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High Density Interconnect-Global Market Insights and Sales Trends 2024

High Density Interconnect-Global Market Insights and Sales Trends 2024

Publishing Date : Nov, 2023

License Type :
 

Report Code : 1808303

No of Pages : 122

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Synopsis
High Density Interconnect. HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
The global High Density Interconnect market size is expected to reach US$ 26120 million by 2029, growing at a CAGR of 10.1% from 2023 to 2029. The market is mainly driven by the significant applications of High Density Interconnect in various end use industries. The expanding demands from the Automotive Electronics, Consumer Electronics and Other Electronic Products,, are propelling High Density Interconnect market. Single Panel, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Double Panel segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for High Density Interconnect market, driven by demand from China, the second largest economy with some signs of stabilising, the High Density Interconnect market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for High Density Interconnect, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global High Density Interconnect market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global High Density Interconnect market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, High Density Interconnect sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of High Density Interconnect covered in this report include IBIDEN Group, Unimicron, AT&S, SEMCO, NCAB Group, Young Poong Group, ZDT, Compeq and Unitech Printed Circuit Board Corp., etc.
The global High Density Interconnect market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
IBIDEN Group
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Group
ZDT
Compeq
Unitech Printed Circuit Board Corp.
LG Innotek
Tripod Technology
TTM Technologies
Daeduck
HannStar Board
Nan Ya PCB
CMK Corporation
Kingboard
Ellington
CCTC
Wuzhu Technology
Kinwong
Aoshikang
Sierra Circuits
Bittele Electronics
Epec
Würth Elektronik
NOD Electronics
San Francisco Circuits
PCBCart
Advanced Circuits
Global High Density Interconnect market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global High Density Interconnect market, Segment by Type:
Single Panel
Double Panel
Others
Global High Density Interconnect market, by Application
Automotive Electronics
Consumer Electronics
Other Electronic Products
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of High Density Interconnect manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of High Density Interconnect in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index
1 High Density Interconnect Market Overview
1.1 High Density Interconnect Product Overview
1.2 High Density Interconnect Market Segment by Type
1.2.1 Single Panel
1.2.2 Double Panel
1.2.3 Others
1.3 Global High Density Interconnect Market Size by Type
1.3.1 Global High Density Interconnect Market Size Overview by Type (2018-2029)
1.3.2 Global High Density Interconnect Historic Market Size Review by Type (2018-2023)
1.3.3 Global High Density Interconnect Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America High Density Interconnect Sales Breakdown by Type (2018-2023)
1.4.2 Europe High Density Interconnect Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific High Density Interconnect Sales Breakdown by Type (2018-2023)
1.4.4 Latin America High Density Interconnect Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa High Density Interconnect Sales Breakdown by Type (2018-2023)
2 Global High Density Interconnect Market Competition by Company
2.1 Global Top Players by High Density Interconnect Sales (2018-2023)
2.2 Global Top Players by High Density Interconnect Revenue (2018-2023)
2.3 Global Top Players by High Density Interconnect Price (2018-2023)
2.4 Global Top Manufacturers High Density Interconnect Manufacturing Base Distribution, Sales Area, Product Type
2.5 High Density Interconnect Market Competitive Situation and Trends
2.5.1 High Density Interconnect Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by High Density Interconnect Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in High Density Interconnect as of 2022)
2.7 Date of Key Manufacturers Enter into High Density Interconnect Market
2.8 Key Manufacturers High Density Interconnect Product Offered
2.9 Mergers & Acquisitions, Expansion
3 High Density Interconnect Status and Outlook by Region
3.1 Global High Density Interconnect Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global High Density Interconnect Historic Market Size by Region
