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Global Through-Silicon Vias (TSVs) Market Research Report 2025
Synopsis
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
The global Through-Silicon Vias (TSVs) market was valued at US$ 1796.1 million in 2023 and is anticipated to reach US$ 7682.8 million by 2030, witnessing a CAGR of 22.8% during the forecast period 2024-2030.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.
Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.
This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs).
Report Scope
The Through-Silicon Vias (TSVs) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Through-Silicon Vias (TSVs) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Through-Silicon Vias (TSVs) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology
Segment by Type
2.5D Through-Silicon Vias
3D Through-Silicon Vias
Segment by Application
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Through-Silicon Vias (TSVs) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
The global Through-Silicon Vias (TSVs) market was valued at US$ 1796.1 million in 2023 and is anticipated to reach US$ 7682.8 million by 2030, witnessing a CAGR of 22.8% during the forecast period 2024-2030.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.
Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.
This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs).
Report Scope
The Through-Silicon Vias (TSVs) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Through-Silicon Vias (TSVs) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Through-Silicon Vias (TSVs) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology
Segment by Type
2.5D Through-Silicon Vias
3D Through-Silicon Vias
Segment by Application
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Through-Silicon Vias (TSVs) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 2.5D Through-Silicon Vias
1.2.3 3D Through-Silicon Vias
1.3 Market by Application
1.3.1 Global Through-Silicon Vias (TSVs) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Mobile And Consumer Electronics
1.3.3 Communication Equipment
1.3.4 Automotive And Transportation Electronics
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Through-Silicon Vias (TSVs) Market Perspective (2019-2030)
2.2 Through-Silicon Vias (TSVs) Growth Trends by Region
2.2.1 Global Through-Silicon Vias (TSVs) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Through-Silicon Vias (TSVs) Historic Market Size by Region (2019-2024)
2.2.3 Through-Silicon Vias (TSVs) Forecasted Market Size by Region (2025-2030)
2.3 Through-Silicon Vias (TSVs) Market Dynamics
2.3.1 Through-Silicon Vias (TSVs) Industry Trends
2.3.2 Through-Silicon Vias (TSVs) Market Drivers
2.3.3 Through-Silicon Vias (TSVs) Market Challenges
2.3.4 Through-Silicon Vias (TSVs) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Through-Silicon Vias (TSVs) Players by Revenue
3.1.1 Global Top Through-Silicon Vias (TSVs) Players by Revenue (2019-2024)
3.1.2 Global Through-Silicon Vias (TSVs) Revenue Market Share by Players (2019-2024)
3.2 Global Through-Silicon Vias (TSVs) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Through-Silicon Vias (TSVs) Revenue
3.4 Global Through-Silicon Vias (TSVs) Market Concentration Ratio
3.4.1 Global Through-Silicon Vias (TSVs) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Through-Silicon Vias (TSVs) Revenue in 2023
3.5 Through-Silicon Vias (TSVs) Key Players Head office and Area Served
3.6 Key Players Through-Silicon Vias (TSVs) Product Solution and Service
3.7 Date of Enter into Through-Silicon Vias (TSVs) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Through-Silicon Vias (TSVs) Breakdown Data by Type
4.1 Global Through-Silicon Vias (TSVs) Historic Market Size by Type (2019-2024)
4.2 Global Through-Silicon Vias (TSVs) Forecasted Market Size by Type (2025-2030)
5 Through-Silicon Vias (TSVs) Breakdown Data by Application
5.1 Global Through-Silicon Vias (TSVs) Historic Market Size by Application (2019-2024)
5.2 Global Through-Silicon Vias (TSVs) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Through-Silicon Vias (TSVs) Market Size (2019-2030)
6.2 North America Through-Silicon Vias (TSVs) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Through-Silicon Vias (TSVs) Market Size by Country (2019-2024)
6.4 North America Through-Silicon Vias (TSVs) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Through-Silicon Vias (TSVs) Market Size (2019-2030)
7.2 Europe Through-Silicon Vias (TSVs) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Through-Silicon Vias (TSVs) Market Size by Country (2019-2024)
