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Global Semiconductor Dicing Die Bonding Tape Market Research Report 2024
Synopsis
Semiconductor dicing die bonding tape, also known as dicing tape or die attach tape, is a specialized adhesive tape used in the semiconductor manufacturing process. It plays a crucial role in wafer dicing and die bonding, which are essential steps in the production of semiconductor devices.
Global Semiconductor Dicing Die Bonding Tape market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Dicing Die Bonding Tape market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.69% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Dicing Die Bonding Tape market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Furukawa
Showa Denko
LINTEC Corporation
Nitto
AI Technology
KGK Chemical
LG Chem
Henkel Adhesives
Segment by Type
Non-Conductive Type
Conductive Type
Segment by Application
Die to Die
Die to Substrate
Film on Wire
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Dicing Die Bonding Tape report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Semiconductor dicing die bonding tape, also known as dicing tape or die attach tape, is a specialized adhesive tape used in the semiconductor manufacturing process. It plays a crucial role in wafer dicing and die bonding, which are essential steps in the production of semiconductor devices.
Global Semiconductor Dicing Die Bonding Tape market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Dicing Die Bonding Tape market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.69% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Dicing Die Bonding Tape market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Furukawa
Showa Denko
LINTEC Corporation
Nitto
AI Technology
KGK Chemical
LG Chem
Henkel Adhesives
Segment by Type
Non-Conductive Type
Conductive Type
Segment by Application
Die to Die
Die to Substrate
Film on Wire
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Dicing Die Bonding Tape report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Semiconductor Dicing Die Bonding Tape Market Overview
1.1 Product Definition
1.2 Semiconductor Dicing Die Bonding Tape Segment by Type
1.2.1 Global Semiconductor Dicing Die Bonding Tape Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Non-Conductive Type
1.2.3 Conductive Type
1.3 Semiconductor Dicing Die Bonding Tape Segment by Application
1.3.1 Global Semiconductor Dicing Die Bonding Tape Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Die to Die
1.3.3 Die to Substrate
1.3.4 Film on Wire
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Dicing Die Bonding Tape Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Dicing Die Bonding Tape Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Dicing Die Bonding Tape Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Dicing Die Bonding Tape Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Dicing Die Bonding Tape Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Dicing Die Bonding Tape, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Dicing Die Bonding Tape Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Dicing Die Bonding Tape Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Dicing Die Bonding Tape, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Dicing Die Bonding Tape, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Dicing Die Bonding Tape, Date of Enter into This Industry
2.9 Semiconductor Dicing Die Bonding Tape Market Competitive Situation and Trends
2.9.1 Semiconductor Dicing Die Bonding Tape Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Dicing Die Bonding Tape Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Dicing Die Bonding Tape Production by Region
3.1 Global Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Dicing Die Bonding Tape Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Dicing Die Bonding Tape Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Dicing Die Bonding Tape by Region (2024-2029)
3.3 Global Semiconductor Dicing Die Bonding Tape Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Dicing Die Bonding Tape Production by Region (2018-2029)
3.4.1 Global Semiconductor Dicing Die Bonding Tape Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Dicing Die Bonding Tape by Region (2024-2029)
3.5 Global Semiconductor Dicing Die Bonding Tape Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Dicing Die Bonding Tape Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Semiconductor Dicing Die Bonding Tape Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Dicing Die Bonding Tape Consumption by Region
4.1 Global Semiconductor Dicing Die Bonding Tape Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Dicing Die Bonding Tape Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Dicing Die Bonding Tape Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Dicing Die Bonding Tape Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Dicing Die Bonding Tape Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Dicing Die Bonding Tape Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Dicing Die Bonding Tape Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Dicing Die Bonding Tape Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Dicing Die Bonding Tape Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Dicing Die Bonding Tape Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Dicing Die Bonding Tape Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Dicing Die Bonding Tape Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Dicing Die Bonding Tape Production by Type (2018-2029)
