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Global Wafer Cutting Scribing Machine Market Research Report 2024

Global Wafer Cutting Scribing Machine Market Research Report 2024

Publishing Date : Jun, 2023

License Type :
 

Report Code : 1739475

No of Pages : 93

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Synopsis
Wafer Cutting Scribing Machine is a tool used in semiconductor manufacturing to cut and separate wafers into individual chips. Scribing machines use a diamond-tipped blade or laser to make precise cuts on the surface of the wafer, creating lines that weaken the material and allow it to be broken cleanly along the cut lines.

Global Wafer Cutting Scribing Machine market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Cutting Scribing Machine market research.

Key manufacturers engaged in the Wafer Cutting Scribing Machine industry include DISCO, Genesem, Tokyo Seimitsu, ASMPT, EO Technics, 3D-Micromac AG, Fujitsu Microelectronics, GL Tech and Han's Laser Technology, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Wafer Cutting Scribing Machine production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Wafer Cutting Scribing Machine were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Wafer Cutting Scribing Machine market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Cutting Scribing Machine market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

  • DISCO
  • Genesem
  • Tokyo Seimitsu
  • ASMPT
  • EO Technics
  • 3D-Micromac AG
  • Fujitsu Microelectronics
  • GL Tech
  • Han's Laser Technology
  • China Electronics Technology Group
  • JCET Group
  • Wuxi Autowell Technology
  • Suzhou Delphi Laser
  • Shenzhen Guangyuan Intelligent

