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Global Wafer Backgrinding Tape and Dicing Tapes Market Research Report 2025
Synopsis
Wafer backgrinding tape and dicing tapes are specialized adhesive tapes used in the semiconductor industry for various stages of wafer processing. These tapes play crucial roles in the fabrication of integrated circuits (ICs) by providing temporary bonding, protection, and support during wafer thinning, dicing, and handling processes.
The global Wafer Backgrinding Tape and Dicing Tapes market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Wafer Backgrinding Tape and Dicing Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, LG Chem, Maxell, D&X, AI Technology, Suzhou Boyan Jingjin Photoelectric, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Wafer Backgrinding Tape and Dicing Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Backgrinding Tape and Dicing Tapes.
The Wafer Backgrinding Tape and Dicing Tapes market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Backgrinding Tape and Dicing Tapes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Backgrinding Tape and Dicing Tapes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
by Type
Backgrinding Tape
Dicing Tape
by Application
Front-End Process
Back-End Process
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Backgrinding Tape and Dicing Tapes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Sales, revenue of Wafer Backgrinding Tape and Dicing Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 8: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 9: The main points and conclusions of the report.
Wafer backgrinding tape and dicing tapes are specialized adhesive tapes used in the semiconductor industry for various stages of wafer processing. These tapes play crucial roles in the fabrication of integrated circuits (ICs) by providing temporary bonding, protection, and support during wafer thinning, dicing, and handling processes.
The global Wafer Backgrinding Tape and Dicing Tapes market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Wafer Backgrinding Tape and Dicing Tapes is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Wafer Backgrinding Tape and Dicing Tapes include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, LG Chem, Maxell, D&X, AI Technology, Suzhou Boyan Jingjin Photoelectric, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Wafer Backgrinding Tape and Dicing Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Backgrinding Tape and Dicing Tapes.
The Wafer Backgrinding Tape and Dicing Tapes market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Backgrinding Tape and Dicing Tapes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Backgrinding Tape and Dicing Tapes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
by Type
Backgrinding Tape
Dicing Tape
by Application
Front-End Process
Back-End Process
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Backgrinding Tape and Dicing Tapes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Sales, revenue of Wafer Backgrinding Tape and Dicing Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 8: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 9: The main points and conclusions of the report.
Index1 Wafer Backgrinding Tape and Dicing Tapes Market Overview
1.1 Product Definition
1.2 Wafer Backgrinding Tape and Dicing Tapes by Type
1.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Value Comparison by Type (2024-2030)
1.2.2 Backgrinding Tape
1.2.3 Dicing Tape
1.3 Wafer Backgrinding Tape and Dicing Tapes by Application
1.3.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Application (2024-2030)
1.3.2 Front-End Process
1.3.3 Back-End Process
1.4 Global Wafer Backgrinding Tape and Dicing Tapes Market Size Estimates and Forecasts
1.4.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue 2019-2030
1.4.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales 2019-2030
1.4.3 Global Wafer Backgrinding Tape and Dicing Tapes Market Average Price (2019-2030)
1.5 Assumptions and Limitations
2 Wafer Backgrinding Tape and Dicing Tapes Market Competition by Manufacturers
2.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Manufacturers (2019-2024)
2.3 Global Wafer Backgrinding Tape and Dicing Tapes Average Price by Manufacturers (2019-2024)
2.4 Global Key Players of Wafer Backgrinding Tape and Dicing Tapes, Industry Ranking, 2022 VS 2023 VS 2024
2.5 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Manufacturing Sites & Headquarters
2.6 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Product Type & Application
2.7 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Date of Enter into This Industry
2.8 Global Wafer Backgrinding Tape and Dicing Tapes Market Competitive Situation and Trends
2.8.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Concentration Rate
2.8.2 The Global 5 and 10 Largest Wafer Backgrinding Tape and Dicing Tapes Players Market Share by Revenue
2.8.3 Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.9 Manufacturers Mergers & Acquisitions, Expansion Plans
3 Global Wafer Backgrinding Tape and Dicing Tapes Market Scenario by Region
3.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Size by Region: 2019 Versus 2023 Versus 2030
3.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2019-2030
3.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2019-2024
3.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region: 2025-2030
3.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2019-2030
3.3.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2019-2024
3.3.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2025-2030
3.4 North America Wafer Backgrinding Tape and Dicing Tapes Market Facts & Figures by Country
3.4.1 North America Wafer Backgrinding Tape and Dicing Tapes Market Size by Country: 2019 VS 2023 VS 2030
3.4.2 North America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.4.3 North America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2030)
3.4.4 United States
3.4.5 Canada
3.5 Europe Wafer Backgrinding Tape and Dicing Tapes Market Facts & Figures by Country
3.5.1 Europe Wafer Backgrinding Tape and Dicing Tapes Market Size by Country: 2019 VS 2023 VS 2030
3.5.2 Europe Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.5.3 Europe Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2030)
