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Lead Solder Ball-Global Market Insights and Sales Trends 2024
Synopsis
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Lead Solder Ball market size is expected to reach US$ 30 million by 2029, growing at a CAGR of 6.3% from 2023 to 2029. The market is mainly driven by the significant applications of Lead Solder Ball in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Lead Solder Ball market. Up to 0.4 mm, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 0.4-0.6 mm segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Lead Solder Ball market, driven by demand from China, the second largest economy with some signs of stabilising, the Lead Solder Ball market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Lead Solder Ball, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Lead Solder Ball market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Lead Solder Ball market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Lead Solder Ball sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Lead Solder Ball covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global Lead Solder Ball market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Global Lead Solder Ball market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Lead Solder Ball market, Segment by Type:
Up to 0.4 mm
0.4-0.6 mm
Above 0.6 mm
Global Lead Solder Ball market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Lead Solder Ball manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Lead Solder Ball in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Lead Solder Ball market size is expected to reach US$ 30 million by 2029, growing at a CAGR of 6.3% from 2023 to 2029. The market is mainly driven by the significant applications of Lead Solder Ball in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Lead Solder Ball market. Up to 0.4 mm, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 0.4-0.6 mm segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Lead Solder Ball market, driven by demand from China, the second largest economy with some signs of stabilising, the Lead Solder Ball market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Lead Solder Ball, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Lead Solder Ball market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Lead Solder Ball market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Lead Solder Ball sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Lead Solder Ball covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global Lead Solder Ball market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Global Lead Solder Ball market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Lead Solder Ball market, Segment by Type:
Up to 0.4 mm
0.4-0.6 mm
Above 0.6 mm
Global Lead Solder Ball market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Lead Solder Ball manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Lead Solder Ball in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Lead Solder Ball Market Overview
1.1 Lead Solder Ball Product Overview
1.2 Lead Solder Ball Market Segment by Type
1.2.1 Up to 0.4 mm
1.2.2 0.4-0.6 mm
1.2.3 Above 0.6 mm
1.3 Global Lead Solder Ball Market Size by Type
1.3.1 Global Lead Solder Ball Market Size Overview by Type (2018-2029)
1.3.2 Global Lead Solder Ball Historic Market Size Review by Type (2018-2023)
1.3.3 Global Lead Solder Ball Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Lead Solder Ball Sales Breakdown by Type (2018-2023)
1.4.2 Europe Lead Solder Ball Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Lead Solder Ball Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Lead Solder Ball Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Lead Solder Ball Sales Breakdown by Type (2018-2023)
2 Global Lead Solder Ball Market Competition by Company
2.1 Global Top Players by Lead Solder Ball Sales (2018-2023)
2.2 Global Top Players by Lead Solder Ball Revenue (2018-2023)
2.3 Global Top Players by Lead Solder Ball Price (2018-2023)
2.4 Global Top Manufacturers Lead Solder Ball Manufacturing Base Distribution, Sales Area, Product Type
2.5 Lead Solder Ball Market Competitive Situation and Trends
2.5.1 Lead Solder Ball Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Lead Solder Ball Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Lead Solder Ball as of 2022)
2.7 Date of Key Manufacturers Enter into Lead Solder Ball Market
2.8 Key Manufacturers Lead Solder Ball Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Lead Solder Ball Status and Outlook by Region
3.1 Global Lead Solder Ball Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Lead Solder Ball Historic Market Size by Region
3.2.1 Global Lead Solder Ball Sales in Volume by Region (2018-2023)
3.2.2 Global Lead Solder Ball Sales in Value by Region (2018-2023)
3.2.3 Global Lead Solder Ball Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Lead Solder Ball Forecasted Market Size by Region
3.3.1 Global Lead Solder Ball Sales in Volume by Region (2024-2029)
3.3.2 Global Lead Solder Ball Sales in Value by Region (2024-2029)
3.3.3 Global Lead Solder Ball Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Lead Solder Ball by Application
4.1 Lead Solder Ball Market Segment by Application
4.1.1 BGA
4.1.2 CSP & WLCSP
4.1.3 Flip-Chip & Others
4.2 Global Lead Solder Ball Market Size by Application
4.2.1 Global Lead Solder Ball Market Size Overview by Application (2018-2029)
4.2.2 Global Lead Solder Ball Historic Market Size Review by Application (2018-2023)
4.2.3 Global Lead Solder Ball Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Lead Solder Ball Sales Breakdown by Application (2018-2023)
4.3.2 Europe Lead Solder Ball Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Lead Solder Ball Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Lead Solder Ball Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Lead Solder Ball Sales Breakdown by Application (2018-2023)
