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Global Wafer Grinding Tapes Market Research Report 2025
Synopsis
Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
The global Wafer Grinding Tapes market was valued at US$ 195 million in 2023 and is anticipated to reach US$ 271.8 million by 2030, witnessing a CAGR of 4.9% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinding Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Tapes.
Report Scope
The Wafer Grinding Tapes market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Grinding Tapes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinding Tapes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Grinding Tapes manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Grinding Tapes by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Grinding Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
The global Wafer Grinding Tapes market was valued at US$ 195 million in 2023 and is anticipated to reach US$ 271.8 million by 2030, witnessing a CAGR of 4.9% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinding Tapes, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Tapes.
Report Scope
The Wafer Grinding Tapes market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Grinding Tapes market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinding Tapes manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Grinding Tapes manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Grinding Tapes by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Grinding Tapes in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Wafer Grinding Tapes Market Overview
1.1 Product Definition
1.2 Wafer Grinding Tapes Segment by Type
1.2.1 Global Wafer Grinding Tapes Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 UV Type
1.2.3 Non-UV Type
1.3 Wafer Grinding Tapes Segment by Application
1.3.1 Global Wafer Grinding Tapes Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Standard
1.3.3 Standard Thin Die
1.3.4 (S)DBG(GAL)
1.3.5 Bump
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Wafer Grinding Tapes Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Wafer Grinding Tapes Production Estimates and Forecasts (2019-2030)
1.4.4 Global Wafer Grinding Tapes Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Grinding Tapes Production Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Grinding Tapes Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Wafer Grinding Tapes, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Wafer Grinding Tapes Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Grinding Tapes Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Wafer Grinding Tapes, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Grinding Tapes, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Grinding Tapes, Date of Enter into This Industry
2.9 Wafer Grinding Tapes Market Competitive Situation and Trends
2.9.1 Wafer Grinding Tapes Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Grinding Tapes Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Grinding Tapes Production by Region
3.1 Global Wafer Grinding Tapes Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Wafer Grinding Tapes Production Value by Region (2019-2030)
3.2.1 Global Wafer Grinding Tapes Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Wafer Grinding Tapes by Region (2025-2030)
3.3 Global Wafer Grinding Tapes Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Wafer Grinding Tapes Production by Region (2019-2030)
3.4.1 Global Wafer Grinding Tapes Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Wafer Grinding Tapes by Region (2025-2030)
3.5 Global Wafer Grinding Tapes Market Price Analysis by Region (2019-2024)
3.6 Global Wafer Grinding Tapes Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Wafer Grinding Tapes Production Value Estimates and Forecasts (2019-2030)
4 Wafer Grinding Tapes Consumption by Region
4.1 Global Wafer Grinding Tapes Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Wafer Grinding Tapes Consumption by Region (2019-2030)
4.2.1 Global Wafer Grinding Tapes Consumption by Region (2019-2024)
4.2.2 Global Wafer Grinding Tapes Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Wafer Grinding Tapes Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Wafer Grinding Tapes Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Grinding Tapes Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Wafer Grinding Tapes Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Wafer Grinding Tapes Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Grinding Tapes Production by Type (2019-2030)
