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Global Wafer Dicing Saw Blades Market Research Report 2025

Global Wafer Dicing Saw Blades Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1764832

No of Pages : 102

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Synopsis
A Wafer Dicing Saw Blade, also referred to as a diamond dicing blade or simply a dicing blade, is a cutting tool specifically designed for separating wafers into individual chips or devices in the semiconductor industry. These blades are typically made of a metal core with diamond particles embedded in a resin or metal bond.

Global Wafer Dicing Saw Blades market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Dicing Saw Blades market research.

Key manufacturers engaged in the Wafer Dicing Saw Blades industry include DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint, Kulicke and Soffa Industries, Asahi Diamond Industrial, Norton Winter (Saint-Gobain), EHWA and Thermocarbon, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Wafer Dicing Saw Blades production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Wafer Dicing Saw Blades were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Wafer Dicing Saw Blades market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Dicing Saw Blades market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

  • DISCO
  • Tokyo Seimitsu
  • Advanced Dicing Technologies (ADT)
  • Loadpoint
  • Kulicke and Soffa Industries
  • Asahi Diamond Industrial
  • Norton Winter (Saint-Gobain)
  • EHWA
  • Thermocarbon
  • Kulicke and Soffa Industries
  • UKAM Industrial Superhard Tools
  • Ceiba Technologies
  • Gl Tech
  • Zhengzhou Hongtuo Superabrasive Products
  • Shanghai Sinyang Semiconductor Materials
  • System Technology (Shenzhen)
  • Zhengzhou Qisheng Precision Manufacturing

