The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global Semiconductor Dicing Saw Blade Market Research Report 2024
Synopsis
Semiconductor dicing saw blade is a specialized cutting tool used in the semiconductor manufacturing process to dice semiconductor wafers into individual chips or dies. Dicing is a critical step in semiconductor fabrication, where the wafer is cut into individual pieces, each containing a single integrated circuit (IC) or multiple ICs, depending on the design.
Global Semiconductor Dicing Saw Blade market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Dicing Saw Blade market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.117% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Dicing Saw Blade market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Disco Corporation
YMB
NDC International
UKAM Industrial
Thermocarbon
TOKYO SEIMITSU
ADT
Ceiba Technologies
Kinik Company
Kulicke & Soffa
Industrial Tools, Inc
Shanghai Sinyang
Segment by Type
Hub Dicing Blade
Hubless Dicing Blade
Segment by Application
200mm Wafer
300mm Wafer
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Dicing Saw Blade report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Semiconductor dicing saw blade is a specialized cutting tool used in the semiconductor manufacturing process to dice semiconductor wafers into individual chips or dies. Dicing is a critical step in semiconductor fabrication, where the wafer is cut into individual pieces, each containing a single integrated circuit (IC) or multiple ICs, depending on the design.
Global Semiconductor Dicing Saw Blade market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Dicing Saw Blade market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.117% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Dicing Saw Blade market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Disco Corporation
YMB
NDC International
UKAM Industrial
Thermocarbon
TOKYO SEIMITSU
ADT
Ceiba Technologies
Kinik Company
Kulicke & Soffa
Industrial Tools, Inc
Shanghai Sinyang
Segment by Type
Hub Dicing Blade
Hubless Dicing Blade
Segment by Application
200mm Wafer
300mm Wafer
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Dicing Saw Blade report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Semiconductor Dicing Saw Blade Market Overview
1.1 Product Definition
1.2 Semiconductor Dicing Saw Blade Segment by Type
1.2.1 Global Semiconductor Dicing Saw Blade Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hub Dicing Blade
1.2.3 Hubless Dicing Blade
1.3 Semiconductor Dicing Saw Blade Segment by Application
1.3.1 Global Semiconductor Dicing Saw Blade Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 200mm Wafer
1.3.3 300mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Dicing Saw Blade Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Dicing Saw Blade Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Dicing Saw Blade Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Dicing Saw Blade Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Dicing Saw Blade Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Dicing Saw Blade, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Dicing Saw Blade Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Dicing Saw Blade Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Date of Enter into This Industry
2.9 Semiconductor Dicing Saw Blade Market Competitive Situation and Trends
2.9.1 Semiconductor Dicing Saw Blade Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Dicing Saw Blade Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Dicing Saw Blade Production by Region
3.1 Global Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Dicing Saw Blade Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Dicing Saw Blade Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Dicing Saw Blade by Region (2024-2029)
3.3 Global Semiconductor Dicing Saw Blade Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Dicing Saw Blade Production by Region (2018-2029)
3.4.1 Global Semiconductor Dicing Saw Blade Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Dicing Saw Blade by Region (2024-2029)
3.5 Global Semiconductor Dicing Saw Blade Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Dicing Saw Blade Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Dicing Saw Blade Consumption by Region
4.1 Global Semiconductor Dicing Saw Blade Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Dicing Saw Blade Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Dicing Saw Blade Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Dicing Saw Blade Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Dicing Saw Blade Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Dicing Saw Blade Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Dicing Saw Blade Production by Type (2018-2029)
5.1.1 Global Semiconductor Dicing Saw Blade Production by Type (2018-2023)
5.1.2 Global Semiconductor Dicing Saw Blade Production by Type (2024-2029)
5.1.3 Global Semiconductor Dicing Saw Blade Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Dicing Saw Blade Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Dicing Saw Blade Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Dicing Saw Blade Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Dicing Saw Blade Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Dicing Saw Blade Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Dicing Saw Blade Production by Application (2018-2029)