3.2.1 Global High Density Interconnect Sales in Volume by Region (2018-2023)
3.2.2 Global High Density Interconnect Sales in Value by Region (2018-2023)
3.2.3 Global High Density Interconnect Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global High Density Interconnect Forecasted Market Size by Region
3.3.1 Global High Density Interconnect Sales in Volume by Region (2024-2029)
3.3.2 Global High Density Interconnect Sales in Value by Region (2024-2029)
3.3.3 Global High Density Interconnect Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global High Density Interconnect by Application
4.1 High Density Interconnect Market Segment by Application
4.1.1 Automotive Electronics
4.1.2 Consumer Electronics
4.1.3 Other Electronic Products
4.2 Global High Density Interconnect Market Size by Application
4.2.1 Global High Density Interconnect Market Size Overview by Application (2018-2029)
4.2.2 Global High Density Interconnect Historic Market Size Review by Application (2018-2023)
4.2.3 Global High Density Interconnect Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America High Density Interconnect Sales Breakdown by Application (2018-2023)
4.3.2 Europe High Density Interconnect Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific High Density Interconnect Sales Breakdown by Application (2018-2023)
4.3.4 Latin America High Density Interconnect Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa High Density Interconnect Sales Breakdown by Application (2018-2023)
5 North America High Density Interconnect by Country
5.1 North America High Density Interconnect Historic Market Size by Country
5.1.1 North America High Density Interconnect Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America High Density Interconnect Sales in Volume by Country (2018-2023)
5.1.3 North America High Density Interconnect Sales in Value by Country (2018-2023)
5.2 North America High Density Interconnect Forecasted Market Size by Country
5.2.1 North America High Density Interconnect Sales in Volume by Country (2024-2029)
5.2.2 North America High Density Interconnect Sales in Value by Country (2024-2029)
6 Europe High Density Interconnect by Country
6.1 Europe High Density Interconnect Historic Market Size by Country
6.1.1 Europe High Density Interconnect Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe High Density Interconnect Sales in Volume by Country (2018-2023)
6.1.3 Europe High Density Interconnect Sales in Value by Country (2018-2023)
6.2 Europe High Density Interconnect Forecasted Market Size by Country
6.2.1 Europe High Density Interconnect Sales in Volume by Country (2024-2029)
6.2.2 Europe High Density Interconnect Sales in Value by Country (2024-2029)
7 Asia-Pacific High Density Interconnect by Region
7.1 Asia-Pacific High Density Interconnect Historic Market Size by Region
7.1.1 Asia-Pacific High Density Interconnect Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific High Density Interconnect Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific High Density Interconnect Sales in Value by Region (2018-2023)
7.2 Asia-Pacific High Density Interconnect Forecasted Market Size by Region
7.2.1 Asia-Pacific High Density Interconnect Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific High Density Interconnect Sales in Value by Region (2024-2029)
8 Latin America High Density Interconnect by Country
8.1 Latin America High Density Interconnect Historic Market Size by Country
8.1.1 Latin America High Density Interconnect Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America High Density Interconnect Sales in Volume by Country (2018-2023)
8.1.3 Latin America High Density Interconnect Sales in Value by Country (2018-2023)
8.2 Latin America High Density Interconnect Forecasted Market Size by Country
8.2.1 Latin America High Density Interconnect Sales in Volume by Country (2024-2029)
8.2.2 Latin America High Density Interconnect Sales in Value by Country (2024-2029)
9 Middle East and Africa High Density Interconnect by Country
9.1 Middle East and Africa High Density Interconnect Historic Market Size by Country
9.1.1 Middle East and Africa High Density Interconnect Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa High Density Interconnect Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa High Density Interconnect Sales in Value by Country (2018-2023)
9.2 Middle East and Africa High Density Interconnect Forecasted Market Size by Country
9.2.1 Middle East and Africa High Density Interconnect Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa High Density Interconnect Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 IBIDEN Group
10.1.1 IBIDEN Group Company Information
