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Global Wafer Dicing Tape Market Research Report 2024
Synopsis
The global Wafer Dicing Tape market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Dicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Dicing Tape.
Report Scope
The Wafer Dicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Rolls) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Dicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Dicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Nitto
Lintec Corporation
AI Technology
Semiconductor Equipment
Sumitomo Bakelite
Minitron
NPMT
Denka
Hitachi Chemical
Furukawa Electric
3M Company
Mitsui Chemicals
Segment by Type
Double Coated Type
Single Coated Type
Segment by Application
Die to Substrate
Die to Die
Film on Wire
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Dicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Dicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Dicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Wafer Dicing Tape market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Dicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Dicing Tape.
Report Scope
The Wafer Dicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Rolls) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Dicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Dicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Nitto
Lintec Corporation
AI Technology
Semiconductor Equipment
Sumitomo Bakelite
Minitron
NPMT
Denka
Hitachi Chemical
Furukawa Electric
3M Company
Mitsui Chemicals
Segment by Type
Double Coated Type
Single Coated Type
Segment by Application
Die to Substrate
Die to Die
Film on Wire
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Dicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Dicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Dicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Wafer Dicing Tape Market Overview
1.1 Product Definition
1.2 Wafer Dicing Tape Segment by Type
1.2.1 Global Wafer Dicing Tape Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Double Coated Type
1.2.3 Single Coated Type
1.3 Wafer Dicing Tape Segment by Application
1.3.1 Global Wafer Dicing Tape Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Die to Substrate
1.3.3 Die to Die
1.3.4 Film on Wire
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Wafer Dicing Tape Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Wafer Dicing Tape Production Estimates and Forecasts (2019-2030)
1.4.4 Global Wafer Dicing Tape Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Dicing Tape Production Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Dicing Tape Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Wafer Dicing Tape, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Wafer Dicing Tape Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Dicing Tape Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Wafer Dicing Tape, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Dicing Tape, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Dicing Tape, Date of Enter into This Industry
2.9 Wafer Dicing Tape Market Competitive Situation and Trends
2.9.1 Wafer Dicing Tape Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Dicing Tape Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Dicing Tape Production by Region
3.1 Global Wafer Dicing Tape Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Wafer Dicing Tape Production Value by Region (2019-2030)
3.2.1 Global Wafer Dicing Tape Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Wafer Dicing Tape by Region (2025-2030)
3.3 Global Wafer Dicing Tape Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Wafer Dicing Tape Production by Region (2019-2030)
3.4.1 Global Wafer Dicing Tape Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Wafer Dicing Tape by Region (2025-2030)
3.5 Global Wafer Dicing Tape Market Price Analysis by Region (2019-2024)
3.6 Global Wafer Dicing Tape Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Wafer Dicing Tape Production Value Estimates and Forecasts (2019-2030)
4 Wafer Dicing Tape Consumption by Region
4.1 Global Wafer Dicing Tape Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Wafer Dicing Tape Consumption by Region (2019-2030)
4.2.1 Global Wafer Dicing Tape Consumption by Region (2019-2024)
4.2.2 Global Wafer Dicing Tape Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Wafer Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Wafer Dicing Tape Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Wafer Dicing Tape Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Dicing Tape Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Wafer Dicing Tape Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Wafer Dicing Tape Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Dicing Tape Production by Type (2019-2030)
5.1.1 Global Wafer Dicing Tape Production by Type (2019-2024)
5.1.2 Global Wafer Dicing Tape Production by Type (2025-2030)
5.1.3 Global Wafer Dicing Tape Production Market Share by Type (2019-2030)
5.2 Global Wafer Dicing Tape Production Value by Type (2019-2030)
5.2.1 Global Wafer Dicing Tape Production Value by Type (2019-2024)