6.1.1 Global Semiconductor Dicing Saw Blade Production by Application (2018-2023)
6.1.2 Global Semiconductor Dicing Saw Blade Production by Application (2024-2029)
6.1.3 Global Semiconductor Dicing Saw Blade Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Dicing Saw Blade Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Dicing Saw Blade Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Dicing Saw Blade Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Dicing Saw Blade Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Dicing Saw Blade Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Disco Corporation
7.1.1 Disco Corporation Semiconductor Dicing Saw Blade Corporation Information
7.1.2 Disco Corporation Semiconductor Dicing Saw Blade Product Portfolio
7.1.3 Disco Corporation Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Disco Corporation Main Business and Markets Served
7.1.5 Disco Corporation Recent Developments/Updates
7.2 YMB
7.2.1 YMB Semiconductor Dicing Saw Blade Corporation Information
7.2.2 YMB Semiconductor Dicing Saw Blade Product Portfolio
7.2.3 YMB Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.2.4 YMB Main Business and Markets Served
7.2.5 YMB Recent Developments/Updates
7.3 NDC International
7.3.1 NDC International Semiconductor Dicing Saw Blade Corporation Information
7.3.2 NDC International Semiconductor Dicing Saw Blade Product Portfolio
7.3.3 NDC International Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.3.4 NDC International Main Business and Markets Served
7.3.5 NDC International Recent Developments/Updates
7.4 UKAM Industrial
7.4.1 UKAM Industrial Semiconductor Dicing Saw Blade Corporation Information
7.4.2 UKAM Industrial Semiconductor Dicing Saw Blade Product Portfolio
7.4.3 UKAM Industrial Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.4.4 UKAM Industrial Main Business and Markets Served
7.4.5 UKAM Industrial Recent Developments/Updates
7.5 Thermocarbon
7.5.1 Thermocarbon Semiconductor Dicing Saw Blade Corporation Information
7.5.2 Thermocarbon Semiconductor Dicing Saw Blade Product Portfolio
7.5.3 Thermocarbon Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Thermocarbon Main Business and Markets Served
7.5.5 Thermocarbon Recent Developments/Updates
7.6 TOKYO SEIMITSU
7.6.1 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Corporation Information
7.6.2 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Product Portfolio
7.6.3 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.6.4 TOKYO SEIMITSU Main Business and Markets Served
7.6.5 TOKYO SEIMITSU Recent Developments/Updates
7.7 ADT
7.7.1 ADT Semiconductor Dicing Saw Blade Corporation Information
7.7.2 ADT Semiconductor Dicing Saw Blade Product Portfolio
7.7.3 ADT Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.7.4 ADT Main Business and Markets Served
7.7.5 ADT Recent Developments/Updates
7.8 Ceiba Technologies
7.8.1 Ceiba Technologies Semiconductor Dicing Saw Blade Corporation Information
7.8.2 Ceiba Technologies Semiconductor Dicing Saw Blade Product Portfolio
7.8.3 Ceiba Technologies Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ceiba Technologies Main Business and Markets Served
7.7.5 Ceiba Technologies Recent Developments/Updates
7.9 Kinik Company
7.9.1 Kinik Company Semiconductor Dicing Saw Blade Corporation Information
7.9.2 Kinik Company Semiconductor Dicing Saw Blade Product Portfolio
7.9.3 Kinik Company Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kinik Company Main Business and Markets Served
7.9.5 Kinik Company Recent Developments/Updates
7.10 Kulicke & Soffa
7.10.1 Kulicke & Soffa Semiconductor Dicing Saw Blade Corporation Information
7.10.2 Kulicke & Soffa Semiconductor Dicing Saw Blade Product Portfolio
7.10.3 Kulicke & Soffa Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kulicke & Soffa Main Business and Markets Served
7.10.5 Kulicke & Soffa Recent Developments/Updates
7.11 Industrial Tools, Inc
7.11.1 Industrial Tools, Inc Semiconductor Dicing Saw Blade Corporation Information
7.11.2 Industrial Tools, Inc Semiconductor Dicing Saw Blade Product Portfolio
7.11.3 Industrial Tools, Inc Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Industrial Tools, Inc Main Business and Markets Served
7.11.5 Industrial Tools, Inc Recent Developments/Updates
7.12 Shanghai Sinyang
7.12.1 Shanghai Sinyang Semiconductor Dicing Saw Blade Corporation Information
7.12.2 Shanghai Sinyang Semiconductor Dicing Saw Blade Product Portfolio
7.12.3 Shanghai Sinyang Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shanghai Sinyang Main Business and Markets Served
7.12.5 Shanghai Sinyang Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Dicing Saw Blade Industry Chain Analysis
8.2 Semiconductor Dicing Saw Blade Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Dicing Saw Blade Production Mode & Process
8.4 Semiconductor Dicing Saw Blade Sales and Marketing
8.4.1 Semiconductor Dicing Saw Blade Sales Channels
8.4.2 Semiconductor Dicing Saw Blade Distributors
8.5 Semiconductor Dicing Saw Blade Customers
9 Semiconductor Dicing Saw Blade Market Dynamics
9.1 Semiconductor Dicing Saw Blade Industry Trends
9.2 Semiconductor Dicing Saw Blade Market Drivers
9.3 Semiconductor Dicing Saw Blade Market Challenges
9.4 Semiconductor Dicing Saw Blade Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