5.1.1 Global Wafer Grinding Tapes Production by Type (2019-2024)
5.1.2 Global Wafer Grinding Tapes Production by Type (2025-2030)
5.1.3 Global Wafer Grinding Tapes Production Market Share by Type (2019-2030)
5.2 Global Wafer Grinding Tapes Production Value by Type (2019-2030)
5.2.1 Global Wafer Grinding Tapes Production Value by Type (2019-2024)
5.2.2 Global Wafer Grinding Tapes Production Value by Type (2025-2030)
5.2.3 Global Wafer Grinding Tapes Production Value Market Share by Type (2019-2030)
5.3 Global Wafer Grinding Tapes Price by Type (2019-2030)
6 Segment by Application
6.1 Global Wafer Grinding Tapes Production by Application (2019-2030)
6.1.1 Global Wafer Grinding Tapes Production by Application (2019-2024)
6.1.2 Global Wafer Grinding Tapes Production by Application (2025-2030)
6.1.3 Global Wafer Grinding Tapes Production Market Share by Application (2019-2030)
6.2 Global Wafer Grinding Tapes Production Value by Application (2019-2030)
6.2.1 Global Wafer Grinding Tapes Production Value by Application (2019-2024)
6.2.2 Global Wafer Grinding Tapes Production Value by Application (2025-2030)
6.2.3 Global Wafer Grinding Tapes Production Value Market Share by Application (2019-2030)
6.3 Global Wafer Grinding Tapes Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Mitsui Chemicals Tohcello
7.1.1 Mitsui Chemicals Tohcello Wafer Grinding Tapes Corporation Information
7.1.2 Mitsui Chemicals Tohcello Wafer Grinding Tapes Product Portfolio
7.1.3 Mitsui Chemicals Tohcello Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Mitsui Chemicals Tohcello Main Business and Markets Served
7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
7.2 Nitto
7.2.1 Nitto Wafer Grinding Tapes Corporation Information
7.2.2 Nitto Wafer Grinding Tapes Product Portfolio
7.2.3 Nitto Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Main Business and Markets Served
7.2.5 Nitto Recent Developments/Updates
7.3 LINTEC
7.3.1 LINTEC Wafer Grinding Tapes Corporation Information
7.3.2 LINTEC Wafer Grinding Tapes Product Portfolio
7.3.3 LINTEC Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.3.4 LINTEC Main Business and Markets Served
7.3.5 LINTEC Recent Developments/Updates
7.4 Furukawa Electric
7.4.1 Furukawa Electric Wafer Grinding Tapes Corporation Information
7.4.2 Furukawa Electric Wafer Grinding Tapes Product Portfolio
7.4.3 Furukawa Electric Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Furukawa Electric Main Business and Markets Served
7.4.5 Furukawa Electric Recent Developments/Updates
7.5 Denka
7.5.1 Denka Wafer Grinding Tapes Corporation Information
7.5.2 Denka Wafer Grinding Tapes Product Portfolio
7.5.3 Denka Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Denka Main Business and Markets Served
7.5.5 Denka Recent Developments/Updates
7.6 D&X
7.6.1 D&X Wafer Grinding Tapes Corporation Information
7.6.2 D&X Wafer Grinding Tapes Product Portfolio
7.6.3 D&X Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.6.4 D&X Main Business and Markets Served
7.6.5 D&X Recent Developments/Updates
7.7 AI Technology
7.7.1 AI Technology Wafer Grinding Tapes Corporation Information
7.7.2 AI Technology Wafer Grinding Tapes Product Portfolio
7.7.3 AI Technology Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.7.4 AI Technology Main Business and Markets Served
7.7.5 AI Technology Recent Developments/Updates
7.8 Force-One Applied Materials
7.8.1 Force-One Applied Materials Wafer Grinding Tapes Corporation Information
7.8.2 Force-One Applied Materials Wafer Grinding Tapes Product Portfolio
7.8.3 Force-One Applied Materials Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Force-One Applied Materials Main Business and Markets Served
7.7.5 Force-One Applied Materials Recent Developments/Updates
7.9 AMC Co, Ltd
7.9.1 AMC Co, Ltd Wafer Grinding Tapes Corporation Information
7.9.2 AMC Co, Ltd Wafer Grinding Tapes Product Portfolio
7.9.3 AMC Co, Ltd Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.9.4 AMC Co, Ltd Main Business and Markets Served
7.9.5 AMC Co, Ltd Recent Developments/Updates
7.10 Pantech Tape Co., Ltd
7.10.1 Pantech Tape Co., Ltd Wafer Grinding Tapes Corporation Information
7.10.2 Pantech Tape Co., Ltd Wafer Grinding Tapes Product Portfolio
7.10.3 Pantech Tape Co., Ltd Wafer Grinding Tapes Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Pantech Tape Co., Ltd Main Business and Markets Served
7.10.5 Pantech Tape Co., Ltd Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Grinding Tapes Industry Chain Analysis
8.2 Wafer Grinding Tapes Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Grinding Tapes Production Mode & Process
