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Molded Interconnect Devices (MID)-Global Market Insights and Sales Trends 2024

Molded Interconnect Devices (MID)-Global Market Insights and Sales Trends 2024

Publishing Date : Nov, 2023

License Type :
 

Report Code : 1838074

No of Pages : 90

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Synopsis
The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.
The global Molded Interconnect Devices (MID) market size is expected to reach US$ 943.1 million by 2029, growing at a CAGR of 6.4% from 2023 to 2029. The market is mainly driven by the significant applications of Molded Interconnect Devices (MID) in various end use industries. The expanding demands from the Automotive, Consumer Products, Healthcare and Industrial, are propelling Molded Interconnect Devices (MID) market. Laser Direct Structuring (LDS), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Two-Shot Molding segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Molded Interconnect Devices (MID) market, driven by demand from China, the second largest economy with some signs of stabilising, the Molded Interconnect Devices (MID) market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Molded Interconnect Devices (MID), with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Molded Interconnect Devices (MID) market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Molded Interconnect Devices (MID) market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Molded Interconnect Devices (MID) sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Molded Interconnect Devices (MID) covered in this report include MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies and RTP company, etc.
The global Molded Interconnect Devices (MID) market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
MacDermid Enthone
Molex
LPKF Laser & Electronics
TE Connectivity
Harting Mitronics AG
SelectConnect Technologies
RTP company
Global Molded Interconnect Devices (MID) market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Molded Interconnect Devices (MID) market, Segment by Type:
Laser Direct Structuring (LDS)
Two-Shot Molding
Others
Global Molded Interconnect Devices (MID) market, by Application
Automotive
Consumer Products
Healthcare
Industrial
Military & Aerospace
Telecommunication & Computing
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Molded Interconnect Devices (MID) manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Molded Interconnect Devices (MID) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index
1 Molded Interconnect Devices (MID) Market Overview
1.1 Molded Interconnect Devices (MID) Product Overview
1.2 Molded Interconnect Devices (MID) Market Segment by Type
1.2.1 Laser Direct Structuring (LDS)
1.2.2 Two-Shot Molding
1.2.3 Others
1.3 Global Molded Interconnect Devices (MID) Market Size by Type
1.3.1 Global Molded Interconnect Devices (MID) Market Size Overview by Type (2018-2029)
1.3.2 Global Molded Interconnect Devices (MID) Historic Market Size Review by Type (2018-2023)
1.3.3 Global Molded Interconnect Devices (MID) Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Molded Interconnect Devices (MID) Sales Breakdown by Type (2018-2023)
1.4.2 Europe Molded Interconnect Devices (MID) Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Molded Interconnect Devices (MID) Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Molded Interconnect Devices (MID) Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Molded Interconnect Devices (MID) Sales Breakdown by Type (2018-2023)
2 Global Molded Interconnect Devices (MID) Market Competition by Company
2.1 Global Top Players by Molded Interconnect Devices (MID) Sales (2018-2023)
2.2 Global Top Players by Molded Interconnect Devices (MID) Revenue (2018-2023)
2.3 Global Top Players by Molded Interconnect Devices (MID) Price (2018-2023)
2.4 Global Top Manufacturers Molded Interconnect Devices (MID) Manufacturing Base Distribution, Sales Area, Product Type
2.5 Molded Interconnect Devices (MID) Market Competitive Situation and Trends
2.5.1 Molded Interconnect Devices (MID) Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Molded Interconnect Devices (MID) Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Molded Interconnect Devices (MID) as of 2022)
2.7 Date of Key Manufacturers Enter into Molded Interconnect Devices (MID) Market
2.8 Key Manufacturers Molded Interconnect Devices (MID) Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Molded Interconnect Devices (MID) Status and Outlook by Region
3.1 Global Molded Interconnect Devices (MID) Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Molded Interconnect Devices (MID) Historic Market Size by Region
3.2.1 Global Molded Interconnect Devices (MID) Sales in Volume by Region (2018-2023)
3.2.2 Global Molded Interconnect Devices (MID) Sales in Value by Region (2018-2023)
3.2.3 Global Molded Interconnect Devices (MID) Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Molded Interconnect Devices (MID) Forecasted Market Size by Region
3.3.1 Global Molded Interconnect Devices (MID) Sales in Volume by Region (2024-2029)
3.3.2 Global Molded Interconnect Devices (MID) Sales in Value by Region (2024-2029)
3.3.3 Global Molded Interconnect Devices (MID) Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Molded Interconnect Devices (MID) by Application