7.4 Europe Through-Silicon Vias (TSVs) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Through-Silicon Vias (TSVs) Market Size (2019-2030)
8.2 Asia-Pacific Through-Silicon Vias (TSVs) Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Through-Silicon Vias (TSVs) Market Size by Region (2019-2024)
8.4 Asia-Pacific Through-Silicon Vias (TSVs) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Through-Silicon Vias (TSVs) Market Size (2019-2030)
9.2 Latin America Through-Silicon Vias (TSVs) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Through-Silicon Vias (TSVs) Market Size by Country (2019-2024)
9.4 Latin America Through-Silicon Vias (TSVs) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Through-Silicon Vias (TSVs) Market Size (2019-2030)
10.2 Middle East & Africa Through-Silicon Vias (TSVs) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Through-Silicon Vias (TSVs) Market Size by Country (2019-2024)
10.4 Middle East & Africa Through-Silicon Vias (TSVs) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology Holding
11.1.1 ASE Technology Holding Company Detail
11.1.2 ASE Technology Holding Business Overview
11.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Introduction
11.1.4 ASE Technology Holding Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.1.5 ASE Technology Holding Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Through-Silicon Vias (TSVs) Introduction
11.2.4 Amkor Technology Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 Taiwan Semiconductor Manufacturing Company Limited
11.3.1 Taiwan Semiconductor Manufacturing Company Limited Company Detail
11.3.2 Taiwan Semiconductor Manufacturing Company Limited Business Overview
11.3.3 Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Introduction
11.3.4 Taiwan Semiconductor Manufacturing Company Limited Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.3.5 Taiwan Semiconductor Manufacturing Company Limited Recent Development
11.4 Intel Corporation
11.4.1 Intel Corporation Company Detail
11.4.2 Intel Corporation Business Overview
11.4.3 Intel Corporation Through-Silicon Vias (TSVs) Introduction
11.4.4 Intel Corporation Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.4.5 Intel Corporation Recent Development
11.5 GLOBALFOUNDRIES
11.5.1 GLOBALFOUNDRIES Company Detail
11.5.2 GLOBALFOUNDRIES Business Overview
11.5.3 GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Introduction
11.5.4 GLOBALFOUNDRIES Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.5.5 GLOBALFOUNDRIES Recent Development
11.6 JCET Group
11.6.1 JCET Group Company Detail
11.6.2 JCET Group Business Overview
11.6.3 JCET Group Through-Silicon Vias (TSVs) Introduction
11.6.4 JCET Group Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.6.5 JCET Group Recent Development
11.7 Samsung
11.7.1 Samsung Company Detail
11.7.2 Samsung Business Overview
11.7.3 Samsung Through-Silicon Vias (TSVs) Introduction
11.7.4 Samsung Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.7.5 Samsung Recent Development
11.8 Tianshui Huatian Technology
11.8.1 Tianshui Huatian Technology Company Detail
11.8.2 Tianshui Huatian Technology Business Overview
11.8.3 Tianshui Huatian Technology Through-Silicon Vias (TSVs) Introduction
11.8.4 Tianshui Huatian Technology Revenue in Through-Silicon Vias (TSVs) Business (2019-2024)
11.8.5 Tianshui Huatian Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of TablesList of Tables
Table 1. Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of 2.5D Through-Silicon Vias
Table 3. Key Players of 3D Through-Silicon Vias
Table 4. Global Through-Silicon Vias (TSVs) Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 5. Global Through-Silicon Vias (TSVs) Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 6. Global Through-Silicon Vias (TSVs) Market Size by Region (2019-2024) & (US$ Million)
Table 7. Global Through-Silicon Vias (TSVs) Market Share by Region (2019-2024)
Table 8. Global Through-Silicon Vias (TSVs) Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 9. Global Through-Silicon Vias (TSVs) Market Share by Region (2025-2030)
Table 10. Through-Silicon Vias (TSVs) Market Trends
Table 11. Through-Silicon Vias (TSVs) Market Drivers
Table 12. Through-Silicon Vias (TSVs) Market Challenges
Table 13. Through-Silicon Vias (TSVs) Market Restraints
Table 14. Global Through-Silicon Vias (TSVs) Revenue by Players (2019-2024) & (US$ Million)
Table 15. Global Through-Silicon Vias (TSVs) Market Share by Players (2019-2024)
Table 16. Global Top Through-Silicon Vias (TSVs) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through-Silicon Vias (TSVs) as of 2023)