8.4 Wafer Grinding Tapes Sales and Marketing
8.4.1 Wafer Grinding Tapes Sales Channels
8.4.2 Wafer Grinding Tapes Distributors
8.5 Wafer Grinding Tapes Customers
9 Wafer Grinding Tapes Market Dynamics
9.1 Wafer Grinding Tapes Industry Trends
9.2 Wafer Grinding Tapes Market Drivers
9.3 Wafer Grinding Tapes Market Challenges
9.4 Wafer Grinding Tapes Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Wafer Grinding Tapes Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Wafer Grinding Tapes Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Wafer Grinding Tapes Production Capacity (K Sqm) by Manufacturers in 2023
Table 4. Global Wafer Grinding Tapes Production by Manufacturers (2019-2024) & (K Sqm)
Table 5. Global Wafer Grinding Tapes Production Market Share by Manufacturers (2019-2024)
Table 6. Global Wafer Grinding Tapes Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Wafer Grinding Tapes Production Value Share by Manufacturers (2019-2024)
Table 8. Global Wafer Grinding Tapes Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Grinding Tapes as of 2023)
Table 10. Global Market Wafer Grinding Tapes Average Price by Manufacturers (US$/Sqm) & (2019-2024)
Table 11. Manufacturers Wafer Grinding Tapes Production Sites and Area Served
Table 12. Manufacturers Wafer Grinding Tapes Product Types
Table 13. Global Wafer Grinding Tapes Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Wafer Grinding Tapes Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Wafer Grinding Tapes Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Wafer Grinding Tapes Production Value Market Share by Region (2019-2024)
Table 18. Global Wafer Grinding Tapes Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Wafer Grinding Tapes Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Wafer Grinding Tapes Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sqm)
Table 21. Global Wafer Grinding Tapes Production (K Sqm) by Region (2019-2024)
Table 22. Global Wafer Grinding Tapes Production Market Share by Region (2019-2024)
Table 23. Global Wafer Grinding Tapes Production (K Sqm) Forecast by Region (2025-2030)
Table 24. Global Wafer Grinding Tapes Production Market Share Forecast by Region (2025-2030)
Table 25. Global Wafer Grinding Tapes Market Average Price (US$/Sqm) by Region (2019-2024)
Table 26. Global Wafer Grinding Tapes Market Average Price (US$/Sqm) by Region (2025-2030)
Table 27. Global Wafer Grinding Tapes Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Sqm)
Table 28. Global Wafer Grinding Tapes Consumption by Region (2019-2024) & (K Sqm)
Table 29. Global Wafer Grinding Tapes Consumption Market Share by Region (2019-2024)
Table 30. Global Wafer Grinding Tapes Forecasted Consumption by Region (2025-2030) & (K Sqm)
Table 31. Global Wafer Grinding Tapes Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
Table 33. North America Wafer Grinding Tapes Consumption by Country (2019-2024) & (K Sqm)
Table 34. North America Wafer Grinding Tapes Consumption by Country (2025-2030) & (K Sqm)
Table 35. Europe Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
Table 36. Europe Wafer Grinding Tapes Consumption by Country (2019-2024) & (K Sqm)
Table 37. Europe Wafer Grinding Tapes Consumption by Country (2025-2030) & (K Sqm)
Table 38. Asia Pacific Wafer Grinding Tapes Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Sqm)
Table 39. Asia Pacific Wafer Grinding Tapes Consumption by Region (2019-2024) & (K Sqm)
Table 40. Asia Pacific Wafer Grinding Tapes Consumption by Region (2025-2030) & (K Sqm)
Table 41. Latin America, Middle East & Africa Wafer Grinding Tapes Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
Table 42. Latin America, Middle East & Africa Wafer Grinding Tapes Consumption by Country (2019-2024) & (K Sqm)
Table 43. Latin America, Middle East & Africa Wafer Grinding Tapes Consumption by Country (2025-2030) & (K Sqm)
Table 44. Global Wafer Grinding Tapes Production (K Sqm) by Type (2019-2024)
Table 45. Global Wafer Grinding Tapes Production (K Sqm) by Type (2025-2030)
Table 46. Global Wafer Grinding Tapes Production Market Share by Type (2019-2024)
Table 47. Global Wafer Grinding Tapes Production Market Share by Type (2025-2030)
Table 48. Global Wafer Grinding Tapes Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Wafer Grinding Tapes Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Wafer Grinding Tapes Production Value Share by Type (2019-2024)
Table 51. Global Wafer Grinding Tapes Production Value Share by Type (2025-2030)
Table 52. Global Wafer Grinding Tapes Price (US$/Sqm) by Type (2019-2024)
