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Global Semiconductor Assembly & Packaging Equipment Market Research Report 2024
Synopsis
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The global Semiconductor Assembly & Packaging Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly & Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly & Packaging Equipment.
Report Scope
The Semiconductor Assembly & Packaging Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Unit) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly & Packaging Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly & Packaging Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Segment by Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Assembly & Packaging Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Assembly & Packaging Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Assembly & Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The global Semiconductor Assembly & Packaging Equipment market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly & Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly & Packaging Equipment.
Report Scope
The Semiconductor Assembly & Packaging Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Unit) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly & Packaging Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Assembly & Packaging Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Segment by Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Assembly & Packaging Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Assembly & Packaging Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Assembly & Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Semiconductor Assembly & Packaging Equipment Market Overview
1.1 Product Definition
1.2 Semiconductor Assembly & Packaging Equipment Segment by Type
1.2.1 Global Semiconductor Assembly & Packaging Equipment Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Die Bonders
1.2.3 Wire Bonders
1.2.4 Packaging Equipment
1.2.5 Others
1.3 Semiconductor Assembly & Packaging Equipment Segment by Application
1.3.1 Global Semiconductor Assembly & Packaging Equipment Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IDMs
1.3.3 OSAT
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Assembly & Packaging Equipment Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Assembly & Packaging Equipment Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Assembly & Packaging Equipment Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Assembly & Packaging Equipment Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Assembly & Packaging Equipment Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Assembly & Packaging Equipment, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Assembly & Packaging Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Assembly & Packaging Equipment Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Assembly & Packaging Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Assembly & Packaging Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Assembly & Packaging Equipment, Date of Enter into This Industry
2.9 Semiconductor Assembly & Packaging Equipment Market Competitive Situation and Trends
2.9.1 Semiconductor Assembly & Packaging Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Assembly & Packaging Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Assembly & Packaging Equipment Production by Region
3.1 Global Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Assembly & Packaging Equipment Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Assembly & Packaging Equipment Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Assembly & Packaging Equipment by Region (2025-2030)
3.3 Global Semiconductor Assembly & Packaging Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Assembly & Packaging Equipment Production by Region (2019-2030)
3.4.1 Global Semiconductor Assembly & Packaging Equipment Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Assembly & Packaging Equipment by Region (2025-2030)
3.5 Global Semiconductor Assembly & Packaging Equipment Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Assembly & Packaging Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Assembly & Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Assembly & Packaging Equipment Consumption by Region
4.1 Global Semiconductor Assembly & Packaging Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Assembly & Packaging Equipment Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Assembly & Packaging Equipment Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Assembly & Packaging Equipment Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Assembly & Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Assembly & Packaging Equipment Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Assembly & Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Assembly & Packaging Equipment Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Assembly & Packaging Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Assembly & Packaging Equipment Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Assembly & Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Assembly & Packaging Equipment Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Assembly & Packaging Equipment Production by Type (2019-2030)
5.1.1 Global Semiconductor Assembly & Packaging Equipment Production by Type (2019-2024)
5.1.2 Global Semiconductor Assembly & Packaging Equipment Production by Type (2025-2030)
5.1.3 Global Semiconductor Assembly & Packaging Equipment Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Assembly & Packaging Equipment Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Assembly & Packaging Equipment Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Assembly & Packaging Equipment Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Assembly & Packaging Equipment Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Assembly & Packaging Equipment Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Assembly & Packaging Equipment Production by Application (2019-2030)
