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Global Semiconductor Chip Packaging Market Research Report 2024
Synopsis
The global Semiconductor Chip Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Chip Packaging.
Report Scope
The Semiconductor Chip Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Chip Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Chip Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Chip Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Chip Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Semiconductor Chip Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Chip Packaging.
Report Scope
The Semiconductor Chip Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Chip Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
Segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Chip Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Chip Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Chip Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Semiconductor Chip Packaging Market Overview
1.1 Product Definition
1.2 Semiconductor Chip Packaging Segment by Type
1.2.1 Global Semiconductor Chip Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.3 Fan-In Wafer-Level Packaging (FI WLP)
1.2.4 Flip Chip (FC)
1.2.5 2.5D/3D
1.3 Semiconductor Chip Packaging Segment by Application
1.3.1 Global Semiconductor Chip Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.3.7 Other
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Chip Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Chip Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Chip Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Chip Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Chip Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Chip Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Chip Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Chip Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Chip Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Chip Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Chip Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Chip Packaging, Date of Enter into This Industry
2.9 Semiconductor Chip Packaging Market Competitive Situation and Trends
2.9.1 Semiconductor Chip Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Chip Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Chip Packaging Production by Region
3.1 Global Semiconductor Chip Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Chip Packaging Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Chip Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Chip Packaging by Region (2025-2030)
3.3 Global Semiconductor Chip Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Chip Packaging Production by Region (2019-2030)
3.4.1 Global Semiconductor Chip Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Chip Packaging by Region (2025-2030)
3.5 Global Semiconductor Chip Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Chip Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Chip Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Chip Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Chip Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Chip Packaging Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Chip Packaging Consumption by Region
4.1 Global Semiconductor Chip Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Chip Packaging Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Chip Packaging Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Chip Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Chip Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Chip Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Chip Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Chip Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Chip Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Chip Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Chip Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Chip Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Chip Packaging Production by Type (2019-2030)
5.1.1 Global Semiconductor Chip Packaging Production by Type (2019-2024)
5.1.2 Global Semiconductor Chip Packaging Production by Type (2025-2030)
5.1.3 Global Semiconductor Chip Packaging Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Chip Packaging Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Chip Packaging Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Chip Packaging Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Chip Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Chip Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Chip Packaging Production by Application (2019-2030)
6.1.1 Global Semiconductor Chip Packaging Production by Application (2019-2024)
6.1.2 Global Semiconductor Chip Packaging Production by Application (2025-2030)
6.1.3 Global Semiconductor Chip Packaging Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Chip Packaging Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Chip Packaging Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Chip Packaging Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Chip Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Chip Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Chip Packaging Corporation Information
7.1.2 Applied Materials Semiconductor Chip Packaging Product Portfolio
7.1.3 Applied Materials Semiconductor Chip Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Applied Materials Main Business and Markets Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 ASM Pacific Technology
7.2.1 ASM Pacific Technology Semiconductor Chip Packaging Corporation Information
7.2.2 ASM Pacific Technology Semiconductor Chip Packaging Product Portfolio
7.2.3 ASM Pacific Technology Semiconductor Chip Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 ASM Pacific Technology Main Business and Markets Served
7.2.5 ASM Pacific Technology Recent Developments/Updates
7.3 Kulicke & Soffa Industries
7.3.1 Kulicke & Soffa Industries Semiconductor Chip Packaging Corporation Information
7.3.2 Kulicke & Soffa Industries Semiconductor Chip Packaging Product Portfolio
7.3.3 Kulicke & Soffa Industries Semiconductor Chip Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Kulicke & Soffa Industries Main Business and Markets Served
7.3.5 Kulicke & Soffa Industries Recent Developments/Updates
7.4 TEL
7.4.1 TEL Semiconductor Chip Packaging Corporation Information
7.4.2 TEL Semiconductor Chip Packaging Product Portfolio
7.4.3 TEL Semiconductor Chip Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 TEL Main Business and Markets Served
7.4.5 TEL Recent Developments/Updates
7.5 Tokyo Seimitsu
7.5.1 Tokyo Seimitsu Semiconductor Chip Packaging Corporation Information
7.5.2 Tokyo Seimitsu Semiconductor Chip Packaging Product Portfolio
7.5.3 Tokyo Seimitsu Semiconductor Chip Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Tokyo Seimitsu Main Business and Markets Served
7.5.5 Tokyo Seimitsu Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Chip Packaging Industry Chain Analysis
8.2 Semiconductor Chip Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Chip Packaging Production Mode & Process
8.4 Semiconductor Chip Packaging Sales and Marketing
8.4.1 Semiconductor Chip Packaging Sales Channels
8.4.2 Semiconductor Chip Packaging Distributors
8.5 Semiconductor Chip Packaging Customers
9 Semiconductor Chip Packaging Market Dynamics
9.1 Semiconductor Chip Packaging Industry Trends
9.2 Semiconductor Chip Packaging Market Drivers
9.3 Semiconductor Chip Packaging Market Challenges
9.4 Semiconductor Chip Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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