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Global Semiconductor Assembly and Packaging Services Market Research Report 2024
Synopsis
Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
The global Semiconductor Assembly and Packaging Services market was valued at US$ 6419.4 million in 2023 and is anticipated to reach US$ 8553.4 million by 2030, witnessing a CAGR of 4.1% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Packaging Services, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Packaging Services.
Report Scope
The Semiconductor Assembly and Packaging Services market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly and Packaging Services market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly and Packaging Services companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC
Segment by Type
Assembly Services
Packaging Services
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Assembly and Packaging Services companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
The global Semiconductor Assembly and Packaging Services market was valued at US$ 6419.4 million in 2023 and is anticipated to reach US$ 8553.4 million by 2030, witnessing a CAGR of 4.1% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Packaging Services, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Packaging Services.
Report Scope
The Semiconductor Assembly and Packaging Services market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly and Packaging Services market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly and Packaging Services companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC
Segment by Type
Assembly Services
Packaging Services
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Assembly and Packaging Services companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Assembly and Packaging Services Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Assembly Services
1.2.3 Packaging Services
1.3 Market by Application
1.3.1 Global Semiconductor Assembly and Packaging Services Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Assembly and Packaging Services Market Perspective (2019-2030)
2.2 Semiconductor Assembly and Packaging Services Growth Trends by Region
2.2.1 Global Semiconductor Assembly and Packaging Services Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Assembly and Packaging Services Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Assembly and Packaging Services Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Assembly and Packaging Services Market Dynamics
2.3.1 Semiconductor Assembly and Packaging Services Industry Trends
2.3.2 Semiconductor Assembly and Packaging Services Market Drivers
2.3.3 Semiconductor Assembly and Packaging Services Market Challenges
2.3.4 Semiconductor Assembly and Packaging Services Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Assembly and Packaging Services Players by Revenue
3.1.1 Global Top Semiconductor Assembly and Packaging Services Players by Revenue (2019-2024)
3.1.2 Global Semiconductor Assembly and Packaging Services Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Assembly and Packaging Services Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Semiconductor Assembly and Packaging Services Revenue
3.4 Global Semiconductor Assembly and Packaging Services Market Concentration Ratio
3.4.1 Global Semiconductor Assembly and Packaging Services Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Assembly and Packaging Services Revenue in 2023
3.5 Semiconductor Assembly and Packaging Services Key Players Head office and Area Served
3.6 Key Players Semiconductor Assembly and Packaging Services Product Solution and Service
3.7 Date of Enter into Semiconductor Assembly and Packaging Services Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Assembly and Packaging Services Breakdown Data by Type
4.1 Global Semiconductor Assembly and Packaging Services Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Assembly and Packaging Services Forecasted Market Size by Type (2025-2030)
5 Semiconductor Assembly and Packaging Services Breakdown Data by Application
5.1 Global Semiconductor Assembly and Packaging Services Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Assembly and Packaging Services Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Assembly and Packaging Services Market Size (2019-2030)
6.2 North America Semiconductor Assembly and Packaging Services Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor Assembly and Packaging Services Market Size by Country (2019-2024)
6.4 North America Semiconductor Assembly and Packaging Services Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor Assembly and Packaging Services Market Size (2019-2030)
7.2 Europe Semiconductor Assembly and Packaging Services Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor Assembly and Packaging Services Market Size by Country (2019-2024)
7.4 Europe Semiconductor Assembly and Packaging Services Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Assembly and Packaging Services Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor Assembly and Packaging Services Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor Assembly and Packaging Services Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor Assembly and Packaging Services Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor Assembly and Packaging Services Market Size (2019-2030)
9.2 Latin America Semiconductor Assembly and Packaging Services Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor Assembly and Packaging Services Market Size by Country (2019-2024)
9.4 Latin America Semiconductor Assembly and Packaging Services Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Assembly and Packaging Services Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor Assembly and Packaging Services Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor Assembly and Packaging Services Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor Assembly and Packaging Services Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Advanced Semiconductor Engineering (ASE)
11.1.1 Advanced Semiconductor Engineering (ASE) Company Detail
11.1.2 Advanced Semiconductor Engineering (ASE) Business Overview
11.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Assembly and Packaging Services Introduction
11.1.4 Advanced Semiconductor Engineering (ASE) Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.1.5 Advanced Semiconductor Engineering (ASE) Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Semiconductor Assembly and Packaging Services Introduction
11.2.4 Amkor Technology Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 Intel
11.3.1 Intel Company Detail
11.3.2 Intel Business Overview
11.3.3 Intel Semiconductor Assembly and Packaging Services Introduction
11.3.4 Intel Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.3.5 Intel Recent Development
11.4 Samsung Electronics
11.4.1 Samsung Electronics Company Detail
11.4.2 Samsung Electronics Business Overview
11.4.3 Samsung Electronics Semiconductor Assembly and Packaging Services Introduction
11.4.4 Samsung Electronics Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.4.5 Samsung Electronics Recent Development
11.5 SPIL
11.5.1 SPIL Company Detail
11.5.2 SPIL Business Overview
11.5.3 SPIL Semiconductor Assembly and Packaging Services Introduction
11.5.4 SPIL Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.5.5 SPIL Recent Development
11.6 TSMC
11.6.1 TSMC Company Detail
11.6.2 TSMC Business Overview
11.6.3 TSMC Semiconductor Assembly and Packaging Services Introduction
11.6.4 TSMC Revenue in Semiconductor Assembly and Packaging Services Business (2019-2024)
11.6.5 TSMC Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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