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Global Solder Bumping Flip Chip Market Research Report 2024
Synopsis
The global Solder Bumping Flip Chip market was valued at US$ 12090 million in 2023 and is anticipated to reach US$ 18790 million by 2030, witnessing a CAGR of 6.6% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Solder Bumping Flip Chip, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Bumping Flip Chip.
Report Scope
The Solder Bumping Flip Chip market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Bumping Flip Chip market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Bumping Flip Chip manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Segment by Type
3D IC
2.5D IC
2D IC
Segment by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Bumping Flip Chip manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Bumping Flip Chip by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Bumping Flip Chip in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Solder Bumping Flip Chip market was valued at US$ 12090 million in 2023 and is anticipated to reach US$ 18790 million by 2030, witnessing a CAGR of 6.6% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Solder Bumping Flip Chip, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Bumping Flip Chip.
Report Scope
The Solder Bumping Flip Chip market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Bumping Flip Chip market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Bumping Flip Chip manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Segment by Type
3D IC
2.5D IC
2D IC
Segment by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Bumping Flip Chip manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Bumping Flip Chip by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Bumping Flip Chip in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Solder Bumping Flip Chip Market Overview
1.1 Product Definition
1.2 Solder Bumping Flip Chip Segment by Type
1.2.1 Global Solder Bumping Flip Chip Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 3D IC
1.2.3 2.5D IC
1.2.4 2D IC
1.3 Solder Bumping Flip Chip Segment by Application
1.3.1 Global Solder Bumping Flip Chip Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Electronics
1.3.3 Industrial
1.3.4 Automotive & Transport
1.3.5 Healthcare
1.3.6 IT & Telecommunication
1.3.7 Aerospace and Defense
1.3.8 Others
1.4 Global Market Growth Prospects
1.4.1 Global Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Solder Bumping Flip Chip Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Solder Bumping Flip Chip Production Estimates and Forecasts (2019-2030)
1.4.4 Global Solder Bumping Flip Chip Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Solder Bumping Flip Chip Production Market Share by Manufacturers (2019-2024)
2.2 Global Solder Bumping Flip Chip Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Solder Bumping Flip Chip, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Solder Bumping Flip Chip Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Solder Bumping Flip Chip Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Solder Bumping Flip Chip, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Solder Bumping Flip Chip, Product Offered and Application
2.8 Global Key Manufacturers of Solder Bumping Flip Chip, Date of Enter into This Industry
2.9 Solder Bumping Flip Chip Market Competitive Situation and Trends
2.9.1 Solder Bumping Flip Chip Market Concentration Rate
2.9.2 Global 5 and 10 Largest Solder Bumping Flip Chip Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Solder Bumping Flip Chip Production by Region
3.1 Global Solder Bumping Flip Chip Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Solder Bumping Flip Chip Production Value by Region (2019-2030)
3.2.1 Global Solder Bumping Flip Chip Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Solder Bumping Flip Chip by Region (2025-2030)
3.3 Global Solder Bumping Flip Chip Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Solder Bumping Flip Chip Production by Region (2019-2030)
3.4.1 Global Solder Bumping Flip Chip Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Solder Bumping Flip Chip by Region (2025-2030)
3.5 Global Solder Bumping Flip Chip Market Price Analysis by Region (2019-2024)
3.6 Global Solder Bumping Flip Chip Production and Value, Year-over-Year Growth
3.6.1 North America Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Solder Bumping Flip Chip Production Value Estimates and Forecasts (2019-2030)
4 Solder Bumping Flip Chip Consumption by Region
4.1 Global Solder Bumping Flip Chip Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Solder Bumping Flip Chip Consumption by Region (2019-2030)
4.2.1 Global Solder Bumping Flip Chip Consumption by Region (2019-2024)
4.2.2 Global Solder Bumping Flip Chip Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Solder Bumping Flip Chip Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Solder Bumping Flip Chip Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Solder Bumping Flip Chip Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Solder Bumping Flip Chip Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Solder Bumping Flip Chip Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Solder Bumping Flip Chip Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Solder Bumping Flip Chip Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Solder Bumping Flip Chip Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Solder Bumping Flip Chip Production by Type (2019-2030)