3.5.4 Germany
3.5.5 France
3.5.6 U.K.
3.5.7 Italy
3.5.8 Russia
3.6 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Market Facts & Figures by Region
3.6.1 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Market Size by Region: 2019 VS 2023 VS 2030
3.6.2 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2019-2030)
3.6.3 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2019-2030)
3.6.4 China
3.6.5 Japan
3.6.6 South Korea
3.6.7 India
3.6.8 Australia
3.6.9 China Taiwan
3.6.10 Southeast Asia
3.7 Latin America Wafer Backgrinding Tape and Dicing Tapes Market Facts & Figures by Country
3.7.1 Latin America Wafer Backgrinding Tape and Dicing Tapes Market Size by Country: 2019 VS 2023 VS 2030
3.7.2 Latin America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.7.3 Latin America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country
3.7.4 Mexico
3.7.5 Brazil
3.7.6 Argentina
3.7.7 Colombia
3.8 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Market Facts & Figures by Country
3.8.1 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Market Size by Country: 2019 VS 2023 VS 2030
3.8.2 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2030)
3.8.3 Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue by Country
3.8.4 Turkey
3.8.5 Saudi Arabia
3.8.6 UAE
4 Segment by Type
4.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2019-2030)
4.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2019-2024)
4.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Type (2025-2030)
4.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Type (2019-2030)
4.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2019-2030)
4.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2019-2024)
4.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Type (2025-2030)
4.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Type (2019-2030)
4.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Type (2019-2030)
5 Segment by Application
5.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2019-2030)
5.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2019-2024)
5.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Sales by Application (2025-2030)
5.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Application (2019-2030)
5.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2019-2030)
5.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2019-2024)
5.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Application (2025-2030)
5.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Application (2019-2030)
5.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Application (2019-2030)
6 Key Companies Profiled
6.1 Mitsui Chemicals Tohcello
6.1.1 Mitsui Chemicals Tohcello Company Information
6.1.2 Mitsui Chemicals Tohcello Description and Business Overview
6.1.3 Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.1.4 Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
6.2 Nitto
6.2.1 Nitto Company Information
6.2.2 Nitto Description and Business Overview
6.2.3 Nitto Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.2.4 Nitto Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.2.5 Nitto Recent Developments/Updates
6.3 LINTEC
6.3.1 LINTEC Company Information
6.3.2 LINTEC Description and Business Overview
6.3.3 LINTEC Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.3.4 LINTEC Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.3.5 LINTEC Recent Developments/Updates
6.4 Furukawa Electric
6.4.1 Furukawa Electric Company Information
6.4.2 Furukawa Electric Description and Business Overview
6.4.3 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.4.4 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.4.5 Furukawa Electric Recent Developments/Updates
6.5 Denka
6.5.1 Denka Company Information
6.5.2 Denka Description and Business Overview
6.5.3 Denka Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.5.4 Denka Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.5.5 Denka Recent Developments/Updates
6.6 LG Chem
6.6.1 LG Chem Company Information
6.6.2 LG Chem Description and Business Overview
6.6.3 LG Chem Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.6.4 LG Chem Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.6.5 LG Chem Recent Developments/Updates
6.7 Maxell
6.7.1 Maxell Company Information
6.7.2 Maxell Description and Business Overview
6.7.3 Maxell Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.7.4 Maxell Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.7.5 Maxell Recent Developments/Updates
6.8 D&X
6.8.1 D&X Company Information
6.8.2 D&X Description and Business Overview
6.8.3 D&X Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.8.4 D&X Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.8.5 D&X Recent Developments/Updates
6.9 AI Technology
6.9.1 AI Technology Company Information
6.9.2 AI Technology Description and Business Overview
6.9.3 AI Technology Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.9.4 AI Technology Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.9.5 AI Technology Recent Developments/Updates
6.10 Suzhou Boyan Jingjin Photoelectric
6.10.1 Suzhou Boyan Jingjin Photoelectric Company Information