Table 17. Ranking of Global Top Through-Silicon Vias (TSVs) Companies by Revenue (US$ Million) in 2023
Table 18. Global 5 Largest Players Market Share by Through-Silicon Vias (TSVs) Revenue (CR5 and HHI) & (2019-2024)
Table 19. Key Players Headquarters and Area Served
Table 20. Key Players Through-Silicon Vias (TSVs) Product Solution and Service
Table 21. Date of Enter into Through-Silicon Vias (TSVs) Market
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. Global Through-Silicon Vias (TSVs) Market Size by Type (2019-2024) & (US$ Million)
Table 24. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2019-2024)
Table 25. Global Through-Silicon Vias (TSVs) Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 26. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2025-2030)
Table 27. Global Through-Silicon Vias (TSVs) Market Size by Application (2019-2024) & (US$ Million)
Table 28. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2019-2024)
Table 29. Global Through-Silicon Vias (TSVs) Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 30. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2025-2030)
Table 31. North America Through-Silicon Vias (TSVs) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 32. North America Through-Silicon Vias (TSVs) Market Size by Country (2019-2024) & (US$ Million)
Table 33. North America Through-Silicon Vias (TSVs) Market Size by Country (2025-2030) & (US$ Million)
Table 34. Europe Through-Silicon Vias (TSVs) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 35. Europe Through-Silicon Vias (TSVs) Market Size by Country (2019-2024) & (US$ Million)
Table 36. Europe Through-Silicon Vias (TSVs) Market Size by Country (2025-2030) & (US$ Million)
Table 37. Asia-Pacific Through-Silicon Vias (TSVs) Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
Table 38. Asia-Pacific Through-Silicon Vias (TSVs) Market Size by Region (2019-2024) & (US$ Million)
Table 39. Asia-Pacific Through-Silicon Vias (TSVs) Market Size by Region (2025-2030) & (US$ Million)
Table 40. Latin America Through-Silicon Vias (TSVs) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 41. Latin America Through-Silicon Vias (TSVs) Market Size by Country (2019-2024) & (US$ Million)
Table 42. Latin America Through-Silicon Vias (TSVs) Market Size by Country (2025-2030) & (US$ Million)
Table 43. Middle East & Africa Through-Silicon Vias (TSVs) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 44. Middle East & Africa Through-Silicon Vias (TSVs) Market Size by Country (2019-2024) & (US$ Million)
Table 45. Middle East & Africa Through-Silicon Vias (TSVs) Market Size by Country (2025-2030) & (US$ Million)
Table 46. ASE Technology Holding Company Detail
Table 47. ASE Technology Holding Business Overview
Table 48. ASE Technology Holding Through-Silicon Vias (TSVs) Product
Table 49. ASE Technology Holding Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 50. ASE Technology Holding Recent Development
Table 51. Amkor Technology Company Detail
Table 52. Amkor Technology Business Overview
Table 53. Amkor Technology Through-Silicon Vias (TSVs) Product
Table 54. Amkor Technology Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 55. Amkor Technology Recent Development
Table 56. Taiwan Semiconductor Manufacturing Company Limited Company Detail
Table 57. Taiwan Semiconductor Manufacturing Company Limited Business Overview
Table 58. Taiwan Semiconductor Manufacturing Company Limited Through-Silicon Vias (TSVs) Product
Table 59. Taiwan Semiconductor Manufacturing Company Limited Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 60. Taiwan Semiconductor Manufacturing Company Limited Recent Development
Table 61. Intel Corporation Company Detail
Table 62. Intel Corporation Business Overview
Table 63. Intel Corporation Through-Silicon Vias (TSVs) Product
Table 64. Intel Corporation Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 65. Intel Corporation Recent Development
Table 66. GLOBALFOUNDRIES Company Detail
Table 67. GLOBALFOUNDRIES Business Overview
Table 68. GLOBALFOUNDRIES Through-Silicon Vias (TSVs) Product
Table 69. GLOBALFOUNDRIES Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 70. GLOBALFOUNDRIES Recent Development
Table 71. JCET Group Company Detail
Table 72. JCET Group Business Overview
Table 73. JCET Group Through-Silicon Vias (TSVs) Product
Table 74. JCET Group Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 75. JCET Group Recent Development
Table 76. Samsung Company Detail
Table 77. Samsung Business Overview
Table 78. Samsung Through-Silicon Vias (TSVs) Product
Table 79. Samsung Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 80. Samsung Recent Development
