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Molded Case Wirewound Chip-Global Market Insights and Sales Trends 2024
Synopsis
The global Molded Case Wirewound Chip market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Molded Case Wirewound Chip in various end use industries. The expanding demands from the Electronics, Automotive, Aerospace and Others, are propelling Molded Case Wirewound Chip market. PEN, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the PET segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Molded Case Wirewound Chip, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Molded Case Wirewound Chip market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Molded Case Wirewound Chip market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Molded Case Wirewound Chip sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Molded Case Wirewound Chip covered in this report include AVX, Kemet, KOA, Murata, Nichicon, Panasonic, SEMCO, TDK and Vishay, etc.
The global Molded Case Wirewound Chip market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
AVX
Kemet
KOA
Murata
Nichicon
Panasonic
SEMCO
TDK
Vishay
Yageo
Global Molded Case Wirewound Chip market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Molded Case Wirewound Chip market, Segment by Type:
PEN
PET
PPS
Global Molded Case Wirewound Chip market, by Application
Electronics
Automotive
Aerospace
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Molded Case Wirewound Chip manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Molded Case Wirewound Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Molded Case Wirewound Chip market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Molded Case Wirewound Chip in various end use industries. The expanding demands from the Electronics, Automotive, Aerospace and Others, are propelling Molded Case Wirewound Chip market. PEN, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the PET segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Molded Case Wirewound Chip, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Molded Case Wirewound Chip market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Molded Case Wirewound Chip market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Molded Case Wirewound Chip sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Molded Case Wirewound Chip covered in this report include AVX, Kemet, KOA, Murata, Nichicon, Panasonic, SEMCO, TDK and Vishay, etc.
The global Molded Case Wirewound Chip market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
AVX
Kemet
KOA
Murata
Nichicon
Panasonic
SEMCO
TDK
Vishay
Yageo
Global Molded Case Wirewound Chip market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Molded Case Wirewound Chip market, Segment by Type:
PEN
PET
PPS
Global Molded Case Wirewound Chip market, by Application
Electronics
Automotive
Aerospace
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Molded Case Wirewound Chip manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Molded Case Wirewound Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Molded Case Wirewound Chip Market Overview
1.1 Molded Case Wirewound Chip Product Overview
1.2 Molded Case Wirewound Chip Market Segment by Type
1.2.1 PEN
1.2.2 PET
1.2.3 PPS
1.3 Global Molded Case Wirewound Chip Market Size by Type
1.3.1 Global Molded Case Wirewound Chip Market Size Overview by Type (2018-2029)
1.3.2 Global Molded Case Wirewound Chip Historic Market Size Review by Type (2018-2023)
1.3.3 Global Molded Case Wirewound Chip Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Molded Case Wirewound Chip Sales Breakdown by Type (2018-2023)
1.4.2 Europe Molded Case Wirewound Chip Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Molded Case Wirewound Chip Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Molded Case Wirewound Chip Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Molded Case Wirewound Chip Sales Breakdown by Type (2018-2023)
2 Global Molded Case Wirewound Chip Market Competition by Company
2.1 Global Top Players by Molded Case Wirewound Chip Sales (2018-2023)
2.2 Global Top Players by Molded Case Wirewound Chip Revenue (2018-2023)
2.3 Global Top Players by Molded Case Wirewound Chip Price (2018-2023)
2.4 Global Top Manufacturers Molded Case Wirewound Chip Manufacturing Base Distribution, Sales Area, Product Type
2.5 Molded Case Wirewound Chip Market Competitive Situation and Trends
2.5.1 Molded Case Wirewound Chip Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Molded Case Wirewound Chip Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Molded Case Wirewound Chip as of 2022)
2.7 Date of Key Manufacturers Enter into Molded Case Wirewound Chip Market
2.8 Key Manufacturers Molded Case Wirewound Chip Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Molded Case Wirewound Chip Status and Outlook by Region
3.1 Global Molded Case Wirewound Chip Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Molded Case Wirewound Chip Historic Market Size by Region
3.2.1 Global Molded Case Wirewound Chip Sales in Volume by Region (2018-2023)
3.2.2 Global Molded Case Wirewound Chip Sales in Value by Region (2018-2023)
3.2.3 Global Molded Case Wirewound Chip Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Molded Case Wirewound Chip Forecasted Market Size by Region
3.3.1 Global Molded Case Wirewound Chip Sales in Volume by Region (2024-2029)
3.3.2 Global Molded Case Wirewound Chip Sales in Value by Region (2024-2029)
3.3.3 Global Molded Case Wirewound Chip Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Molded Case Wirewound Chip by Application
4.1 Molded Case Wirewound Chip Market Segment by Application
4.1.1 Electronics
4.1.2 Automotive
4.1.3 Aerospace
4.1.4 Others
4.2 Global Molded Case Wirewound Chip Market Size by Application
4.2.1 Global Molded Case Wirewound Chip Market Size Overview by Application (2018-2029)
4.2.2 Global Molded Case Wirewound Chip Historic Market Size Review by Application (2018-2023)
4.2.3 Global Molded Case Wirewound Chip Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Molded Case Wirewound Chip Sales Breakdown by Application (2018-2023)
4.3.2 Europe Molded Case Wirewound Chip Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Molded Case Wirewound Chip Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Molded Case Wirewound Chip Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Molded Case Wirewound Chip Sales Breakdown by Application (2018-2023)
