.15.5 TATSUTA Electric Wire & Cable Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor and IC Packaging Materials Industry Chain Analysis
8.2 Semiconductor and IC Packaging Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor and IC Packaging Materials Production Mode & Process
8.4 Semiconductor and IC Packaging Materials Sales and Marketing
8.4.1 Semiconductor and IC Packaging Materials Sales Channels
8.4.2 Semiconductor and IC Packaging Materials Distributors
8.5 Semiconductor and IC Packaging Materials Customers
9 Semiconductor and IC Packaging Materials Market Dynamics
9.1 Semiconductor and IC Packaging Materials Industry Trends
9.2 Semiconductor and IC Packaging Materials Market Drivers
9.3 Semiconductor and IC Packaging Materials Market Challenges
9.4 Semiconductor and IC Packaging Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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