10.1.2 IBIDEN Group Introduction and Business Overview
10.1.3 IBIDEN Group High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.1.4 IBIDEN Group High Density Interconnect Products Offered
10.1.5 IBIDEN Group Recent Development
10.2 Unimicron
10.2.1 Unimicron Company Information
10.2.2 Unimicron Introduction and Business Overview
10.2.3 Unimicron High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Unimicron High Density Interconnect Products Offered
10.2.5 Unimicron Recent Development
10.3 AT&S
10.3.1 AT&S Company Information
10.3.2 AT&S Introduction and Business Overview
10.3.3 AT&S High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.3.4 AT&S High Density Interconnect Products Offered
10.3.5 AT&S Recent Development
10.4 SEMCO
10.4.1 SEMCO Company Information
10.4.2 SEMCO Introduction and Business Overview
10.4.3 SEMCO High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.4.4 SEMCO High Density Interconnect Products Offered
10.4.5 SEMCO Recent Development
10.5 NCAB Group
10.5.1 NCAB Group Company Information
10.5.2 NCAB Group Introduction and Business Overview
10.5.3 NCAB Group High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.5.4 NCAB Group High Density Interconnect Products Offered
10.5.5 NCAB Group Recent Development
10.6 Young Poong Group
10.6.1 Young Poong Group Company Information
10.6.2 Young Poong Group Introduction and Business Overview
10.6.3 Young Poong Group High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Young Poong Group High Density Interconnect Products Offered
10.6.5 Young Poong Group Recent Development
10.7 ZDT
10.7.1 ZDT Company Information
10.7.2 ZDT Introduction and Business Overview
10.7.3 ZDT High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.7.4 ZDT High Density Interconnect Products Offered
10.7.5 ZDT Recent Development
10.8 Compeq
10.8.1 Compeq Company Information
10.8.2 Compeq Introduction and Business Overview
10.8.3 Compeq High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Compeq High Density Interconnect Products Offered
10.8.5 Compeq Recent Development
10.9 Unitech Printed Circuit Board Corp.
10.9.1 Unitech Printed Circuit Board Corp. Company Information
10.9.2 Unitech Printed Circuit Board Corp. Introduction and Business Overview
10.9.3 Unitech Printed Circuit Board Corp. High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Unitech Printed Circuit Board Corp. High Density Interconnect Products Offered
10.9.5 Unitech Printed Circuit Board Corp. Recent Development
10.10 LG Innotek
10.10.1 LG Innotek Company Information
10.10.2 LG Innotek Introduction and Business Overview
10.10.3 LG Innotek High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.10.4 LG Innotek High Density Interconnect Products Offered
10.10.5 LG Innotek Recent Development
10.11 Tripod Technology
10.11.1 Tripod Technology Company Information
10.11.2 Tripod Technology Introduction and Business Overview
10.11.3 Tripod Technology High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Tripod Technology High Density Interconnect Products Offered
10.11.5 Tripod Technology Recent Development
10.12 TTM Technologies
10.12.1 TTM Technologies Company Information
10.12.2 TTM Technologies Introduction and Business Overview
10.12.3 TTM Technologies High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.12.4 TTM Technologies High Density Interconnect Products Offered
10.12.5 TTM Technologies Recent Development
10.13 Daeduck
10.13.1 Daeduck Company Information
10.13.2 Daeduck Introduction and Business Overview
10.13.3 Daeduck High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Daeduck High Density Interconnect Products Offered
10.13.5 Daeduck Recent Development
10.14 HannStar Board
10.14.1 HannStar Board Company Information
10.14.2 HannStar Board Introduction and Business Overview
10.14.3 HannStar Board High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.14.4 HannStar Board High Density Interconnect Products Offered
10.14.5 HannStar Board Recent Development
10.15 Nan Ya PCB
10.15.1 Nan Ya PCB Company Information
10.15.2 Nan Ya PCB Introduction and Business Overview
10.15.3 Nan Ya PCB High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.15.4 Nan Ya PCB High Density Interconnect Products Offered
10.15.5 Nan Ya PCB Recent Development
10.16 CMK Corporation
10.16.1 CMK Corporation Company Information
10.16.2 CMK Corporation Introduction and Business Overview
10.16.3 CMK Corporation High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.16.4 CMK Corporation High Density Interconnect Products Offered
10.16.5 CMK Corporation Recent Development
10.17 Kingboard
10.17.1 Kingboard Company Information
10.17.2 Kingboard Introduction and Business Overview