Segment by Type

  • Grinding Wheel Scribing Machine
  • Laser Scribing Machine

Segment by Application

  • Semiconductor Packaging and Testing
  • EMC Leadframe
  • Ceramic Sheet
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
  • Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Wafer Cutting Scribing Machine report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Wafer Cutting Scribing Machine Market Overview
1.1 Product Definition
1.2 Wafer Cutting Scribing Machine Segment by Type
1.2.1 Global Wafer Cutting Scribing Machine Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Grinding Wheel Scribing Machine
1.2.3 Laser Scribing Machine
1.3 Wafer Cutting Scribing Machine Segment by Application
1.3.1 Global Wafer Cutting Scribing Machine Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Packaging and Testing
1.3.3 EMC Leadframe
1.3.4 Ceramic Sheet
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Cutting Scribing Machine Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Cutting Scribing Machine Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Cutting Scribing Machine Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Cutting Scribing Machine Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Cutting Scribing Machine Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Cutting Scribing Machine Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Cutting Scribing Machine, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Cutting Scribing Machine Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Cutting Scribing Machine Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Cutting Scribing Machine, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Cutting Scribing Machine, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Cutting Scribing Machine, Date of Enter into This Industry
2.9 Wafer Cutting Scribing Machine Market Competitive Situation and Trends
2.9.1 Wafer Cutting Scribing Machine Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Cutting Scribing Machine Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Cutting Scribing Machine Production by Region
3.1 Global Wafer Cutting Scribing Machine Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Cutting Scribing Machine Production Value by Region (2018-2029)
3.2.1 Global Wafer Cutting Scribing Machine Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Cutting Scribing Machine by Region (2024-2029)
3.3 Global Wafer Cutting Scribing Machine Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Cutting Scribing Machine Production by Region (2018-2029)
3.4.1 Global Wafer Cutting Scribing Machine Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Cutting Scribing Machine by Region (2024-2029)
3.5 Global Wafer Cutting Scribing Machine Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Cutting Scribing Machine Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Cutting Scribing Machine Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Cutting Scribing Machine Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Cutting Scribing Machine Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Cutting Scribing Machine Production Value Estimates and Forecasts (2018-2029)
4 Wafer Cutting Scribing Machine Consumption by Region
4.1 Global Wafer Cutting Scribing Machine Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Cutting Scribing Machine Consumption by Region (2018-2029)
4.2.1 Global Wafer Cutting Scribing Machine Consumption by Region (2018-2023)
4.2.2 Global Wafer Cutting Scribing Machine Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Cutting Scribing Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Cutting Scribing Machine Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Cutting Scribing Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Cutting Scribing Machine Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Cutting Scribing Machine Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Cutting Scribing Machine Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Cutting Scribing Machine Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Cutting Scribing Machine Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Cutting Scribing Machine Production by Type (2018-2029)
5.1.1 Global Wafer Cutting Scribing Machine Production by Type (2018-2023)
5.1.2 Global Wafer Cutting Scribing Machine Production by Type (2024-2029)
5.1.3 Global Wafer Cutting Scribing Machine Production Market Share by Type (2018-2029)
5.2 Global Wafer Cutting Scribing Machine Production Value by Type (2018-2029)
5.2.1 Global Wafer Cutting Scribing Machine Production Value by Type (2018-2023)
5.2.2 Global Wafer Cutting Scribing Machine Production Value by Type (2024-2029)
5.2.3 Global Wafer Cutting Scribing Machine Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Cutting Scribing Machine Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Cutting Scribing Machine Production by Application (2018-2029)
6.1.1 Global Wafer Cutting Scribing Machine Production by Application (2018-2023)
6.1.2 Global Wafer Cutting Scribing Machine Production by Application (2024-2029)
6.1.3 Global Wafer Cutting Scribing Machine Production Market Share by Application (2018-2029)
6.2 Global Wafer Cutting Scribing Machine Production Value by Application (2018-2029)
6.2.1 Global Wafer Cutting Scribing Machine Production Value by Application (2018-2023)
6.2.2 Global Wafer Cutting Scribing Machine Production Value by Application (2024-2029)
6.2.3 Global Wafer Cutting Scribing Machine Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Cutting Scribing Machine Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO
7.1.1 DISCO Wafer Cutting Scribing Machine Corporation Information
7.1.2 DISCO Wafer Cutting Scribing Machine Product Portfolio
7.1.3 DISCO Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Main Business and Markets Served
7.1.5 DISCO Recent Developments/Updates
7.2 Genesem
7.2.1 Genesem Wafer Cutting Scribing Machine Corporation Information
7.2.2 Genesem Wafer Cutting Scribing Machine Product Portfolio
7.2.3 Genesem Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Genesem Main Business and Markets Served
7.2.5 Genesem Recent Developments/Updates
7.3 Tokyo Seimitsu
7.3.1 Tokyo Seimitsu Wafer Cutting Scribing Machine Corporation Information
7.3.2 Tokyo Seimitsu Wafer Cutting Scribing Machine Product Portfolio
7.3.3 Tokyo Seimitsu Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Tokyo Seimitsu Main Business and Markets Served
7.3.5 Tokyo Seimitsu Recent Developments/Updates
7.4 ASMPT
7.4.1 ASMPT Wafer Cutting Scribing Machine Corporation Information
7.4.2 ASMPT Wafer Cutting Scribing Machine Product Portfolio
7.4.3 ASMPT Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.4.4 ASMPT Main Business and Markets Served
7.4.5 ASMPT Recent Developments/Updates
7.5 EO Technics
7.5.1 EO Technics Wafer Cutting Scribing Machine Corporation Information
7.5.2 EO Technics Wafer Cutting Scribing Machine Product Portfolio
7.5.3 EO Technics Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.5.4 EO Technics Main Business and Markets Served
7.5.5 EO Technics Recent Developments/Updates
7.6 3D-Micromac AG
7.6.1 3D-Micromac AG Wafer Cutting Scribing Machine Corporation Information
7.6.2 3D-Micromac AG Wafer Cutting Scribing Machine Product Portfolio
7.6.3 3D-Micromac AG Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.6.4 3D-Micromac AG Main Business and Markets Served
7.6.5 3D-Micromac AG Recent Developments/Updates
7.7 Fujitsu Microelectronics
7.7.1 Fujitsu Microelectronics Wafer Cutting Scribing Machine Corporation Information
7.7.2 Fujitsu Microelectronics Wafer Cutting Scribing Machine Product Portfolio
7.7.3 Fujitsu Microelectronics Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Fujitsu Microelectronics Main Business and Markets Served
7.7.5 Fujitsu Microelectronics Recent Developments/Updates
7.8 GL Tech
7.8.1 GL Tech Wafer Cutting Scribing Machine Corporation Information
7.8.2 GL Tech Wafer Cutting Scribing Machine Product Portfolio
7.8.3 GL Tech Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.8.4 GL Tech Main Business and Markets Served
7.7.5 GL Tech Recent Developments/Updates
7.9 Han's Laser Technology
7.9.1 Han's Laser Technology Wafer Cutting Scribing Machine Corporation Information
7.9.2 Han's Laser Technology Wafer Cutting Scribing Machine Product Portfolio
7.9.3 Han's Laser Technology Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Han's Laser Technology Main Business and Markets Served
7.9.5 Han's Laser Technology Recent Developments/Updates
7.10 China Electronics Technology Group
7.10.1 China Electronics Technology Group Wafer Cutting Scribing Machine Corporation Information
7.10.2 China Electronics Technology Group Wafer Cutting Scribing Machine Product Portfolio
7.10.3 China Electronics Technology Group Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.10.4 China Electronics Technology Group Main Business and Markets Served
7.10.5 China Electronics Technology Group Recent Developments/Updates
7.11 JCET Group
7.11.1 JCET Group Wafer Cutting Scribing Machine Corporation Information
7.11.2 JCET Group Wafer Cutting Scribing Machine Product Portfolio
7.11.3 JCET Group Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.11.4 JCET Group Main Business and Markets Served
7.11.5 JCET Group Recent Developments/Updates
7.12 Wuxi Autowell Technology
7.12.1 Wuxi Autowell Technology Wafer Cutting Scribing Machine Corporation Information
7.12.2 Wuxi Autowell Technology Wafer Cutting Scribing Machine Product Portfolio
7.12.3 Wuxi Autowell Technology Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Wuxi Autowell Technology Main Business and Markets Served
7.12.5 Wuxi Autowell Technology Recent Developments/Updates
7.13 Suzhou Delphi Laser
7.13.1 Suzhou Delphi Laser Wafer Cutting Scribing Machine Corporation Information
7.13.2 Suzhou Delphi Laser Wafer Cutting Scribing Machine Product Portfolio
7.13.3 Suzhou Delphi Laser Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Suzhou Delphi Laser Main Business and Markets Served
7.13.5 Suzhou Delphi Laser Recent Developments/Updates
7.14 Shenzhen Guangyuan Intelligent
7.14.1 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Corporation Information
7.14.2 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Product Portfolio
7.14.3 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Shenzhen Guangyuan Intelligent Main Business and Markets Served
7.14.5 Shenzhen Guangyuan Intelligent Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Cutting Scribing Machine Industry Chain Analysis
8.2 Wafer Cutting Scribing Machine Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Cutting Scribing Machine Production Mode & Process
8.4 Wafer Cutting Scribing Machine Sales and Marketing
8.4.1 Wafer Cutting Scribing Machine Sales Channels
8.4.2 Wafer Cutting Scribing Machine Distributors
8.5 Wafer Cutting Scribing Machine Customers
9 Wafer Cutting Scribing Machine Market Dynamics
9.1 Wafer Cutting Scribing Machine Industry Trends
9.2 Wafer Cutting Scribing Machine Market Drivers
9.3 Wafer Cutting Scribing Machine Market Challenges
9.4 Wafer Cutting Scribing Machine Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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