6.10.2 Suzhou Boyan Jingjin Photoelectric Description and Business Overview
6.10.3 Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.10.4 Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.10.5 Suzhou Boyan Jingjin Photoelectric Recent Developments/Updates
6.11 Shanghai Guke Adhesive Tape
6.11.1 Shanghai Guke Adhesive Tape Company Information
6.11.2 Shanghai Guke Adhesive Tape Description and Business Overview
6.11.3 Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.11.4 Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.11.5 Shanghai Guke Adhesive Tape Recent Developments/Updates
6.12 WISE New Material
6.12.1 WISE New Material Company Information
6.12.2 WISE New Material Description and Business Overview
6.12.3 WISE New Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.12.4 WISE New Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.12.5 WISE New Material Recent Developments/Updates
6.13 Taicang Zhanxin Adhesive Material
6.13.1 Taicang Zhanxin Adhesive Material Company Information
6.13.2 Taicang Zhanxin Adhesive Material Description and Business Overview
6.13.3 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.13.4 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.13.5 Taicang Zhanxin Adhesive Material Recent Developments/Updates
6.14 Shanghai Plusco Tech
6.14.1 Shanghai Plusco Tech Company Information
6.14.2 Shanghai Plusco Tech Description and Business Overview
6.14.3 Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.14.4 Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.14.5 Shanghai Plusco Tech Recent Developments/Updates
6.15 Kunshan BYE Science Macromolecule Material
6.15.1 Kunshan BYE Science Macromolecule Material Company Information
6.15.2 Kunshan BYE Science Macromolecule Material Description and Business Overview
6.15.3 Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.15.4 Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.15.5 Kunshan BYE Science Macromolecule Material Recent Developments/Updates
6.16 Cybrid Technologies
6.16.1 Cybrid Technologies Company Information
6.16.2 Cybrid Technologies Description and Business Overview
6.16.3 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Sales, Revenue and Gross Margin (2019-2024)
6.16.4 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
6.16.5 Cybrid Technologies Recent Developments/Updates
7 Industry Chain and Sales Channels Analysis
7.1 Wafer Backgrinding Tape and Dicing Tapes Industry Chain Analysis
7.2 Wafer Backgrinding Tape and Dicing Tapes Key Raw Materials
7.2.1 Key Raw Materials
7.2.2 Raw Materials Key Suppliers
7.3 Wafer Backgrinding Tape and Dicing Tapes Production Mode & Process
7.4 Wafer Backgrinding Tape and Dicing Tapes Sales and Marketing
7.4.1 Wafer Backgrinding Tape and Dicing Tapes Sales Channels
7.4.2 Wafer Backgrinding Tape and Dicing Tapes Distributors
7.5 Wafer Backgrinding Tape and Dicing Tapes Customers
8 Wafer Backgrinding Tape and Dicing Tapes Market Dynamics
8.1 Wafer Backgrinding Tape and Dicing Tapes Industry Trends
8.2 Wafer Backgrinding Tape and Dicing Tapes Market Drivers
8.3 Wafer Backgrinding Tape and Dicing Tapes Market Challenges
8.4 Wafer Backgrinding Tape and Dicing Tapes Market Restraints
9 Research Findings and Conclusion
10 Methodology and Data Source
10.1 Methodology/Research Approach
10.1.1 Research Programs/Design
10.1.2 Market Size Estimation
10.1.3 Market Breakdown and Data Triangulation
10.2 Data Source
10.2.1 Secondary Sources
10.2.2 Primary Sources
10.3 Author List
10.4 Disclaimer
List of TablesList of Tables
Table 1. Global Wafer Backgrinding Tape and Dicing Tapes Market Value Comparison by Type (2024-2030) & (US$ Million)
Table 2. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Application (2024-2030) & (US$ Million)
Table 3. Global Wafer Backgrinding Tape and Dicing Tapes Market Competitive Situation by Manufacturers in 2023
Table 4. Global Wafer Backgrinding Tape and Dicing Tapes Sales (Units) of Key Manufacturers (2019-2024)
Table 5. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Manufacturers (2019-2024)
Table 6. Global Wafer Backgrinding Tape and Dicing Tapes Revenue (US$ Million) by Manufacturers (2019-2024)
Table 7. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Share by Manufacturers (2019-2024)
Table 8. Global Market Wafer Backgrinding Tape and Dicing Tapes Average Price (US$/Unit) of Key Manufacturers (2019-2024)
Table 9. Global Key Players of Wafer Backgrinding Tape and Dicing Tapes, Industry Ranking, 2022 VS 2023 VS 2024
Table 10. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Manufacturing Sites & Headquarters
Table 11. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Product Type & Application
Table 12. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Date of Enter into This Industry
Table 13. Global Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Global Wafer Backgrinding Tape and Dicing Tapes by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Backgrinding Tape and Dicing Tapes as of 2023)
Table 15. Manufacturers Mergers & Acquisitions, Expansion Plans