5 North America Lead Solder Ball by Country
5.1 North America Lead Solder Ball Historic Market Size by Country
5.1.1 North America Lead Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Lead Solder Ball Sales in Volume by Country (2018-2023)
5.1.3 North America Lead Solder Ball Sales in Value by Country (2018-2023)
5.2 North America Lead Solder Ball Forecasted Market Size by Country
5.2.1 North America Lead Solder Ball Sales in Volume by Country (2024-2029)
5.2.2 North America Lead Solder Ball Sales in Value by Country (2024-2029)
6 Europe Lead Solder Ball by Country
6.1 Europe Lead Solder Ball Historic Market Size by Country
6.1.1 Europe Lead Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Lead Solder Ball Sales in Volume by Country (2018-2023)
6.1.3 Europe Lead Solder Ball Sales in Value by Country (2018-2023)
6.2 Europe Lead Solder Ball Forecasted Market Size by Country
6.2.1 Europe Lead Solder Ball Sales in Volume by Country (2024-2029)
6.2.2 Europe Lead Solder Ball Sales in Value by Country (2024-2029)
7 Asia-Pacific Lead Solder Ball by Region
7.1 Asia-Pacific Lead Solder Ball Historic Market Size by Region
7.1.1 Asia-Pacific Lead Solder Ball Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Lead Solder Ball Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Lead Solder Ball Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Lead Solder Ball Forecasted Market Size by Region
7.2.1 Asia-Pacific Lead Solder Ball Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Lead Solder Ball Sales in Value by Region (2024-2029)
8 Latin America Lead Solder Ball by Country
8.1 Latin America Lead Solder Ball Historic Market Size by Country
8.1.1 Latin America Lead Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Lead Solder Ball Sales in Volume by Country (2018-2023)
8.1.3 Latin America Lead Solder Ball Sales in Value by Country (2018-2023)
8.2 Latin America Lead Solder Ball Forecasted Market Size by Country
8.2.1 Latin America Lead Solder Ball Sales in Volume by Country (2024-2029)
8.2.2 Latin America Lead Solder Ball Sales in Value by Country (2024-2029)
9 Middle East and Africa Lead Solder Ball by Country
9.1 Middle East and Africa Lead Solder Ball Historic Market Size by Country
9.1.1 Middle East and Africa Lead Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Lead Solder Ball Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Lead Solder Ball Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Lead Solder Ball Forecasted Market Size by Country
9.2.1 Middle East and Africa Lead Solder Ball Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Lead Solder Ball Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Senju Metal
10.1.1 Senju Metal Company Information
10.1.2 Senju Metal Introduction and Business Overview
10.1.3 Senju Metal Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Senju Metal Lead Solder Ball Products Offered
10.1.5 Senju Metal Recent Development
10.2 DS HiMetal
10.2.1 DS HiMetal Company Information
10.2.2 DS HiMetal Introduction and Business Overview
10.2.3 DS HiMetal Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.2.4 DS HiMetal Lead Solder Ball Products Offered
10.2.5 DS HiMetal Recent Development
10.3 MKE
10.3.1 MKE Company Information
10.3.2 MKE Introduction and Business Overview
10.3.3 MKE Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.3.4 MKE Lead Solder Ball Products Offered
10.3.5 MKE Recent Development
10.4 YCTC
10.4.1 YCTC Company Information
10.4.2 YCTC Introduction and Business Overview
10.4.3 YCTC Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.4.4 YCTC Lead Solder Ball Products Offered
10.4.5 YCTC Recent Development
10.5 Accurus
10.5.1 Accurus Company Information
10.5.2 Accurus Introduction and Business Overview
10.5.3 Accurus Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Accurus Lead Solder Ball Products Offered
10.5.5 Accurus Recent Development
10.6 PMTC
10.6.1 PMTC Company Information
10.6.2 PMTC Introduction and Business Overview
10.6.3 PMTC Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.6.4 PMTC Lead Solder Ball Products Offered
10.6.5 PMTC Recent Development
10.7 Shanghai hiking solder material
10.7.1 Shanghai hiking solder material Company Information
10.7.2 Shanghai hiking solder material Introduction and Business Overview
10.7.3 Shanghai hiking solder material Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shanghai hiking solder material Lead Solder Ball Products Offered
10.7.5 Shanghai hiking solder material Recent Development
10.8 Shenmao Technology
10.8.1 Shenmao Technology Company Information
10.8.2 Shenmao Technology Introduction and Business Overview
10.8.3 Shenmao Technology Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Shenmao Technology Lead Solder Ball Products Offered
10.8.5 Shenmao Technology Recent Development
10.9 Nippon Micrometal
10.9.1 Nippon Micrometal Company Information
10.9.2 Nippon Micrometal Introduction and Business Overview
10.9.3 Nippon Micrometal Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Nippon Micrometal Lead Solder Ball Products Offered
10.9.5 Nippon Micrometal Recent Development
10.10 Indium Corporation
10.10.1 Indium Corporation Company Information
10.10.2 Indium Corporation Introduction and Business Overview
10.10.3 Indium Corporation Lead Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Indium Corporation Lead Solder Ball Products Offered
10.10.5 Indium Corporation Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Lead Solder Ball Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Lead Solder Ball Industrial Chain Analysis
11.4 Lead Solder Ball Market Dynamics
11.4.1 Lead Solder Ball Industry Trends
11.4.2 Lead Solder Ball Market Drivers
11.4.3 Lead Solder Ball Market Challenges
11.4.4 Lead Solder Ball Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Lead Solder Ball Distributors
12.3 Lead Solder Ball Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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