Table 53. Global Wafer Grinding Tapes Price (US$/Sqm) by Type (2025-2030)
Table 54. Global Wafer Grinding Tapes Production (K Sqm) by Application (2019-2024)
Table 55. Global Wafer Grinding Tapes Production (K Sqm) by Application (2025-2030)
Table 56. Global Wafer Grinding Tapes Production Market Share by Application (2019-2024)
Table 57. Global Wafer Grinding Tapes Production Market Share by Application (2025-2030)
Table 58. Global Wafer Grinding Tapes Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Wafer Grinding Tapes Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Wafer Grinding Tapes Production Value Share by Application (2019-2024)
Table 61. Global Wafer Grinding Tapes Production Value Share by Application (2025-2030)
Table 62. Global Wafer Grinding Tapes Price (US$/Sqm) by Application (2019-2024)
Table 63. Global Wafer Grinding Tapes Price (US$/Sqm) by Application (2025-2030)
Table 64. Mitsui Chemicals Tohcello Wafer Grinding Tapes Corporation Information
Table 65. Mitsui Chemicals Tohcello Specification and Application
Table 66. Mitsui Chemicals Tohcello Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 67. Mitsui Chemicals Tohcello Main Business and Markets Served
Table 68. Mitsui Chemicals Tohcello Recent Developments/Updates
Table 69. Nitto Wafer Grinding Tapes Corporation Information
Table 70. Nitto Specification and Application
Table 71. Nitto Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 72. Nitto Main Business and Markets Served
Table 73. Nitto Recent Developments/Updates
Table 74. LINTEC Wafer Grinding Tapes Corporation Information
Table 75. LINTEC Specification and Application
Table 76. LINTEC Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 77. LINTEC Main Business and Markets Served
Table 78. LINTEC Recent Developments/Updates
Table 79. Furukawa Electric Wafer Grinding Tapes Corporation Information
Table 80. Furukawa Electric Specification and Application
Table 81. Furukawa Electric Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 82. Furukawa Electric Main Business and Markets Served
Table 83. Furukawa Electric Recent Developments/Updates
Table 84. Denka Wafer Grinding Tapes Corporation Information
Table 85. Denka Specification and Application
Table 86. Denka Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 87. Denka Main Business and Markets Served
Table 88. Denka Recent Developments/Updates
Table 89. D&X Wafer Grinding Tapes Corporation Information
Table 90. D&X Specification and Application
Table 91. D&X Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 92. D&X Main Business and Markets Served
Table 93. D&X Recent Developments/Updates
Table 94. AI Technology Wafer Grinding Tapes Corporation Information
Table 95. AI Technology Specification and Application
Table 96. AI Technology Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 97. AI Technology Main Business and Markets Served
Table 98. AI Technology Recent Developments/Updates
Table 99. Force-One Applied Materials Wafer Grinding Tapes Corporation Information
Table 100. Force-One Applied Materials Specification and Application
Table 101. Force-One Applied Materials Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 102. Force-One Applied Materials Main Business and Markets Served
Table 103. Force-One Applied Materials Recent Developments/Updates
Table 104. AMC Co, Ltd Wafer Grinding Tapes Corporation Information
Table 105. AMC Co, Ltd Specification and Application
Table 106. AMC Co, Ltd Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 107. AMC Co, Ltd Main Business and Markets Served
Table 108. AMC Co, Ltd Recent Developments/Updates
Table 109. Pantech Tape Co., Ltd Wafer Grinding Tapes Corporation Information
Table 110. Pantech Tape Co., Ltd Specification and Application
Table 111. Pantech Tape Co., Ltd Wafer Grinding Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 112. Pantech Tape Co., Ltd Main Business and Markets Served
Table 113. Pantech Tape Co., Ltd Recent Developments/Updates
Table 114. Key Raw Materials Lists
Table 115. Raw Materials Key Suppliers Lists
Table 116. Wafer Grinding Tapes Distributors List
Table 117. Wafer Grinding Tapes Customers List
Table 118. Wafer Grinding Tapes Market Trends
Table 119. Wafer Grinding Tapes Market Drivers
Table 120. Wafer Grinding Tapes Market Challenges
Table 121. Wafer Grinding Tapes Market Restraints
Table 122. Research Programs/Design for This Report
Table 123. Key Data Information from Secondary Sources
Table 124. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Wafer Grinding Tapes