Table 16. Global Wafer Backgrinding Tape and Dicing Tapes Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 17. Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2019-2024) & (Units)
Table 18. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Region (2019-2024)
Table 19. Global Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2025-2030) & (Units)
Table 20. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Region (2025-2030)
Table 21. Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2019-2024) & (US$ Million)
Table 22. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Region (2019-2024)
Table 23. Global Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2025-2030) & (US$ Million)
Table 24. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Region (2025-2030)
Table 25. North America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country: 2019 VS 2023 VS 2030 (US$ Million)
Table 26. North America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2024) & (Units)
Table 27. North America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2025-2030) & (Units)
Table 28. North America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2024) & (US$ Million)
Table 29. North America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2025-2030) & (US$ Million)
Table 30. Europe Wafer Backgrinding Tape and Dicing Tapes Revenue by Country: 2019 VS 2023 VS 2030 (US$ Million)
Table 31. Europe Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2024) & (Units)
Table 32. Europe Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2025-2030) & (Units)
Table 33. Europe Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2024) & (US$ Million)
Table 34. Europe Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2025-2030) & (US$ Million)
Table 35. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 36. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2019-2024) & (Units)
Table 37. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Sales by Region (2025-2030) & (Units)
Table 38. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2019-2024) & (US$ Million)
Table 39. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue by Region (2025-2030) & (US$ Million)
Table 40. Latin America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country: 2019 VS 2023 VS 2030 (US$ Million)
Table 41. Latin America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2024) & (Units)
Table 42. Latin America Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2025-2030) & (Units)
Table 43. Latin America Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2024) & (US$ Million)
Table 44. Latin America Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Country (2019-2024)
Table 45. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue by Country: 2019 VS 2023 VS 2030 (US$ Million)
Table 46. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2019-2024) & (Units)
Table 47. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Sales by Country (2025-2030) & (Units)
Table 48. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2019-2024) & (US$ Million)
Table 49. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue by Country (2025-2030) & (US$ Million)
Table 50. Global Wafer Backgrinding Tape and Dicing Tapes Sales (Units) by Type (2019-2024)
Table 51. Global Wafer Backgrinding Tape and Dicing Tapes Sales (Units) by Type (2025-2030)
Table 52. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Type (2019-2024)
Table 53. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Type (2025-2030)
Table 54. Global Wafer Backgrinding Tape and Dicing Tapes Revenue (US$ Million) by Type (2019-2024)
Table 55. Global Wafer Backgrinding Tape and Dicing Tapes Revenue (US$ Million) by Type (2025-2030)
Table 56. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Type (2019-2024)
Table 57. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Type (2025-2030)
Table 58. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Type (2019-2024)
Table 59. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Type (2025-2030)
Table 60. Global Wafer Backgrinding Tape and Dicing Tapes Sales (Units) by Application (2019-2024)
Table 61. Global Wafer Backgrinding Tape and Dicing Tapes Sales (Units) by Application (2025-2030)
Table 62. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Application (2019-2024)
Table 63. Global Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Application (2025-2030)
Table 64. Global Wafer Backgrinding Tape and Dicing Tapes Revenue (US$ Million) by Application (2019-2024)
Table 65. Global Wafer Backgrinding Tape and Dicing Tapes Revenue (US$ Million) by Application (2025-2030)
Table 66. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Application (2019-2024)
Table 67. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Application (2025-2030)
Table 68. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Application (2019-2024)
Table 69. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Application (2025-2030)
Table 70. Mitsui Chemicals Tohcello Company Information
Table 71. Mitsui Chemicals Tohcello Description and Business Overview
Table 72. Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 73. Mitsui Chemicals Tohcello Wafer Backgrinding Tape and Dicing Tapes Product
