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Global Temporary Wafer Bonding Materials Market Research Report 2024
Synopsis
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers
Global Temporary Wafer Bonding Materials market is projected to reach US$ 1936.2 million in 2029, increasing from US$ 1264 million in 2022, with the CAGR of 6.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Temporary Wafer Bonding Materials market research.
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Temporary Wafer Bonding Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Brewer Science
Samcien Semiconductor Materials
Sekisui Chemical
3M
HD MicroSystems (DuPont)
Dow
Henkel
Nissan Chemical
TOKYO OHKA KOGYO
AI Technology
Segment by Type
Thermoplastic Materials
UV Curing Materials
Composite Films
Metallic Materials
Others
Segment by Application
Wafer-level Packaging
MEMS
Compound Semiconductor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Temporary Wafer Bonding Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Temporary Wafer Bonding Materials provide rigid support for ultra-thin wafers during the backside process, enabling them to complete the complex back-end processing of ultra-thin wafers
Global Temporary Wafer Bonding Materials market is projected to reach US$ 1936.2 million in 2029, increasing from US$ 1264 million in 2022, with the CAGR of 6.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Temporary Wafer Bonding Materials market research.
The market for temporary wafer bonding materials has been growing steadily in recent years. Temporary wafer bonding is a process used in semiconductor manufacturing and advanced packaging technologies. It involves bonding a device wafer to a carrier wafer using a temporary bonding material. This bonding enables subsequent processing steps such as thinning, 3D integration, and back-end processing.
The demand for temporary wafer bonding materials has been driven by several factors, including:
Advanced Packaging Technologies: Temporary wafer bonding materials play a crucial role in advanced packaging technologies such as 3D integration, stacked die packaging, and system-in-package (SiP) solutions. These technologies require temporary bonding to enable the fabrication of multiple layers or the integration of diverse components into a single package.
Wafer Thinning: Temporary bonding materials are essential for thinning the device wafer to achieve desired thicknesses in processes like wafer thinning for backside illumination (BSI) image sensors or through-silicon via (TSV) fabrication for 3D integration.
Yield Improvement: Temporary wafer bonding helps protect delicate or fragile wafers during processing, reducing the risk of damage and improving yield in the manufacturing process.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Temporary Wafer Bonding Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Brewer Science
Samcien Semiconductor Materials
Sekisui Chemical
3M
HD MicroSystems (DuPont)
Dow
Henkel
Nissan Chemical
TOKYO OHKA KOGYO
AI Technology
Segment by Type
Thermoplastic Materials
UV Curing Materials
Composite Films
Metallic Materials
Others
Segment by Application
Wafer-level Packaging
MEMS
Compound Semiconductor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Temporary Wafer Bonding Materials report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Temporary Wafer Bonding Materials Market Overview
1.1 Product Definition
1.2 Temporary Wafer Bonding Materials Segment by Type
1.2.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Thermoplastic Materials
1.2.3 UV Curing Materials
1.2.4 Composite Films
1.2.5 Metallic Materials
1.2.6 Others
1.3 Temporary Wafer Bonding Materials Segment by Application
1.3.1 Global Temporary Wafer Bonding Materials Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Wafer-level Packaging
1.3.3 MEMS
1.3.4 Compound Semiconductor
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Temporary Wafer Bonding Materials Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts (2018-2029)
1.4.4 Global Temporary Wafer Bonding Materials Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Temporary Wafer Bonding Materials Production Market Share by Manufacturers (2018-2023)
2.2 Global Temporary Wafer Bonding Materials Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Temporary Wafer Bonding Materials, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Temporary Wafer Bonding Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Temporary Wafer Bonding Materials Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Temporary Wafer Bonding Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Temporary Wafer Bonding Materials, Product Offered and Application
2.8 Global Key Manufacturers of Temporary Wafer Bonding Materials, Date of Enter into This Industry
2.9 Temporary Wafer Bonding Materials Market Competitive Situation and Trends
2.9.1 Temporary Wafer Bonding Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Temporary Wafer Bonding Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Temporary Wafer Bonding Materials Production by Region
3.1 Global Temporary Wafer Bonding Materials Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Temporary Wafer Bonding Materials Production Value by Region (2018-2029)
3.2.1 Global Temporary Wafer Bonding Materials Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Temporary Wafer Bonding Materials by Region (2024-2029)
3.3 Global Temporary Wafer Bonding Materials Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Temporary Wafer Bonding Materials Production by Region (2018-2029)
3.4.1 Global Temporary Wafer Bonding Materials Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Temporary Wafer Bonding Materials by Region (2024-2029)
3.5 Global Temporary Wafer Bonding Materials Market Price Analysis by Region (2018-2023)
3.6 Global Temporary Wafer Bonding Materials Production and Value, Year-over-Year Growth
3.6.1 North America Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Temporary Wafer Bonding Materials Production Value Estimates and Forecasts (2018-2029)
4 Temporary Wafer Bonding Materials Consumption by Region