5 North America Molded Case Wirewound Chip by Country
5.1 North America Molded Case Wirewound Chip Historic Market Size by Country
5.1.1 North America Molded Case Wirewound Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Molded Case Wirewound Chip Sales in Volume by Country (2018-2023)
5.1.3 North America Molded Case Wirewound Chip Sales in Value by Country (2018-2023)
5.2 North America Molded Case Wirewound Chip Forecasted Market Size by Country
5.2.1 North America Molded Case Wirewound Chip Sales in Volume by Country (2024-2029)
5.2.2 North America Molded Case Wirewound Chip Sales in Value by Country (2024-2029)
6 Europe Molded Case Wirewound Chip by Country
6.1 Europe Molded Case Wirewound Chip Historic Market Size by Country
6.1.1 Europe Molded Case Wirewound Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Molded Case Wirewound Chip Sales in Volume by Country (2018-2023)
6.1.3 Europe Molded Case Wirewound Chip Sales in Value by Country (2018-2023)
6.2 Europe Molded Case Wirewound Chip Forecasted Market Size by Country
6.2.1 Europe Molded Case Wirewound Chip Sales in Volume by Country (2024-2029)
6.2.2 Europe Molded Case Wirewound Chip Sales in Value by Country (2024-2029)
7 Asia-Pacific Molded Case Wirewound Chip by Region
7.1 Asia-Pacific Molded Case Wirewound Chip Historic Market Size by Region
7.1.1 Asia-Pacific Molded Case Wirewound Chip Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Molded Case Wirewound Chip Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Molded Case Wirewound Chip Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Molded Case Wirewound Chip Forecasted Market Size by Region
7.2.1 Asia-Pacific Molded Case Wirewound Chip Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Molded Case Wirewound Chip Sales in Value by Region (2024-2029)
8 Latin America Molded Case Wirewound Chip by Country
8.1 Latin America Molded Case Wirewound Chip Historic Market Size by Country
8.1.1 Latin America Molded Case Wirewound Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Molded Case Wirewound Chip Sales in Volume by Country (2018-2023)
8.1.3 Latin America Molded Case Wirewound Chip Sales in Value by Country (2018-2023)
8.2 Latin America Molded Case Wirewound Chip Forecasted Market Size by Country
8.2.1 Latin America Molded Case Wirewound Chip Sales in Volume by Country (2024-2029)
8.2.2 Latin America Molded Case Wirewound Chip Sales in Value by Country (2024-2029)
9 Middle East and Africa Molded Case Wirewound Chip by Country
9.1 Middle East and Africa Molded Case Wirewound Chip Historic Market Size by Country
9.1.1 Middle East and Africa Molded Case Wirewound Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Molded Case Wirewound Chip Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Molded Case Wirewound Chip Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Molded Case Wirewound Chip Forecasted Market Size by Country
9.2.1 Middle East and Africa Molded Case Wirewound Chip Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Molded Case Wirewound Chip Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 AVX
10.1.1 AVX Company Information
10.1.2 AVX Introduction and Business Overview
10.1.3 AVX Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.1.4 AVX Molded Case Wirewound Chip Products Offered
10.1.5 AVX Recent Development
10.2 Kemet
10.2.1 Kemet Company Information
10.2.2 Kemet Introduction and Business Overview
10.2.3 Kemet Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Kemet Molded Case Wirewound Chip Products Offered
10.2.5 Kemet Recent Development
10.3 KOA
10.3.1 KOA Company Information
10.3.2 KOA Introduction and Business Overview
10.3.3 KOA Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.3.4 KOA Molded Case Wirewound Chip Products Offered
10.3.5 KOA Recent Development
10.4 Murata
10.4.1 Murata Company Information
10.4.2 Murata Introduction and Business Overview
10.4.3 Murata Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Murata Molded Case Wirewound Chip Products Offered
10.4.5 Murata Recent Development
10.5 Nichicon
10.5.1 Nichicon Company Information
10.5.2 Nichicon Introduction and Business Overview
10.5.3 Nichicon Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Nichicon Molded Case Wirewound Chip Products Offered
10.5.5 Nichicon Recent Development
10.6 Panasonic
10.6.1 Panasonic Company Information
10.6.2 Panasonic Introduction and Business Overview
10.6.3 Panasonic Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Panasonic Molded Case Wirewound Chip Products Offered
10.6.5 Panasonic Recent Development
10.7 SEMCO
10.7.1 SEMCO Company Information
10.7.2 SEMCO Introduction and Business Overview
10.7.3 SEMCO Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.7.4 SEMCO Molded Case Wirewound Chip Products Offered
10.7.5 SEMCO Recent Development
10.8 TDK
10.8.1 TDK Company Information
10.8.2 TDK Introduction and Business Overview
10.8.3 TDK Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.8.4 TDK Molded Case Wirewound Chip Products Offered
10.8.5 TDK Recent Development
10.9 Vishay
10.9.1 Vishay Company Information
10.9.2 Vishay Introduction and Business Overview
10.9.3 Vishay Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Vishay Molded Case Wirewound Chip Products Offered
10.9.5 Vishay Recent Development
10.10 Yageo
10.10.1 Yageo Company Information
10.10.2 Yageo Introduction and Business Overview
10.10.3 Yageo Molded Case Wirewound Chip Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Yageo Molded Case Wirewound Chip Products Offered
10.10.5 Yageo Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Molded Case Wirewound Chip Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Molded Case Wirewound Chip Industrial Chain Analysis
11.4 Molded Case Wirewound Chip Market Dynamics
11.4.1 Molded Case Wirewound Chip Industry Trends
11.4.2 Molded Case Wirewound Chip Market Drivers
11.4.3 Molded Case Wirewound Chip Market Challenges
11.4.4 Molded Case Wirewound Chip Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Molded Case Wirewound Chip Distributors
12.3 Molded Case Wirewound Chip Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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