Table 74. Mitsui Chemicals Tohcello Recent Developments/Updates
Table 75. Nitto Company Information
Table 76. Nitto Description and Business Overview
Table 77. Nitto Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 78. Nitto Wafer Backgrinding Tape and Dicing Tapes Product
Table 79. Nitto Recent Developments/Updates
Table 80. LINTEC Company Information
Table 81. LINTEC Description and Business Overview
Table 82. LINTEC Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 83. LINTEC Wafer Backgrinding Tape and Dicing Tapes Product
Table 84. LINTEC Recent Developments/Updates
Table 85. Furukawa Electric Company Information
Table 86. Furukawa Electric Description and Business Overview
Table 87. Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 88. Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Product
Table 89. Furukawa Electric Recent Developments/Updates
Table 90. Denka Company Information
Table 91. Denka Description and Business Overview
Table 92. Denka Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 93. Denka Wafer Backgrinding Tape and Dicing Tapes Product
Table 94. Denka Recent Developments/Updates
Table 95. LG Chem Company Information
Table 96. LG Chem Description and Business Overview
Table 97. LG Chem Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 98. LG Chem Wafer Backgrinding Tape and Dicing Tapes Product
Table 99. LG Chem Recent Developments/Updates
Table 100. Maxell Company Information
Table 101. Maxell Description and Business Overview
Table 102. Maxell Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 103. Maxell Wafer Backgrinding Tape and Dicing Tapes Product
Table 104. Maxell Recent Developments/Updates
Table 105. D&X Company Information
Table 106. D&X Description and Business Overview
Table 107. D&X Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 108. D&X Wafer Backgrinding Tape and Dicing Tapes Product
Table 109. D&X Recent Developments/Updates
Table 110. AI Technology Company Information
Table 111. AI Technology Description and Business Overview
Table 112. AI Technology Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 113. AI Technology Wafer Backgrinding Tape and Dicing Tapes Product
Table 114. AI Technology Recent Developments/Updates
Table 115. Suzhou Boyan Jingjin Photoelectric Company Information
Table 116. Suzhou Boyan Jingjin Photoelectric Description and Business Overview
Table 117. Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 118. Suzhou Boyan Jingjin Photoelectric Wafer Backgrinding Tape and Dicing Tapes Product
Table 119. Suzhou Boyan Jingjin Photoelectric Recent Developments/Updates
Table 120. Shanghai Guke Adhesive Tape Company Information
Table 121. Shanghai Guke Adhesive Tape Description and Business Overview
Table 122. Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 123. Shanghai Guke Adhesive Tape Wafer Backgrinding Tape and Dicing Tapes Product
Table 124. Shanghai Guke Adhesive Tape Recent Developments/Updates
Table 125. WISE New Material Company Information
Table 126. WISE New Material Description and Business Overview
Table 127. WISE New Material Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 128. WISE New Material Wafer Backgrinding Tape and Dicing Tapes Product
Table 129. WISE New Material Recent Developments/Updates
Table 130. Taicang Zhanxin Adhesive Material Company Information
Table 131. Taicang Zhanxin Adhesive Material Description and Business Overview
Table 132. Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 133. Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Product
Table 134. Taicang Zhanxin Adhesive Material Recent Developments/Updates
Table 135. Shanghai Plusco Tech Company Information
Table 136. Shanghai Plusco Tech Description and Business Overview
Table 137. Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 138. Shanghai Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Product
Table 139. Shanghai Plusco Tech Recent Developments/Updates
Table 140. Kunshan BYE Science Macromolecule Material Company Information
Table 141. Kunshan BYE Science Macromolecule Material Description and Business Overview
Table 142. Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 143. Kunshan BYE Science Macromolecule Material Wafer Backgrinding Tape and Dicing Tapes Product
Table 144. Kunshan BYE Science Macromolecule Material Recent Developments/Updates
Table 145. Cybrid Technologies Company Information
Table 146. Cybrid Technologies Description and Business Overview
Table 147. Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 148. Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Product
Table 149. Cybrid Technologies Recent Developments/Updates
Table 150. Key Raw Materials Lists
Table 151. Raw Materials Key Suppliers Lists
Table 152. Wafer Backgrinding Tape and Dicing Tapes Distributors List
Table 153. Wafer Backgrinding Tape and Dicing Tapes Customers List
Table 154. Wafer Backgrinding Tape and Dicing Tapes Market Trends
Table 155. Wafer Backgrinding Tape and Dicing Tapes Market Drivers
Table 156. Wafer Backgrinding Tape and Dicing Tapes Market Challenges
Table 157. Wafer Backgrinding Tape and Dicing Tapes Market Restraints
