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Global Semiconductor Packaging and Test Service Market Research Report 2024
Synopsis
In this report, the Semiconductor Equipment Packaging and Test refers to the IC-packaging and test services.
The global Semiconductor Packaging and Test Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Test Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Test Service.
Report Scope
The Semiconductor Packaging and Test Service market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Packaging and Test Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging and Test Service companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
UTAC
ChipMos
Greatek
JCET
KYEC
Lingsen Precision
Tianshui Huatian (TSHT)
Segment by Type
Packaging Service
Test Service
Segment by Application
Communication
Computing
Consumer Electronics
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Packaging and Test Service companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
In this report, the Semiconductor Equipment Packaging and Test refers to the IC-packaging and test services.
The global Semiconductor Packaging and Test Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Test Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Test Service.
Report Scope
The Semiconductor Packaging and Test Service market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Packaging and Test Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging and Test Service companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
UTAC
ChipMos
Greatek
JCET
KYEC
Lingsen Precision
Tianshui Huatian (TSHT)
Segment by Type
Packaging Service
Test Service
Segment by Application
Communication
Computing
Consumer Electronics
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Packaging and Test Service companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor Packaging and Test Service Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Packaging Service
1.2.3 Test Service
1.3 Market by Application
1.3.1 Global Semiconductor Packaging and Test Service Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Communication
1.3.3 Computing
1.3.4 Consumer Electronics
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor Packaging and Test Service Market Perspective (2019-2030)
2.2 Semiconductor Packaging and Test Service Growth Trends by Region
2.2.1 Global Semiconductor Packaging and Test Service Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor Packaging and Test Service Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor Packaging and Test Service Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor Packaging and Test Service Market Dynamics
2.3.1 Semiconductor Packaging and Test Service Industry Trends
2.3.2 Semiconductor Packaging and Test Service Market Drivers
2.3.3 Semiconductor Packaging and Test Service Market Challenges
2.3.4 Semiconductor Packaging and Test Service Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Packaging and Test Service Players by Revenue
3.1.1 Global Top Semiconductor Packaging and Test Service Players by Revenue (2019-2024)
3.1.2 Global Semiconductor Packaging and Test Service Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor Packaging and Test Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Semiconductor Packaging and Test Service Revenue
3.4 Global Semiconductor Packaging and Test Service Market Concentration Ratio
3.4.1 Global Semiconductor Packaging and Test Service Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Packaging and Test Service Revenue in 2023
3.5 Semiconductor Packaging and Test Service Key Players Head office and Area Served
3.6 Key Players Semiconductor Packaging and Test Service Product Solution and Service
3.7 Date of Enter into Semiconductor Packaging and Test Service Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor Packaging and Test Service Breakdown Data by Type
4.1 Global Semiconductor Packaging and Test Service Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor Packaging and Test Service Forecasted Market Size by Type (2025-2030)
5 Semiconductor Packaging and Test Service Breakdown Data by Application
5.1 Global Semiconductor Packaging and Test Service Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor Packaging and Test Service Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor Packaging and Test Service Market Size (2019-2030)
6.2 North America Semiconductor Packaging and Test Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor Packaging and Test Service Market Size by Country (2019-2024)
6.4 North America Semiconductor Packaging and Test Service Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor Packaging and Test Service Market Size (2019-2030)
7.2 Europe Semiconductor Packaging and Test Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor Packaging and Test Service Market Size by Country (2019-2024)
7.4 Europe Semiconductor Packaging and Test Service Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Packaging and Test Service Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor Packaging and Test Service Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor Packaging and Test Service Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor Packaging and Test Service Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor Packaging and Test Service Market Size (2019-2030)
9.2 Latin America Semiconductor Packaging and Test Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor Packaging and Test Service Market Size by Country (2019-2024)
9.4 Latin America Semiconductor Packaging and Test Service Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Packaging and Test Service Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor Packaging and Test Service Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor Packaging and Test Service Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor Packaging and Test Service Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Detail
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology Semiconductor Packaging and Test Service Introduction
11.1.4 Amkor Technology Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.1.5 Amkor Technology Recent Development
11.2 ASE
11.2.1 ASE Company Detail
11.2.2 ASE Business Overview
11.2.3 ASE Semiconductor Packaging and Test Service Introduction
11.2.4 ASE Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.2.5 ASE Recent Development
11.3 Powertech Technology
11.3.1 Powertech Technology Company Detail
11.3.2 Powertech Technology Business Overview
11.3.3 Powertech Technology Semiconductor Packaging and Test Service Introduction
11.3.4 Powertech Technology Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.3.5 Powertech Technology Recent Development
11.4 Siliconware Precision Industries (SPIL)
11.4.1 Siliconware Precision Industries (SPIL) Company Detail
11.4.2 Siliconware Precision Industries (SPIL) Business Overview
11.4.3 Siliconware Precision Industries (SPIL) Semiconductor Packaging and Test Service Introduction
11.4.4 Siliconware Precision Industries (SPIL) Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.4.5 Siliconware Precision Industries (SPIL) Recent Development
11.5 UTAC
11.5.1 UTAC Company Detail
11.5.2 UTAC Business Overview
11.5.3 UTAC Semiconductor Packaging and Test Service Introduction
11.5.4 UTAC Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.5.5 UTAC Recent Development
11.6 ChipMos
11.6.1 ChipMos Company Detail
11.6.2 ChipMos Business Overview
11.6.3 ChipMos Semiconductor Packaging and Test Service Introduction
11.6.4 ChipMos Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.6.5 ChipMos Recent Development
11.7 Greatek
11.7.1 Greatek Company Detail
11.7.2 Greatek Business Overview
11.7.3 Greatek Semiconductor Packaging and Test Service Introduction
11.7.4 Greatek Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.7.5 Greatek Recent Development
11.8 JCET
11.8.1 JCET Company Detail
11.8.2 JCET Business Overview
11.8.3 JCET Semiconductor Packaging and Test Service Introduction
11.8.4 JCET Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.8.5 JCET Recent Development
11.9 KYEC
11.9.1 KYEC Company Detail
11.9.2 KYEC Business Overview
11.9.3 KYEC Semiconductor Packaging and Test Service Introduction
11.9.4 KYEC Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.9.5 KYEC Recent Development
11.10 Lingsen Precision
11.10.1 Lingsen Precision Company Detail
11.10.2 Lingsen Precision Business Overview
11.10.3 Lingsen Precision Semiconductor Packaging and Test Service Introduction
11.10.4 Lingsen Precision Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.10.5 Lingsen Precision Recent Development
11.11 Tianshui Huatian (TSHT)
11.11.1 Tianshui Huatian (TSHT) Company Detail
11.11.2 Tianshui Huatian (TSHT) Business Overview
11.11.3 Tianshui Huatian (TSHT) Semiconductor Packaging and Test Service Introduction
11.11.4 Tianshui Huatian (TSHT) Revenue in Semiconductor Packaging and Test Service Business (2019-2024)
11.11.5 Tianshui Huatian (TSHT) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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