Segment by Type

  • Hubless Dicing Blades
  • Hubbed Dicing Blades

Segment by Application

  • Semiconductor
  • LED
  • Photovoltaic
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
  • Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Wafer Dicing Saw Blades report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Wafer Dicing Saw Blades Market Overview
1.1 Product Definition
1.2 Wafer Dicing Saw Blades Segment by Type
1.2.1 Global Wafer Dicing Saw Blades Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hubless Dicing Blades
1.2.3 Hubbed Dicing Blades
1.3 Wafer Dicing Saw Blades Segment by Application
1.3.1 Global Wafer Dicing Saw Blades Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor
1.3.3 LED
1.3.4 Photovoltaic
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Dicing Saw Blades Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Dicing Saw Blades Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Dicing Saw Blades Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Dicing Saw Blades Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Dicing Saw Blades Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Dicing Saw Blades, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Dicing Saw Blades Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Dicing Saw Blades Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Dicing Saw Blades, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Dicing Saw Blades, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Dicing Saw Blades, Date of Enter into This Industry
2.9 Wafer Dicing Saw Blades Market Competitive Situation and Trends
2.9.1 Wafer Dicing Saw Blades Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Dicing Saw Blades Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Dicing Saw Blades Production by Region
3.1 Global Wafer Dicing Saw Blades Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Dicing Saw Blades Production Value by Region (2018-2029)
3.2.1 Global Wafer Dicing Saw Blades Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Dicing Saw Blades by Region (2024-2029)
3.3 Global Wafer Dicing Saw Blades Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Dicing Saw Blades Production by Region (2018-2029)
3.4.1 Global Wafer Dicing Saw Blades Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Dicing Saw Blades by Region (2024-2029)
3.5 Global Wafer Dicing Saw Blades Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Dicing Saw Blades Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
4 Wafer Dicing Saw Blades Consumption by Region
4.1 Global Wafer Dicing Saw Blades Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Dicing Saw Blades Consumption by Region (2018-2029)
4.2.1 Global Wafer Dicing Saw Blades Consumption by Region (2018-2023)
4.2.2 Global Wafer Dicing Saw Blades Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Dicing Saw Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Dicing Saw Blades Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Dicing Saw Blades Production by Type (2018-2029)
5.1.1 Global Wafer Dicing Saw Blades Production by Type (2018-2023)
5.1.2 Global Wafer Dicing Saw Blades Production by Type (2024-2029)
5.1.3 Global Wafer Dicing Saw Blades Production Market Share by Type (2018-2029)
5.2 Global Wafer Dicing Saw Blades Production Value by Type (2018-2029)
5.2.1 Global Wafer Dicing Saw Blades Production Value by Type (2018-2023)
5.2.2 Global Wafer Dicing Saw Blades Production Value by Type (2024-2029)
5.2.3 Global Wafer Dicing Saw Blades Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Dicing Saw Blades Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Dicing Saw Blades Production by Application (2018-2029)
6.1.1 Global Wafer Dicing Saw Blades Production by Application (2018-2023)
6.1.2 Global Wafer Dicing Saw Blades Production by Application (2024-2029)
6.1.3 Global Wafer Dicing Saw Blades Production Market Share by Application (2018-2029)
6.2 Global Wafer Dicing Saw Blades Production Value by Application (2018-2029)
6.2.1 Global Wafer Dicing Saw Blades Production Value by Application (2018-2023)
6.2.2 Global Wafer Dicing Saw Blades Production Value by Application (2024-2029)
6.2.3 Global Wafer Dicing Saw Blades Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Dicing Saw Blades Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO
7.1.1 DISCO Wafer Dicing Saw Blades Corporation Information
7.1.2 DISCO Wafer Dicing Saw Blades Product Portfolio
7.1.3 DISCO Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Main Business and Markets Served
7.1.5 DISCO Recent Developments/Updates
7.2 Tokyo Seimitsu
7.2.1 Tokyo Seimitsu Wafer Dicing Saw Blades Corporation Information
7.2.2 Tokyo Seimitsu Wafer Dicing Saw Blades Product Portfolio
7.2.3 Tokyo Seimitsu Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Tokyo Seimitsu Main Business and Markets Served
7.2.5 Tokyo Seimitsu Recent Developments/Updates
7.3 Advanced Dicing Technologies (ADT)
7.3.1 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Corporation Information
7.3.2 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Product Portfolio
7.3.3 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Advanced Dicing Technologies (ADT) Main Business and Markets Served
7.3.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates
7.4 Loadpoint
7.4.1 Loadpoint Wafer Dicing Saw Blades Corporation Information
7.4.2 Loadpoint Wafer Dicing Saw Blades Product Portfolio
7.4.3 Loadpoint Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Loadpoint Main Business and Markets Served
7.4.5 Loadpoint Recent Developments/Updates
7.5 Kulicke and Soffa Industries
7.5.1 Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
7.5.2 Kulicke and Soffa Industries Wafer Dicing Saw Blades Product Portfolio
7.5.3 Kulicke and Soffa Industries Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Kulicke and Soffa Industries Main Business and Markets Served
7.5.5 Kulicke and Soffa Industries Recent Developments/Updates
7.6 Asahi Diamond Industrial
7.6.1 Asahi Diamond Industrial Wafer Dicing Saw Blades Corporation Information
7.6.2 Asahi Diamond Industrial Wafer Dicing Saw Blades Product Portfolio
7.6.3 Asahi Diamond Industrial Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Asahi Diamond Industrial Main Business and Markets Served
7.6.5 Asahi Diamond Industrial Recent Developments/Updates
7.7 Norton Winter (Saint-Gobain)
7.7.1 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Corporation Information
7.7.2 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Product Portfolio
7.7.3 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Norton Winter (Saint-Gobain) Main Business and Markets Served
7.7.5 Norton Winter (Saint-Gobain) Recent Developments/Updates
7.8 EHWA
7.8.1 EHWA Wafer Dicing Saw Blades Corporation Information
7.8.2 EHWA Wafer Dicing Saw Blades Product Portfolio
7.8.3 EHWA Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.8.4 EHWA Main Business and Markets Served
7.7.5 EHWA Recent Developments/Updates
7.9 Thermocarbon
7.9.1 Thermocarbon Wafer Dicing Saw Blades Corporation Information
7.9.2 Thermocarbon Wafer Dicing Saw Blades Product Portfolio
7.9.3 Thermocarbon Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Thermocarbon Main Business and Markets Served
7.9.5 Thermocarbon Recent Developments/Updates
7.10 Kulicke and Soffa Industries
7.10.1 Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
7.10.2 Kulicke and Soffa Industries Wafer Dicing Saw Blades Product Portfolio
7.10.3 Kulicke and Soffa Industries Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kulicke and Soffa Industries Main Business and Markets Served
7.10.5 Kulicke and Soffa Industries Recent Developments/Updates
7.11 UKAM Industrial Superhard Tools
7.11.1 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Corporation Information
7.11.2 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Product Portfolio
7.11.3 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.11.4 UKAM Industrial Superhard Tools Main Business and Markets Served
7.11.5 UKAM Industrial Superhard Tools Recent Developments/Updates
7.12 Ceiba Technologies
7.12.1 Ceiba Technologies Wafer Dicing Saw Blades Corporation Information
7.12.2 Ceiba Technologies Wafer Dicing Saw Blades Product Portfolio
7.12.3 Ceiba Technologies Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Ceiba Technologies Main Business and Markets Served
7.12.5 Ceiba Technologies Recent Developments/Updates
7.13 Gl Tech
7.13.1 Gl Tech Wafer Dicing Saw Blades Corporation Information
7.13.2 Gl Tech Wafer Dicing Saw Blades Product Portfolio
7.13.3 Gl Tech Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Gl Tech Main Business and Markets Served
7.13.5 Gl Tech Recent Developments/Updates
7.14 Zhengzhou Hongtuo Superabrasive Products
7.14.1 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Corporation Information
7.14.2 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Product Portfolio
7.14.3 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Zhengzhou Hongtuo Superabrasive Products Main Business and Markets Served
7.14.5 Zhengzhou Hongtuo Superabrasive Products Recent Developments/Updates
7.15 Shanghai Sinyang Semiconductor Materials
7.15.1 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Corporation Information
7.15.2 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Product Portfolio
7.15.3 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
7.15.5 Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
7.16 System Technology (Shenzhen)
7.16.1 System Technology (Shenzhen) Wafer Dicing Saw Blades Corporation Information
7.16.2 System Technology (Shenzhen) Wafer Dicing Saw Blades Product Portfolio
7.16.3 System Technology (Shenzhen) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.16.4 System Technology (Shenzhen) Main Business and Markets Served
7.16.5 System Technology (Shenzhen) Recent Developments/Updates
7.17 Zhengzhou Qisheng Precision Manufacturing
7.17.1 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Corporation Information
7.17.2 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Product Portfolio
7.17.3 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.17.4 Zhengzhou Qisheng Precision Manufacturing Main Business and Markets Served
7.17.5 Zhengzhou Qisheng Precision Manufacturing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Dicing Saw Blades Industry Chain Analysis
8.2 Wafer Dicing Saw Blades Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Dicing Saw Blades Production Mode & Process
8.4 Wafer Dicing Saw Blades Sales and Marketing
8.4.1 Wafer Dicing Saw Blades Sales Channels
8.4.2 Wafer Dicing Saw Blades Distributors
8.5 Wafer Dicing Saw Blades Customers
9 Wafer Dicing Saw Blades Market Dynamics
9.1 Wafer Dicing Saw Blades Industry Trends
9.2 Wafer Dicing Saw Blades Market Drivers
9.3 Wafer Dicing Saw Blades Market Challenges
9.4 Wafer Dicing Saw Blades Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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