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Global Solder Bumps Market Research Report 2024
Synopsis
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "bumps" or "balls" made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Those "bumps", which can be composed from eutectic, lead free, high lead materials, or Cu pillar on wafer are the fundamental interconnect components that will interconnect the die and the substrate together into a single package. These bumps not only provide a connected path between die and substrate, but also play an important role in the electrical, mechanical and thermal performance in the flip chip package.
Flip chip assembly package has traditionally been used for high-end niche applications. Recent technology development has adopted this process to be widely used in today's consumer electronics applications. For the performance driven market, flip chip interconnection reduces signal propagation delay, provide much better bandwidth, and relieves the constraints of power and ground distribution. For the form factor driven market, such as mobile applications, replacing wire bonding by flip chip interconnects reduces the size and weight of the package.
The global Solder Bumps market was valued at US$ 228.3 million in 2023 and is anticipated to reach US$ 344.2 million by 2030, witnessing a CAGR of 6.0% during the forecast period 2024-2030.
North American market for Solder Bumps is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Solder Bumps is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Solder Bumps include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Solder Bumps, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Bumps.
Report Scope
The Solder Bumps market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Bumps market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Bumps manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Segment by Type
Lead Solder Bumps
Lead Free Solder Bumps
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Bumps manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Bumps by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Bumps in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "bumps" or "balls" made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Those "bumps", which can be composed from eutectic, lead free, high lead materials, or Cu pillar on wafer are the fundamental interconnect components that will interconnect the die and the substrate together into a single package. These bumps not only provide a connected path between die and substrate, but also play an important role in the electrical, mechanical and thermal performance in the flip chip package.
Flip chip assembly package has traditionally been used for high-end niche applications. Recent technology development has adopted this process to be widely used in today's consumer electronics applications. For the performance driven market, flip chip interconnection reduces signal propagation delay, provide much better bandwidth, and relieves the constraints of power and ground distribution. For the form factor driven market, such as mobile applications, replacing wire bonding by flip chip interconnects reduces the size and weight of the package.
The global Solder Bumps market was valued at US$ 228.3 million in 2023 and is anticipated to reach US$ 344.2 million by 2030, witnessing a CAGR of 6.0% during the forecast period 2024-2030.
North American market for Solder Bumps is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Solder Bumps is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Solder Bumps include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Solder Bumps, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Bumps.
Report Scope
The Solder Bumps market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Solder Bumps market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Solder Bumps manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Segment by Type
Lead Solder Bumps
Lead Free Solder Bumps
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Solder Bumps manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Solder Bumps by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Solder Bumps in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Solder Bumps Market Overview
1.1 Product Definition
1.2 Solder Bumps Segment by Type
1.2.1 Global Solder Bumps Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Lead Solder Bumps
1.2.3 Lead Free Solder Bumps
1.3 Solder Bumps Segment by Application
1.3.1 Global Solder Bumps Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 BGA
1.3.3 CSP & WLCSP
1.3.4 Flip-Chip & Others
1.4 Global Market Growth Prospects
1.4.1 Global Solder Bumps Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Solder Bumps Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Solder Bumps Production Estimates and Forecasts (2019-2030)
1.4.4 Global Solder Bumps Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Solder Bumps Production Market Share by Manufacturers (2019-2024)
2.2 Global Solder Bumps Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Solder Bumps, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Solder Bumps Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Solder Bumps Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Solder Bumps, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Solder Bumps, Product Offered and Application
2.8 Global Key Manufacturers of Solder Bumps, Date of Enter into This Industry
2.9 Solder Bumps Market Competitive Situation and Trends
2.9.1 Solder Bumps Market Concentration Rate
2.9.2 Global 5 and 10 Largest Solder Bumps Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Solder Bumps Production by Region
3.1 Global Solder Bumps Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Solder Bumps Production Value by Region (2019-2030)
3.2.1 Global Solder Bumps Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Solder Bumps by Region (2025-2030)