5.2.2 Global Wafer Dicing Tape Production Value by Type (2025-2030)
5.2.3 Global Wafer Dicing Tape Production Value Market Share by Type (2019-2030)
5.3 Global Wafer Dicing Tape Price by Type (2019-2030)
6 Segment by Application
6.1 Global Wafer Dicing Tape Production by Application (2019-2030)
6.1.1 Global Wafer Dicing Tape Production by Application (2019-2024)
6.1.2 Global Wafer Dicing Tape Production by Application (2025-2030)
6.1.3 Global Wafer Dicing Tape Production Market Share by Application (2019-2030)
6.2 Global Wafer Dicing Tape Production Value by Application (2019-2030)
6.2.1 Global Wafer Dicing Tape Production Value by Application (2019-2024)
6.2.2 Global Wafer Dicing Tape Production Value by Application (2025-2030)
6.2.3 Global Wafer Dicing Tape Production Value Market Share by Application (2019-2030)
6.3 Global Wafer Dicing Tape Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Nitto
7.1.1 Nitto Wafer Dicing Tape Corporation Information
7.1.2 Nitto Wafer Dicing Tape Product Portfolio
7.1.3 Nitto Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Nitto Main Business and Markets Served
7.1.5 Nitto Recent Developments/Updates
7.2 Lintec Corporation
7.2.1 Lintec Corporation Wafer Dicing Tape Corporation Information
7.2.2 Lintec Corporation Wafer Dicing Tape Product Portfolio
7.2.3 Lintec Corporation Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Lintec Corporation Main Business and Markets Served
7.2.5 Lintec Corporation Recent Developments/Updates
7.3 AI Technology
7.3.1 AI Technology Wafer Dicing Tape Corporation Information
7.3.2 AI Technology Wafer Dicing Tape Product Portfolio
7.3.3 AI Technology Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.3.4 AI Technology Main Business and Markets Served
7.3.5 AI Technology Recent Developments/Updates
7.4 Semiconductor Equipment
7.4.1 Semiconductor Equipment Wafer Dicing Tape Corporation Information
7.4.2 Semiconductor Equipment Wafer Dicing Tape Product Portfolio
7.4.3 Semiconductor Equipment Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Semiconductor Equipment Main Business and Markets Served
7.4.5 Semiconductor Equipment Recent Developments/Updates
7.5 Sumitomo Bakelite
7.5.1 Sumitomo Bakelite Wafer Dicing Tape Corporation Information
7.5.2 Sumitomo Bakelite Wafer Dicing Tape Product Portfolio
7.5.3 Sumitomo Bakelite Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Sumitomo Bakelite Main Business and Markets Served
7.5.5 Sumitomo Bakelite Recent Developments/Updates
7.6 Minitron
7.6.1 Minitron Wafer Dicing Tape Corporation Information
7.6.2 Minitron Wafer Dicing Tape Product Portfolio
7.6.3 Minitron Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Minitron Main Business and Markets Served
7.6.5 Minitron Recent Developments/Updates
7.7 NPMT
7.7.1 NPMT Wafer Dicing Tape Corporation Information
7.7.2 NPMT Wafer Dicing Tape Product Portfolio
7.7.3 NPMT Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.7.4 NPMT Main Business and Markets Served
7.7.5 NPMT Recent Developments/Updates
7.8 Denka
7.8.1 Denka Wafer Dicing Tape Corporation Information
7.8.2 Denka Wafer Dicing Tape Product Portfolio
7.8.3 Denka Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Denka Main Business and Markets Served
7.7.5 Denka Recent Developments/Updates
7.9 Hitachi Chemical
7.9.1 Hitachi Chemical Wafer Dicing Tape Corporation Information
7.9.2 Hitachi Chemical Wafer Dicing Tape Product Portfolio
7.9.3 Hitachi Chemical Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Hitachi Chemical Main Business and Markets Served
7.9.5 Hitachi Chemical Recent Developments/Updates
7.10 Furukawa Electric
7.10.1 Furukawa Electric Wafer Dicing Tape Corporation Information
7.10.2 Furukawa Electric Wafer Dicing Tape Product Portfolio
7.10.3 Furukawa Electric Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Furukawa Electric Main Business and Markets Served
7.10.5 Furukawa Electric Recent Developments/Updates
7.11 3M Company
7.11.1 3M Company Wafer Dicing Tape Corporation Information
7.11.2 3M Company Wafer Dicing Tape Product Portfolio
7.11.3 3M Company Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.11.4 3M Company Main Business and Markets Served
7.11.5 3M Company Recent Developments/Updates
7.12 Mitsui Chemicals
7.12.1 Mitsui Chemicals Wafer Dicing Tape Corporation Information
7.12.2 Mitsui Chemicals Wafer Dicing Tape Product Portfolio
7.12.3 Mitsui Chemicals Wafer Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Mitsui Chemicals Main Business and Markets Served
7.12.5 Mitsui Chemicals Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Dicing Tape Industry Chain Analysis
8.2 Wafer Dicing Tape Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Dicing Tape Production Mode & Process
8.4 Wafer Dicing Tape Sales and Marketing
8.4.1 Wafer Dicing Tape Sales Channels
8.4.2 Wafer Dicing Tape Distributors
8.5 Wafer Dicing Tape Customers
9 Wafer Dicing Tape Market Dynamics
9.1 Wafer Dicing Tape Industry Trends
9.2 Wafer Dicing Tape Market Drivers
9.3 Wafer Dicing Tape Market Challenges
9.4 Wafer Dicing Tape Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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