10.17.3 Kingboard High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.17.4 Kingboard High Density Interconnect Products Offered
10.17.5 Kingboard Recent Development
10.18 Ellington
10.18.1 Ellington Company Information
10.18.2 Ellington Introduction and Business Overview
10.18.3 Ellington High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.18.4 Ellington High Density Interconnect Products Offered
10.18.5 Ellington Recent Development
10.19 CCTC
10.19.1 CCTC Company Information
10.19.2 CCTC Introduction and Business Overview
10.19.3 CCTC High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.19.4 CCTC High Density Interconnect Products Offered
10.19.5 CCTC Recent Development
10.20 Wuzhu Technology
10.20.1 Wuzhu Technology Company Information
10.20.2 Wuzhu Technology Introduction and Business Overview
10.20.3 Wuzhu Technology High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.20.4 Wuzhu Technology High Density Interconnect Products Offered
10.20.5 Wuzhu Technology Recent Development
10.21 Kinwong
10.21.1 Kinwong Company Information
10.21.2 Kinwong Introduction and Business Overview
10.21.3 Kinwong High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.21.4 Kinwong High Density Interconnect Products Offered
10.21.5 Kinwong Recent Development
10.22 Aoshikang
10.22.1 Aoshikang Company Information
10.22.2 Aoshikang Introduction and Business Overview
10.22.3 Aoshikang High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.22.4 Aoshikang High Density Interconnect Products Offered
10.22.5 Aoshikang Recent Development
10.23 Sierra Circuits
10.23.1 Sierra Circuits Company Information
10.23.2 Sierra Circuits Introduction and Business Overview
10.23.3 Sierra Circuits High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.23.4 Sierra Circuits High Density Interconnect Products Offered
10.23.5 Sierra Circuits Recent Development
10.24 Bittele Electronics
10.24.1 Bittele Electronics Company Information
10.24.2 Bittele Electronics Introduction and Business Overview
10.24.3 Bittele Electronics High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.24.4 Bittele Electronics High Density Interconnect Products Offered
10.24.5 Bittele Electronics Recent Development
10.25 Epec
10.25.1 Epec Company Information
10.25.2 Epec Introduction and Business Overview
10.25.3 Epec High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.25.4 Epec High Density Interconnect Products Offered
10.25.5 Epec Recent Development
10.26 Würth Elektronik
10.26.1 Würth Elektronik Company Information
10.26.2 Würth Elektronik Introduction and Business Overview
10.26.3 Würth Elektronik High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.26.4 Würth Elektronik High Density Interconnect Products Offered
10.26.5 Würth Elektronik Recent Development
10.27 NOD Electronics
10.27.1 NOD Electronics Company Information
10.27.2 NOD Electronics Introduction and Business Overview
10.27.3 NOD Electronics High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.27.4 NOD Electronics High Density Interconnect Products Offered
10.27.5 NOD Electronics Recent Development
10.28 San Francisco Circuits
10.28.1 San Francisco Circuits Company Information
10.28.2 San Francisco Circuits Introduction and Business Overview
10.28.3 San Francisco Circuits High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.28.4 San Francisco Circuits High Density Interconnect Products Offered
10.28.5 San Francisco Circuits Recent Development
10.29 PCBCart
10.29.1 PCBCart Company Information
10.29.2 PCBCart Introduction and Business Overview
10.29.3 PCBCart High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.29.4 PCBCart High Density Interconnect Products Offered
10.29.5 PCBCart Recent Development
10.30 Advanced Circuits
10.30.1 Advanced Circuits Company Information
10.30.2 Advanced Circuits Introduction and Business Overview
10.30.3 Advanced Circuits High Density Interconnect Sales, Revenue and Gross Margin (2018-2023)
10.30.4 Advanced Circuits High Density Interconnect Products Offered
10.30.5 Advanced Circuits Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 High Density Interconnect Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 High Density Interconnect Industrial Chain Analysis
11.4 High Density Interconnect Market Dynamics
11.4.1 High Density Interconnect Industry Trends
11.4.2 High Density Interconnect Market Drivers
11.4.3 High Density Interconnect Market Challenges
11.4.4 High Density Interconnect Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 High Density Interconnect Distributors
12.3 High Density Interconnect Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer

Published By : QY Research

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