4.1 Global Temporary Wafer Bonding Materials Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Temporary Wafer Bonding Materials Consumption by Region (2018-2029)
4.2.1 Global Temporary Wafer Bonding Materials Consumption by Region (2018-2023)
4.2.2 Global Temporary Wafer Bonding Materials Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Temporary Wafer Bonding Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Temporary Wafer Bonding Materials Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Temporary Wafer Bonding Materials Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Temporary Wafer Bonding Materials Production by Type (2018-2029)
5.1.1 Global Temporary Wafer Bonding Materials Production by Type (2018-2023)
5.1.2 Global Temporary Wafer Bonding Materials Production by Type (2024-2029)
5.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Type (2018-2029)
5.2 Global Temporary Wafer Bonding Materials Production Value by Type (2018-2029)
5.2.1 Global Temporary Wafer Bonding Materials Production Value by Type (2018-2023)
5.2.2 Global Temporary Wafer Bonding Materials Production Value by Type (2024-2029)
5.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Type (2018-2029)
5.3 Global Temporary Wafer Bonding Materials Price by Type (2018-2029)
6 Segment by Application
6.1 Global Temporary Wafer Bonding Materials Production by Application (2018-2029)
6.1.1 Global Temporary Wafer Bonding Materials Production by Application (2018-2023)
6.1.2 Global Temporary Wafer Bonding Materials Production by Application (2024-2029)
6.1.3 Global Temporary Wafer Bonding Materials Production Market Share by Application (2018-2029)
6.2 Global Temporary Wafer Bonding Materials Production Value by Application (2018-2029)
6.2.1 Global Temporary Wafer Bonding Materials Production Value by Application (2018-2023)
6.2.2 Global Temporary Wafer Bonding Materials Production Value by Application (2024-2029)
6.2.3 Global Temporary Wafer Bonding Materials Production Value Market Share by Application (2018-2029)
6.3 Global Temporary Wafer Bonding Materials Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Brewer Science
7.1.1 Brewer Science Temporary Wafer Bonding Materials Corporation Information
7.1.2 Brewer Science Temporary Wafer Bonding Materials Product Portfolio
7.1.3 Brewer Science Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Brewer Science Main Business and Markets Served
7.1.5 Brewer Science Recent Developments/Updates
7.2 Samcien Semiconductor Materials
7.2.1 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Corporation Information
7.2.2 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product Portfolio
7.2.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Samcien Semiconductor Materials Main Business and Markets Served
7.2.5 Samcien Semiconductor Materials Recent Developments/Updates
7.3 Sekisui Chemical
7.3.1 Sekisui Chemical Temporary Wafer Bonding Materials Corporation Information
7.3.2 Sekisui Chemical Temporary Wafer Bonding Materials Product Portfolio
7.3.3 Sekisui Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Sekisui Chemical Main Business and Markets Served
7.3.5 Sekisui Chemical Recent Developments/Updates
7.4 3M
7.4.1 3M Temporary Wafer Bonding Materials Corporation Information
7.4.2 3M Temporary Wafer Bonding Materials Product Portfolio
7.4.3 3M Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.4.4 3M Main Business and Markets Served
7.4.5 3M Recent Developments/Updates
7.5 HD MicroSystems (DuPont)
7.5.1 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Corporation Information
7.5.2 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Product Portfolio
7.5.3 HD MicroSystems (DuPont) Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.5.4 HD MicroSystems (DuPont) Main Business and Markets Served
7.5.5 HD MicroSystems (DuPont) Recent Developments/Updates
7.6 Dow
7.6.1 Dow Temporary Wafer Bonding Materials Corporation Information
7.6.2 Dow Temporary Wafer Bonding Materials Product Portfolio
7.6.3 Dow Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Dow Main Business and Markets Served
7.6.5 Dow Recent Developments/Updates
7.7 Henkel
7.7.1 Henkel Temporary Wafer Bonding Materials Corporation Information
7.7.2 Henkel Temporary Wafer Bonding Materials Product Portfolio
7.7.3 Henkel Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Henkel Main Business and Markets Served
7.7.5 Henkel Recent Developments/Updates
7.8 Nissan Chemical
7.8.1 Nissan Chemical Temporary Wafer Bonding Materials Corporation Information
7.8.2 Nissan Chemical Temporary Wafer Bonding Materials Product Portfolio
7.8.3 Nissan Chemical Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Nissan Chemical Main Business and Markets Served
7.7.5 Nissan Chemical Recent Developments/Updates
7.9 TOKYO OHKA KOGYO
7.9.1 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Corporation Information
7.9.2 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Product Portfolio
7.9.3 TOKYO OHKA KOGYO Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.9.4 TOKYO OHKA KOGYO Main Business and Markets Served
7.9.5 TOKYO OHKA KOGYO Recent Developments/Updates
7.10 AI Technology
7.10.1 AI Technology Temporary Wafer Bonding Materials Corporation Information
7.10.2 AI Technology Temporary Wafer Bonding Materials Product Portfolio
7.10.3 AI Technology Temporary Wafer Bonding Materials Production, Value, Price and Gross Margin (2018-2023)
7.10.4 AI Technology Main Business and Markets Served
7.10.5 AI Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Temporary Wafer Bonding Materials Industry Chain Analysis
8.2 Temporary Wafer Bonding Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Temporary Wafer Bonding Materials Production Mode & Process
8.4 Temporary Wafer Bonding Materials Sales and Marketing
8.4.1 Temporary Wafer Bonding Materials Sales Channels
8.4.2 Temporary Wafer Bonding Materials Distributors
8.5 Temporary Wafer Bonding Materials Customers
9 Temporary Wafer Bonding Materials Market Dynamics
9.1 Temporary Wafer Bonding Materials Industry Trends
9.2 Temporary Wafer Bonding Materials Market Drivers
9.3 Temporary Wafer Bonding Materials Market Challenges
9.4 Temporary Wafer Bonding Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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