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Global Solder Ball Packaging Material Market Research Report 2024
Synopsis
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Solder Ball Packaging Material market was valued at US$ 242.3 million in 2023 and is anticipated to reach US$ 346.5 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.
This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material.
Report Scope
The Solder Ball Packaging Material market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Ball Packaging Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Ball Packaging Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Production by Region
North America
Europe
China
Japan
Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Ball Packaging Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Ball Packaging Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Solder Ball Packaging Material market was valued at US$ 242.3 million in 2023 and is anticipated to reach US$ 346.5 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.
This report aims to provide a comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Ball Packaging Material.
Report Scope
The Solder Ball Packaging Material market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Ball Packaging Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Ball Packaging Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Production by Region
North America
Europe
China
Japan
Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Ball Packaging Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Ball Packaging Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Solder Ball Packaging Material Market Overview
1.1 Product Definition
1.2 Solder Ball Packaging Material Segment by Type
1.2.1 Global Solder Ball Packaging Material Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Lead Solder Ball
1.2.3 Lead Free Solder Ball
1.3 Solder Ball Packaging Material Segment by Application
1.3.1 Global Solder Ball Packaging Material Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 BGA
1.3.3 CSP & WLCSP
1.3.4 Flip-Chip & Others
1.4 Global Market Growth Prospects
1.4.1 Global Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Solder Ball Packaging Material Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Solder Ball Packaging Material Production Estimates and Forecasts (2019-2030)
1.4.4 Global Solder Ball Packaging Material Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Solder Ball Packaging Material Production Market Share by Manufacturers (2019-2024)
2.2 Global Solder Ball Packaging Material Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Solder Ball Packaging Material, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Solder Ball Packaging Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Solder Ball Packaging Material Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Solder Ball Packaging Material, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Solder Ball Packaging Material, Product Offered and Application
2.8 Global Key Manufacturers of Solder Ball Packaging Material, Date of Enter into This Industry
2.9 Solder Ball Packaging Material Market Competitive Situation and Trends
2.9.1 Solder Ball Packaging Material Market Concentration Rate
2.9.2 Global 5 and 10 Largest Solder Ball Packaging Material Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Solder Ball Packaging Material Production by Region
3.1 Global Solder Ball Packaging Material Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Solder Ball Packaging Material Production Value by Region (2019-2030)
3.2.1 Global Solder Ball Packaging Material Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Solder Ball Packaging Material by Region (2025-2030)
3.3 Global Solder Ball Packaging Material Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Solder Ball Packaging Material Production by Region (2019-2030)
3.4.1 Global Solder Ball Packaging Material Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Solder Ball Packaging Material by Region (2025-2030)
3.5 Global Solder Ball Packaging Material Market Price Analysis by Region (2019-2024)
3.6 Global Solder Ball Packaging Material Production and Value, Year-over-Year Growth
3.6.1 North America Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
3.6.5 Korea Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Solder Ball Packaging Material Production Value Estimates and Forecasts (2019-2030)
4 Solder Ball Packaging Material Consumption by Region
4.1 Global Solder Ball Packaging Material Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Solder Ball Packaging Material Consumption by Region (2019-2030)
4.2.1 Global Solder Ball Packaging Material Consumption by Region (2019-2024)
4.2.2 Global Solder Ball Packaging Material Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Solder Ball Packaging Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Solder Ball Packaging Material Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Solder Ball Packaging Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Solder Ball Packaging Material Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Solder Ball Packaging Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Solder Ball Packaging Material Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Solder Ball Packaging Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Solder Ball Packaging Material Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Solder Ball Packaging Material Production by Type (2019-2030)
5.1.1 Global Solder Ball Packaging Material Production by Type (2019-2024)