Table 158. Research Programs/Design for This Report
Table 159. Key Data Information from Secondary Sources
Table 160. Key Data Information from Primary Sources
Table 161. Authors List of This Report
List of Figures
Figure 1. Product Picture of Wafer Backgrinding Tape and Dicing Tapes
Figure 2. Global Wafer Backgrinding Tape and Dicing Tapes Market Value Comparison by Type (2024-2030) & (US$ Million)
Figure 3. Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Type: 2023 & 2030
Figure 4. Backgrinding Tape Product Picture
Figure 5. Dicing Tape Product Picture
Figure 6. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Application (2024-2030) & (US$ Million)
Figure 7. Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Application: 2023 & 2030
Figure 8. Front-End Process
Figure 9. Back-End Process
Figure 10. Global Wafer Backgrinding Tape and Dicing Tapes Revenue, (US$ Million), 2019 VS 2023 VS 2030
Figure 11. Global Wafer Backgrinding Tape and Dicing Tapes Market Size (2019-2030) & (US$ Million)
Figure 12. Global Wafer Backgrinding Tape and Dicing Tapes Sales (2019-2030) & (Units)
Figure 13. Global Wafer Backgrinding Tape and Dicing Tapes Average Price (US$/Unit) & (2019-2030)
Figure 14. Wafer Backgrinding Tape and Dicing Tapes Report Years Considered
Figure 15. Wafer Backgrinding Tape and Dicing Tapes Sales Share by Manufacturers in 2023
Figure 16. Global Wafer Backgrinding Tape and Dicing Tapes Revenue Share by Manufacturers in 2023
Figure 17. Global 5 and 10 Largest Wafer Backgrinding Tape and Dicing Tapes Players: Market Share by Revenue in Wafer Backgrinding Tape and Dicing Tapes in 2023
Figure 18. Wafer Backgrinding Tape and Dicing Tapes Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 19. Global Wafer Backgrinding Tape and Dicing Tapes Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Figure 20. North America Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Country (2019-2030)
Figure 21. North America Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Country (2019-2030)
Figure 22. United States Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 23. Canada Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 24. Europe Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Country (2019-2030)
Figure 25. Europe Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Country (2019-2030)
Figure 26. Germany Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 27. France Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 28. U.K. Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 29. Italy Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 30. Russia Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 31. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Region (2019-2030)
Figure 32. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Region (2019-2030)
Figure 33. China Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 34. Japan Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 35. South Korea Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 36. India Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 37. Australia Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 38. China Taiwan Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 39. Southeast Asia Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 40. Latin America Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Country (2019-2030)
Figure 41. Mexico Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 42. Brazil Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 43. Argentina Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 44. Colombia Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 45. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Sales Market Share by Country (2019-2030)
Figure 46. Middle East and Africa Wafer Backgrinding Tape and Dicing Tapes Revenue Market Share by Country (2019-2030)
Figure 47. Turkey Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 48. Saudi Arabia Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 49. UAE Wafer Backgrinding Tape and Dicing Tapes Revenue Growth Rate (2019-2030) & (US$ Million)
Figure 50. Global Sales Market Share of Wafer Backgrinding Tape and Dicing Tapes by Type (2019-2030)
Figure 51. Global Revenue Market Share of Wafer Backgrinding Tape and Dicing Tapes by Type (2019-2030)
Figure 52. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Type (2019-2030)
Figure 53. Global Sales Market Share of Wafer Backgrinding Tape and Dicing Tapes by Application (2019-2030)
Figure 54. Global Revenue Market Share of Wafer Backgrinding Tape and Dicing Tapes by Application (2019-2030)
Figure 55. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Unit) by Application (2019-2030)
Figure 56. Wafer Backgrinding Tape and Dicing Tapes Value Chain
Figure 57. Wafer Backgrinding Tape and Dicing Tapes Production Process
Figure 58. Channels of Distribution (Direct Vs Distribution)
Figure 59. Bottom-up and Top-down Approaches for This Report
Figure 60. Data Triangulation
Figure 61. Key Executives Interviewed
Published By : QY Research
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