5.1.1 Global Solder Bumping Flip Chip Production by Type (2019-2024)
5.1.2 Global Solder Bumping Flip Chip Production by Type (2025-2030)
5.1.3 Global Solder Bumping Flip Chip Production Market Share by Type (2019-2030)
5.2 Global Solder Bumping Flip Chip Production Value by Type (2019-2030)
5.2.1 Global Solder Bumping Flip Chip Production Value by Type (2019-2024)
5.2.2 Global Solder Bumping Flip Chip Production Value by Type (2025-2030)
5.2.3 Global Solder Bumping Flip Chip Production Value Market Share by Type (2019-2030)
5.3 Global Solder Bumping Flip Chip Price by Type (2019-2030)
6 Segment by Application
6.1 Global Solder Bumping Flip Chip Production by Application (2019-2030)
6.1.1 Global Solder Bumping Flip Chip Production by Application (2019-2024)
6.1.2 Global Solder Bumping Flip Chip Production by Application (2025-2030)
6.1.3 Global Solder Bumping Flip Chip Production Market Share by Application (2019-2030)
6.2 Global Solder Bumping Flip Chip Production Value by Application (2019-2030)
6.2.1 Global Solder Bumping Flip Chip Production Value by Application (2019-2024)
6.2.2 Global Solder Bumping Flip Chip Production Value by Application (2025-2030)
6.2.3 Global Solder Bumping Flip Chip Production Value Market Share by Application (2019-2030)
6.3 Global Solder Bumping Flip Chip Price by Application (2019-2030)
7 Key Companies Profiled
7.1 TSMC (Taiwan)
7.1.1 TSMC (Taiwan) Solder Bumping Flip Chip Corporation Information
7.1.2 TSMC (Taiwan) Solder Bumping Flip Chip Product Portfolio
7.1.3 TSMC (Taiwan) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.1.4 TSMC (Taiwan) Main Business and Markets Served
7.1.5 TSMC (Taiwan) Recent Developments/Updates
7.2 Samsung (South Korea)
7.2.1 Samsung (South Korea) Solder Bumping Flip Chip Corporation Information
7.2.2 Samsung (South Korea) Solder Bumping Flip Chip Product Portfolio
7.2.3 Samsung (South Korea) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samsung (South Korea) Main Business and Markets Served
7.2.5 Samsung (South Korea) Recent Developments/Updates
7.3 ASE Group (Taiwan)
7.3.1 ASE Group (Taiwan) Solder Bumping Flip Chip Corporation Information
7.3.2 ASE Group (Taiwan) Solder Bumping Flip Chip Product Portfolio
7.3.3 ASE Group (Taiwan) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.3.4 ASE Group (Taiwan) Main Business and Markets Served
7.3.5 ASE Group (Taiwan) Recent Developments/Updates
7.4 Amkor Technology (US)
7.4.1 Amkor Technology (US) Solder Bumping Flip Chip Corporation Information
7.4.2 Amkor Technology (US) Solder Bumping Flip Chip Product Portfolio
7.4.3 Amkor Technology (US) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Amkor Technology (US) Main Business and Markets Served
7.4.5 Amkor Technology (US) Recent Developments/Updates
7.5 UMC (Taiwan)
7.5.1 UMC (Taiwan) Solder Bumping Flip Chip Corporation Information
7.5.2 UMC (Taiwan) Solder Bumping Flip Chip Product Portfolio
7.5.3 UMC (Taiwan) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.5.4 UMC (Taiwan) Main Business and Markets Served
7.5.5 UMC (Taiwan) Recent Developments/Updates
7.6 STATS ChipPAC (Singapore)
7.6.1 STATS ChipPAC (Singapore) Solder Bumping Flip Chip Corporation Information
7.6.2 STATS ChipPAC (Singapore) Solder Bumping Flip Chip Product Portfolio
7.6.3 STATS ChipPAC (Singapore) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.6.4 STATS ChipPAC (Singapore) Main Business and Markets Served
7.6.5 STATS ChipPAC (Singapore) Recent Developments/Updates
7.7 Powertech Technology (Taiwan)
7.7.1 Powertech Technology (Taiwan) Solder Bumping Flip Chip Corporation Information
7.7.2 Powertech Technology (Taiwan) Solder Bumping Flip Chip Product Portfolio
7.7.3 Powertech Technology (Taiwan) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Powertech Technology (Taiwan) Main Business and Markets Served
7.7.5 Powertech Technology (Taiwan) Recent Developments/Updates
7.8 STMicroelectronics (Switzerland)
7.8.1 STMicroelectronics (Switzerland) Solder Bumping Flip Chip Corporation Information
7.8.2 STMicroelectronics (Switzerland) Solder Bumping Flip Chip Product Portfolio
7.8.3 STMicroelectronics (Switzerland) Solder Bumping Flip Chip Production, Value, Price and Gross Margin (2019-2024)
7.8.4 STMicroelectronics (Switzerland) Main Business and Markets Served
7.7.5 STMicroelectronics (Switzerland) Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Solder Bumping Flip Chip Industry Chain Analysis
8.2 Solder Bumping Flip Chip Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Solder Bumping Flip Chip Production Mode & Process
8.4 Solder Bumping Flip Chip Sales and Marketing
8.4.1 Solder Bumping Flip Chip Sales Channels
8.4.2 Solder Bumping Flip Chip Distributors
8.5 Solder Bumping Flip Chip Customers
9 Solder Bumping Flip Chip Market Dynamics
9.1 Solder Bumping Flip Chip Industry Trends
9.2 Solder Bumping Flip Chip Market Drivers
9.3 Solder Bumping Flip Chip Market Challenges
9.4 Solder Bumping Flip Chip Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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