5.1.2 Global Solder Ball Packaging Material Production by Type (2025-2030)
5.1.3 Global Solder Ball Packaging Material Production Market Share by Type (2019-2030)
5.2 Global Solder Ball Packaging Material Production Value by Type (2019-2030)
5.2.1 Global Solder Ball Packaging Material Production Value by Type (2019-2024)
5.2.2 Global Solder Ball Packaging Material Production Value by Type (2025-2030)
5.2.3 Global Solder Ball Packaging Material Production Value Market Share by Type (2019-2030)
5.3 Global Solder Ball Packaging Material Price by Type (2019-2030)
6 Segment by Application
6.1 Global Solder Ball Packaging Material Production by Application (2019-2030)
6.1.1 Global Solder Ball Packaging Material Production by Application (2019-2024)
6.1.2 Global Solder Ball Packaging Material Production by Application (2025-2030)
6.1.3 Global Solder Ball Packaging Material Production Market Share by Application (2019-2030)
6.2 Global Solder Ball Packaging Material Production Value by Application (2019-2030)
6.2.1 Global Solder Ball Packaging Material Production Value by Application (2019-2024)
6.2.2 Global Solder Ball Packaging Material Production Value by Application (2025-2030)
6.2.3 Global Solder Ball Packaging Material Production Value Market Share by Application (2019-2030)
6.3 Global Solder Ball Packaging Material Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal Solder Ball Packaging Material Corporation Information
7.1.2 Senju Metal Solder Ball Packaging Material Product Portfolio
7.1.3 Senju Metal Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 DS HiMetal
7.2.1 DS HiMetal Solder Ball Packaging Material Corporation Information
7.2.2 DS HiMetal Solder Ball Packaging Material Product Portfolio
7.2.3 DS HiMetal Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DS HiMetal Main Business and Markets Served
7.2.5 DS HiMetal Recent Developments/Updates
7.3 MKE
7.3.1 MKE Solder Ball Packaging Material Corporation Information
7.3.2 MKE Solder Ball Packaging Material Product Portfolio
7.3.3 MKE Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.3.4 MKE Main Business and Markets Served
7.3.5 MKE Recent Developments/Updates
7.4 YCTC
7.4.1 YCTC Solder Ball Packaging Material Corporation Information
7.4.2 YCTC Solder Ball Packaging Material Product Portfolio
7.4.3 YCTC Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.4.4 YCTC Main Business and Markets Served
7.4.5 YCTC Recent Developments/Updates
7.5 Nippon Micrometal
7.5.1 Nippon Micrometal Solder Ball Packaging Material Corporation Information
7.5.2 Nippon Micrometal Solder Ball Packaging Material Product Portfolio
7.5.3 Nippon Micrometal Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Nippon Micrometal Main Business and Markets Served
7.5.5 Nippon Micrometal Recent Developments/Updates
7.6 Accurus
7.6.1 Accurus Solder Ball Packaging Material Corporation Information
7.6.2 Accurus Solder Ball Packaging Material Product Portfolio
7.6.3 Accurus Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Accurus Main Business and Markets Served
7.6.5 Accurus Recent Developments/Updates
7.7 PMTC
7.7.1 PMTC Solder Ball Packaging Material Corporation Information
7.7.2 PMTC Solder Ball Packaging Material Product Portfolio
7.7.3 PMTC Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.7.4 PMTC Main Business and Markets Served
7.7.5 PMTC Recent Developments/Updates
7.8 Shanghai hiking solder material
7.8.1 Shanghai hiking solder material Solder Ball Packaging Material Corporation Information
7.8.2 Shanghai hiking solder material Solder Ball Packaging Material Product Portfolio
7.8.3 Shanghai hiking solder material Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shanghai hiking solder material Main Business and Markets Served
7.7.5 Shanghai hiking solder material Recent Developments/Updates
7.9 Shenmao Technology
7.9.1 Shenmao Technology Solder Ball Packaging Material Corporation Information
7.9.2 Shenmao Technology Solder Ball Packaging Material Product Portfolio
7.9.3 Shenmao Technology Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shenmao Technology Main Business and Markets Served
7.9.5 Shenmao Technology Recent Developments/Updates
7.10 Indium Corporation
7.10.1 Indium Corporation Solder Ball Packaging Material Corporation Information
7.10.2 Indium Corporation Solder Ball Packaging Material Product Portfolio
7.10.3 Indium Corporation Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Indium Corporation Main Business and Markets Served
7.10.5 Indium Corporation Recent Developments/Updates
7.11 Jovy Systems
7.11.1 Jovy Systems Solder Ball Packaging Material Corporation Information
7.11.2 Jovy Systems Solder Ball Packaging Material Product Portfolio
7.11.3 Jovy Systems Solder Ball Packaging Material Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Jovy Systems Main Business and Markets Served
7.11.5 Jovy Systems Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Solder Ball Packaging Material Industry Chain Analysis
8.2 Solder Ball Packaging Material Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Solder Ball Packaging Material Production Mode & Process
8.4 Solder Ball Packaging Material Sales and Marketing
8.4.1 Solder Ball Packaging Material Sales Channels
8.4.2 Solder Ball Packaging Material Distributors
8.5 Solder Ball Packaging Material Customers
9 Solder Ball Packaging Material Market Dynamics
9.1 Solder Ball Packaging Material Industry Trends
9.2 Solder Ball Packaging Material Market Drivers
9.3 Solder Ball Packaging Material Market Challenges
9.4 Solder Ball Packaging Material Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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