Figure 2. Global Wafer Grinding Tapes Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Wafer Grinding Tapes Market Share by Type: 2023 VS 2030
Figure 4. UV Type Product Picture
Figure 5. Non-UV Type Product Picture
Figure 6. Global Wafer Grinding Tapes Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Wafer Grinding Tapes Market Share by Application: 2023 VS 2030
Figure 8. Standard
Figure 9. Standard Thin Die
Figure 10. (S)DBG(GAL)
Figure 11. Bump
Figure 12. Global Wafer Grinding Tapes Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 13. Global Wafer Grinding Tapes Production Value (US$ Million) & (2019-2030)
Figure 14. Global Wafer Grinding Tapes Production (K Sqm) & (2019-2030)
Figure 15. Global Wafer Grinding Tapes Average Price (US$/Sqm) & (2019-2030)
Figure 16. Wafer Grinding Tapes Report Years Considered
Figure 17. Wafer Grinding Tapes Production Share by Manufacturers in 2023
Figure 18. Wafer Grinding Tapes Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 19. The Global 5 and 10 Largest Players: Market Share by Wafer Grinding Tapes Revenue in 2023
Figure 20. Global Wafer Grinding Tapes Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 21. Global Wafer Grinding Tapes Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 22. Global Wafer Grinding Tapes Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sqm)
Figure 23. Global Wafer Grinding Tapes Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 24. North America Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 25. Europe Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. China Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. Japan Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. South Korea Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. Taiwan Wafer Grinding Tapes Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global Wafer Grinding Tapes Consumption by Region: 2019 VS 2023 VS 2030 (K Sqm)
Figure 31. Global Wafer Grinding Tapes Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 33. North America Wafer Grinding Tapes Consumption Market Share by Country (2019-2030)
Figure 34. Canada Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 35. U.S. Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 36. Europe Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 37. Europe Wafer Grinding Tapes Consumption Market Share by Country (2019-2030)
Figure 38. Germany Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 39. France Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 40. U.K. Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 41. Italy Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 42. Russia Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 43. Asia Pacific Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 44. Asia Pacific Wafer Grinding Tapes Consumption Market Share by Regions (2019-2030)
Figure 45. China Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 46. Japan Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 47. South Korea Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 48. China Taiwan Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 49. Southeast Asia Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 50. India Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 51. Latin America, Middle East & Africa Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 52. Latin America, Middle East & Africa Wafer Grinding Tapes Consumption Market Share by Country (2019-2030)
Figure 53. Mexico Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 54. Brazil Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 55. Turkey Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 56. GCC Countries Wafer Grinding Tapes Consumption and Growth Rate (2019-2024) & (K Sqm)
Figure 57. Global Production Market Share of Wafer Grinding Tapes by Type (2019-2030)
Figure 58. Global Production Value Market Share of Wafer Grinding Tapes by Type (2019-2030)
Figure 59. Global Wafer Grinding Tapes Price (US$/Sqm) by Type (2019-2030)
Figure 60. Global Production Market Share of Wafer Grinding Tapes by Application (2019-2030)
Figure 61. Global Production Value Market Share of Wafer Grinding Tapes by Application (2019-2030)
Figure 62. Global Wafer Grinding Tapes Price (US$/Sqm) by Application (2019-2030)
Figure 63. Wafer Grinding Tapes Value Chain
Figure 64. Wafer Grinding Tapes Production Process
Figure 65. Channels of Distribution (Direct Vs Distribution)
Figure 66. Distributors Profiles
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation
Published By : QY Research
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