5.1.1 Global Semiconductor Dicing Die Bonding Tape Production by Type (2018-2023)
5.1.2 Global Semiconductor Dicing Die Bonding Tape Production by Type (2024-2029)
5.1.3 Global Semiconductor Dicing Die Bonding Tape Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Dicing Die Bonding Tape Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Dicing Die Bonding Tape Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Dicing Die Bonding Tape Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Dicing Die Bonding Tape Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Dicing Die Bonding Tape Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Dicing Die Bonding Tape Production by Application (2018-2029)
6.1.1 Global Semiconductor Dicing Die Bonding Tape Production by Application (2018-2023)
6.1.2 Global Semiconductor Dicing Die Bonding Tape Production by Application (2024-2029)
6.1.3 Global Semiconductor Dicing Die Bonding Tape Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Dicing Die Bonding Tape Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Dicing Die Bonding Tape Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Dicing Die Bonding Tape Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Dicing Die Bonding Tape Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Dicing Die Bonding Tape Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Furukawa
7.1.1 Furukawa Semiconductor Dicing Die Bonding Tape Corporation Information
7.1.2 Furukawa Semiconductor Dicing Die Bonding Tape Product Portfolio
7.1.3 Furukawa Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Furukawa Main Business and Markets Served
7.1.5 Furukawa Recent Developments/Updates
7.2 Showa Denko
7.2.1 Showa Denko Semiconductor Dicing Die Bonding Tape Corporation Information
7.2.2 Showa Denko Semiconductor Dicing Die Bonding Tape Product Portfolio
7.2.3 Showa Denko Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Showa Denko Main Business and Markets Served
7.2.5 Showa Denko Recent Developments/Updates
7.3 LINTEC Corporation
7.3.1 LINTEC Corporation Semiconductor Dicing Die Bonding Tape Corporation Information
7.3.2 LINTEC Corporation Semiconductor Dicing Die Bonding Tape Product Portfolio
7.3.3 LINTEC Corporation Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.3.4 LINTEC Corporation Main Business and Markets Served
7.3.5 LINTEC Corporation Recent Developments/Updates
7.4 Nitto
7.4.1 Nitto Semiconductor Dicing Die Bonding Tape Corporation Information
7.4.2 Nitto Semiconductor Dicing Die Bonding Tape Product Portfolio
7.4.3 Nitto Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Nitto Main Business and Markets Served
7.4.5 Nitto Recent Developments/Updates
7.5 AI Technology
7.5.1 AI Technology Semiconductor Dicing Die Bonding Tape Corporation Information
7.5.2 AI Technology Semiconductor Dicing Die Bonding Tape Product Portfolio
7.5.3 AI Technology Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.5.4 AI Technology Main Business and Markets Served
7.5.5 AI Technology Recent Developments/Updates
7.6 KGK Chemical
7.6.1 KGK Chemical Semiconductor Dicing Die Bonding Tape Corporation Information
7.6.2 KGK Chemical Semiconductor Dicing Die Bonding Tape Product Portfolio
7.6.3 KGK Chemical Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.6.4 KGK Chemical Main Business and Markets Served
7.6.5 KGK Chemical Recent Developments/Updates
7.7 LG Chem
7.7.1 LG Chem Semiconductor Dicing Die Bonding Tape Corporation Information
7.7.2 LG Chem Semiconductor Dicing Die Bonding Tape Product Portfolio
7.7.3 LG Chem Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.7.4 LG Chem Main Business and Markets Served
7.7.5 LG Chem Recent Developments/Updates
7.8 Henkel Adhesives
7.8.1 Henkel Adhesives Semiconductor Dicing Die Bonding Tape Corporation Information
7.8.2 Henkel Adhesives Semiconductor Dicing Die Bonding Tape Product Portfolio
7.8.3 Henkel Adhesives Semiconductor Dicing Die Bonding Tape Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Henkel Adhesives Main Business and Markets Served
7.7.5 Henkel Adhesives Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Dicing Die Bonding Tape Industry Chain Analysis
8.2 Semiconductor Dicing Die Bonding Tape Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Dicing Die Bonding Tape Production Mode & Process
8.4 Semiconductor Dicing Die Bonding Tape Sales and Marketing
8.4.1 Semiconductor Dicing Die Bonding Tape Sales Channels
8.4.2 Semiconductor Dicing Die Bonding Tape Distributors
8.5 Semiconductor Dicing Die Bonding Tape Customers
9 Semiconductor Dicing Die Bonding Tape Market Dynamics
9.1 Semiconductor Dicing Die Bonding Tape Industry Trends
9.2 Semiconductor Dicing Die Bonding Tape Market Drivers
9.3 Semiconductor Dicing Die Bonding Tape Market Challenges
9.4 Semiconductor Dicing Die Bonding Tape Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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