6.1.1 Global Semiconductor Assembly & Packaging Equipment Production by Application (2019-2024)
6.1.2 Global Semiconductor Assembly & Packaging Equipment Production by Application (2025-2030)
6.1.3 Global Semiconductor Assembly & Packaging Equipment Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Assembly & Packaging Equipment Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Assembly & Packaging Equipment Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Assembly & Packaging Equipment Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Assembly & Packaging Equipment Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Assembly & Packaging Equipment Price by Application (2019-2030)
7 Key Companies Profiled
7.1 ASM Pacific Technology
7.1.1 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Corporation Information
7.1.2 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Product Portfolio
7.1.3 ASM Pacific Technology Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.1.4 ASM Pacific Technology Main Business and Markets Served
7.1.5 ASM Pacific Technology Recent Developments/Updates
7.2 Kulicke & Soffa Industries
7.2.1 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Corporation Information
7.2.2 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Product Portfolio
7.2.3 Kulicke & Soffa Industries Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Kulicke & Soffa Industries Main Business and Markets Served
7.2.5 Kulicke & Soffa Industries Recent Developments/Updates
7.3 Besi
7.3.1 Besi Semiconductor Assembly & Packaging Equipment Corporation Information
7.3.2 Besi Semiconductor Assembly & Packaging Equipment Product Portfolio
7.3.3 Besi Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Besi Main Business and Markets Served
7.3.5 Besi Recent Developments/Updates
7.4 Accrutech
7.4.1 Accrutech Semiconductor Assembly & Packaging Equipment Corporation Information
7.4.2 Accrutech Semiconductor Assembly & Packaging Equipment Product Portfolio
7.4.3 Accrutech Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Accrutech Main Business and Markets Served
7.4.5 Accrutech Recent Developments/Updates
7.5 Shinkawa
7.5.1 Shinkawa Semiconductor Assembly & Packaging Equipment Corporation Information
7.5.2 Shinkawa Semiconductor Assembly & Packaging Equipment Product Portfolio
7.5.3 Shinkawa Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shinkawa Main Business and Markets Served
7.5.5 Shinkawa Recent Developments/Updates
7.6 Palomar Technologies
7.6.1 Palomar Technologies Semiconductor Assembly & Packaging Equipment Corporation Information
7.6.2 Palomar Technologies Semiconductor Assembly & Packaging Equipment Product Portfolio
7.6.3 Palomar Technologies Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Palomar Technologies Main Business and Markets Served
7.6.5 Palomar Technologies Recent Developments/Updates
7.7 Hesse Mechatronics
7.7.1 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Corporation Information
7.7.2 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Product Portfolio
7.7.3 Hesse Mechatronics Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Hesse Mechatronics Main Business and Markets Served
7.7.5 Hesse Mechatronics Recent Developments/Updates
7.8 Toray Engineering
7.8.1 Toray Engineering Semiconductor Assembly & Packaging Equipment Corporation Information
7.8.2 Toray Engineering Semiconductor Assembly & Packaging Equipment Product Portfolio
7.8.3 Toray Engineering Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Toray Engineering Main Business and Markets Served
7.7.5 Toray Engineering Recent Developments/Updates
7.9 West Bond
7.9.1 West Bond Semiconductor Assembly & Packaging Equipment Corporation Information
7.9.2 West Bond Semiconductor Assembly & Packaging Equipment Product Portfolio
7.9.3 West Bond Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.9.4 West Bond Main Business and Markets Served
7.9.5 West Bond Recent Developments/Updates
7.10 HYBOND
7.10.1 HYBOND Semiconductor Assembly & Packaging Equipment Corporation Information
7.10.2 HYBOND Semiconductor Assembly & Packaging Equipment Product Portfolio
7.10.3 HYBOND Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.10.4 HYBOND Main Business and Markets Served
7.10.5 HYBOND Recent Developments/Updates
7.11 DIAS Automation
7.11.1 DIAS Automation Semiconductor Assembly & Packaging Equipment Corporation Information
7.11.2 DIAS Automation Semiconductor Assembly & Packaging Equipment Product Portfolio
7.11.3 DIAS Automation Semiconductor Assembly & Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.11.4 DIAS Automation Main Business and Markets Served
7.11.5 DIAS Automation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Assembly & Packaging Equipment Industry Chain Analysis
8.2 Semiconductor Assembly & Packaging Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Assembly & Packaging Equipment Production Mode & Process
8.4 Semiconductor Assembly & Packaging Equipment Sales and Marketing
8.4.1 Semiconductor Assembly & Packaging Equipment Sales Channels
8.4.2 Semiconductor Assembly & Packaging Equipment Distributors
8.5 Semiconductor Assembly & Packaging Equipment Customers
9 Semiconductor Assembly & Packaging Equipment Market Dynamics
9.1 Semiconductor Assembly & Packaging Equipment Industry Trends
9.2 Semiconductor Assembly & Packaging Equipment Market Drivers
9.3 Semiconductor Assembly & Packaging Equipment Market Challenges
9.4 Semiconductor Assembly & Packaging Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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