3.3 Global Solder Bumps Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Solder Bumps Production by Region (2019-2030)
3.4.1 Global Solder Bumps Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Solder Bumps by Region (2025-2030)
3.5 Global Solder Bumps Market Price Analysis by Region (2019-2024)
3.6 Global Solder Bumps Production and Value, Year-over-Year Growth
3.6.1 North America Solder Bumps Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Solder Bumps Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Solder Bumps Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Solder Bumps Production Value Estimates and Forecasts (2019-2030)
4 Solder Bumps Consumption by Region
4.1 Global Solder Bumps Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Solder Bumps Consumption by Region (2019-2030)
4.2.1 Global Solder Bumps Consumption by Region (2019-2024)
4.2.2 Global Solder Bumps Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Solder Bumps Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Solder Bumps Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Solder Bumps Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Solder Bumps Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Solder Bumps Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Solder Bumps Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Solder Bumps Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Solder Bumps Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Solder Bumps Production by Type (2019-2030)
5.1.1 Global Solder Bumps Production by Type (2019-2024)
5.1.2 Global Solder Bumps Production by Type (2025-2030)
5.1.3 Global Solder Bumps Production Market Share by Type (2019-2030)
5.2 Global Solder Bumps Production Value by Type (2019-2030)
5.2.1 Global Solder Bumps Production Value by Type (2019-2024)
5.2.2 Global Solder Bumps Production Value by Type (2025-2030)
5.2.3 Global Solder Bumps Production Value Market Share by Type (2019-2030)
5.3 Global Solder Bumps Price by Type (2019-2030)
6 Segment by Application
6.1 Global Solder Bumps Production by Application (2019-2030)
6.1.1 Global Solder Bumps Production by Application (2019-2024)
6.1.2 Global Solder Bumps Production by Application (2025-2030)
6.1.3 Global Solder Bumps Production Market Share by Application (2019-2030)
6.2 Global Solder Bumps Production Value by Application (2019-2030)
6.2.1 Global Solder Bumps Production Value by Application (2019-2024)
6.2.2 Global Solder Bumps Production Value by Application (2025-2030)
6.2.3 Global Solder Bumps Production Value Market Share by Application (2019-2030)
6.3 Global Solder Bumps Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal Solder Bumps Corporation Information
7.1.2 Senju Metal Solder Bumps Product Portfolio
7.1.3 Senju Metal Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 DS HiMetal
7.2.1 DS HiMetal Solder Bumps Corporation Information
7.2.2 DS HiMetal Solder Bumps Product Portfolio
7.2.3 DS HiMetal Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DS HiMetal Main Business and Markets Served
7.2.5 DS HiMetal Recent Developments/Updates
7.3 MKE
7.3.1 MKE Solder Bumps Corporation Information
7.3.2 MKE Solder Bumps Product Portfolio
7.3.3 MKE Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.3.4 MKE Main Business and Markets Served
7.3.5 MKE Recent Developments/Updates
7.4 YCTC
7.4.1 YCTC Solder Bumps Corporation Information
7.4.2 YCTC Solder Bumps Product Portfolio
7.4.3 YCTC Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.4.4 YCTC Main Business and Markets Served
7.4.5 YCTC Recent Developments/Updates
7.5 Accurus
7.5.1 Accurus Solder Bumps Corporation Information
7.5.2 Accurus Solder Bumps Product Portfolio
7.5.3 Accurus Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Accurus Main Business and Markets Served
7.5.5 Accurus Recent Developments/Updates
7.6 PMTC
7.6.1 PMTC Solder Bumps Corporation Information
7.6.2 PMTC Solder Bumps Product Portfolio
7.6.3 PMTC Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.6.4 PMTC Main Business and Markets Served
7.6.5 PMTC Recent Developments/Updates
7.7 Shanghai hiking solder material
7.7.1 Shanghai hiking solder material Solder Bumps Corporation Information
7.7.2 Shanghai hiking solder material Solder Bumps Product Portfolio
7.7.3 Shanghai hiking solder material Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Shanghai hiking solder material Main Business and Markets Served
7.7.5 Shanghai hiking solder material Recent Developments/Updates
7.8 Shenmao Technology
7.8.1 Shenmao Technology Solder Bumps Corporation Information
7.8.2 Shenmao Technology Solder Bumps Product Portfolio
7.8.3 Shenmao Technology Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shenmao Technology Main Business and Markets Served
7.7.5 Shenmao Technology Recent Developments/Updates
7.9 Nippon Micrometal
7.9.1 Nippon Micrometal Solder Bumps Corporation Information
7.9.2 Nippon Micrometal Solder Bumps Product Portfolio
7.9.3 Nippon Micrometal Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Nippon Micrometal Main Business and Markets Served
7.9.5 Nippon Micrometal Recent Developments/Updates
7.10 Indium Corporation
7.10.1 Indium Corporation Solder Bumps Corporation Information
7.10.2 Indium Corporation Solder Bumps Product Portfolio
7.10.3 Indium Corporation Solder Bumps Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Indium Corporation Main Business and Markets Served
7.10.5 Indium Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Solder Bumps Industry Chain Analysis
8.2 Solder Bumps Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Solder Bumps Production Mode & Process
8.4 Solder Bumps Sales and Marketing
8.4.1 Solder Bumps Sales Channels
8.4.2 Solder Bumps Distributors
8.5 Solder Bumps Customers
9 Solder Bumps Market Dynamics
9.1 Solder Bumps Industry Trends
9.2 Solder Bumps Market Drivers
9.3 Solder Bumps Market Challenges
9.4 Solder Bumps Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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