Table 81. Tianshui Huatian Technology Company Detail
Table 82. Tianshui Huatian Technology Business Overview
Table 83. Tianshui Huatian Technology Through-Silicon Vias (TSVs) Product
Table 84. Tianshui Huatian Technology Revenue in Through-Silicon Vias (TSVs) Business (2019-2024) & (US$ Million)
Table 85. Tianshui Huatian Technology Recent Development
Table 86. Research Programs/Design for This Report
Table 87. Key Data Information from Secondary Sources
Table 88. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Through-Silicon Vias (TSVs) Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 2. Global Through-Silicon Vias (TSVs) Market Share by Type: 2023 VS 2030
Figure 3. 2.5D Through-Silicon Vias Features
Figure 4. 3D Through-Silicon Vias Features
Figure 5. Global Through-Silicon Vias (TSVs) Market Size Comparison by Application (2024-2030) & (US$ Million)
Figure 6. Global Through-Silicon Vias (TSVs) Market Share by Application: 2023 VS 2030
Figure 7. Mobile And Consumer Electronics Case Studies
Figure 8. Communication Equipment Case Studies
Figure 9. Automotive And Transportation Electronics Case Studies
Figure 10. Through-Silicon Vias (TSVs) Report Years Considered
Figure 11. Global Through-Silicon Vias (TSVs) Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 12. Global Through-Silicon Vias (TSVs) Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 13. Global Through-Silicon Vias (TSVs) Market Share by Region: 2023 VS 2030
Figure 14. Global Through-Silicon Vias (TSVs) Market Share by Players in 2023
Figure 15. Global Top Through-Silicon Vias (TSVs) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through-Silicon Vias (TSVs) as of 2023)
Figure 16. The Top 10 and 5 Players Market Share by Through-Silicon Vias (TSVs) Revenue in 2023
Figure 17. North America Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 18. North America Through-Silicon Vias (TSVs) Market Share by Country (2019-2030)
Figure 19. United States Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 20. Canada Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 21. Europe Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 22. Europe Through-Silicon Vias (TSVs) Market Share by Country (2019-2030)
Figure 23. Germany Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 24. France Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 25. U.K. Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. Italy Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 27. Russia Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Nordic Countries Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Asia-Pacific Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Asia-Pacific Through-Silicon Vias (TSVs) Market Share by Region (2019-2030)
Figure 31. China Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 32. Japan Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. South Korea Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. Southeast Asia Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. India Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. Australia Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Latin America Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Latin America Through-Silicon Vias (TSVs) Market Share by Country (2019-2030)
Figure 39. Mexico Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 40. Brazil Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. Middle East & Africa Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Middle East & Africa Through-Silicon Vias (TSVs) Market Share by Country (2019-2030)
Figure 43. Turkey Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 44. Saudi Arabia Through-Silicon Vias (TSVs) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. ASE Technology Holding Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 46. Amkor Technology Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 47. Taiwan Semiconductor Manufacturing Company Limited Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 48. Intel Corporation Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 49. GLOBALFOUNDRIES Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 50. JCET Group Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 51. Samsung Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 52. Tianshui Huatian Technology Revenue Growth Rate in Through-Silicon Vias (TSVs) Business (2019-2024)
Figure 53. Bottom-up and Top-down Approaches for This Report
Figure 54. Data Triangulation
Figure 55. Key Executives Interviewed
Published By : QY Research
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