4.1 Molded Interconnect Devices (MID) Market Segment by Application
4.1.1 Automotive
4.1.2 Consumer Products
4.1.3 Healthcare
4.1.4 Industrial
4.1.5 Military & Aerospace
4.1.6 Telecommunication & Computing
4.2 Global Molded Interconnect Devices (MID) Market Size by Application
4.2.1 Global Molded Interconnect Devices (MID) Market Size Overview by Application (2018-2029)
4.2.2 Global Molded Interconnect Devices (MID) Historic Market Size Review by Application (2018-2023)
4.2.3 Global Molded Interconnect Devices (MID) Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Molded Interconnect Devices (MID) Sales Breakdown by Application (2018-2023)
4.3.2 Europe Molded Interconnect Devices (MID) Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Molded Interconnect Devices (MID) Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Molded Interconnect Devices (MID) Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Molded Interconnect Devices (MID) Sales Breakdown by Application (2018-2023)
5 North America Molded Interconnect Devices (MID) by Country
5.1 North America Molded Interconnect Devices (MID) Historic Market Size by Country
5.1.1 North America Molded Interconnect Devices (MID) Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Molded Interconnect Devices (MID) Sales in Volume by Country (2018-2023)
5.1.3 North America Molded Interconnect Devices (MID) Sales in Value by Country (2018-2023)
5.2 North America Molded Interconnect Devices (MID) Forecasted Market Size by Country
5.2.1 North America Molded Interconnect Devices (MID) Sales in Volume by Country (2024-2029)
5.2.2 North America Molded Interconnect Devices (MID) Sales in Value by Country (2024-2029)
6 Europe Molded Interconnect Devices (MID) by Country
6.1 Europe Molded Interconnect Devices (MID) Historic Market Size by Country
6.1.1 Europe Molded Interconnect Devices (MID) Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Molded Interconnect Devices (MID) Sales in Volume by Country (2018-2023)
6.1.3 Europe Molded Interconnect Devices (MID) Sales in Value by Country (2018-2023)
6.2 Europe Molded Interconnect Devices (MID) Forecasted Market Size by Country
6.2.1 Europe Molded Interconnect Devices (MID) Sales in Volume by Country (2024-2029)
6.2.2 Europe Molded Interconnect Devices (MID) Sales in Value by Country (2024-2029)
7 Asia-Pacific Molded Interconnect Devices (MID) by Region
7.1 Asia-Pacific Molded Interconnect Devices (MID) Historic Market Size by Region
7.1.1 Asia-Pacific Molded Interconnect Devices (MID) Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Molded Interconnect Devices (MID) Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Molded Interconnect Devices (MID) Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Molded Interconnect Devices (MID) Forecasted Market Size by Region
7.2.1 Asia-Pacific Molded Interconnect Devices (MID) Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Molded Interconnect Devices (MID) Sales in Value by Region (2024-2029)
8 Latin America Molded Interconnect Devices (MID) by Country
8.1 Latin America Molded Interconnect Devices (MID) Historic Market Size by Country
8.1.1 Latin America Molded Interconnect Devices (MID) Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Molded Interconnect Devices (MID) Sales in Volume by Country (2018-2023)
8.1.3 Latin America Molded Interconnect Devices (MID) Sales in Value by Country (2018-2023)
8.2 Latin America Molded Interconnect Devices (MID) Forecasted Market Size by Country
8.2.1 Latin America Molded Interconnect Devices (MID) Sales in Volume by Country (2024-2029)
8.2.2 Latin America Molded Interconnect Devices (MID) Sales in Value by Country (2024-2029)
9 Middle East and Africa Molded Interconnect Devices (MID) by Country
9.1 Middle East and Africa Molded Interconnect Devices (MID) Historic Market Size by Country
9.1.1 Middle East and Africa Molded Interconnect Devices (MID) Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Molded Interconnect Devices (MID) Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Molded Interconnect Devices (MID) Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Molded Interconnect Devices (MID) Forecasted Market Size by Country
9.2.1 Middle East and Africa Molded Interconnect Devices (MID) Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Molded Interconnect Devices (MID) Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 MacDermid Enthone
10.1.1 MacDermid Enthone Company Information
10.1.2 MacDermid Enthone Introduction and Business Overview
10.1.3 MacDermid Enthone Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.1.4 MacDermid Enthone Molded Interconnect Devices (MID) Products Offered
10.1.5 MacDermid Enthone Recent Development
10.2 Molex
10.2.1 Molex Company Information
10.2.2 Molex Introduction and Business Overview
10.2.3 Molex Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Molex Molded Interconnect Devices (MID) Products Offered
10.2.5 Molex Recent Development
10.3 LPKF Laser & Electronics
10.3.1 LPKF Laser & Electronics Company Information
10.3.2 LPKF Laser & Electronics Introduction and Business Overview
10.3.3 LPKF Laser & Electronics Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.3.4 LPKF Laser & Electronics Molded Interconnect Devices (MID) Products Offered
10.3.5 LPKF Laser & Electronics Recent Development
10.4 TE Connectivity
10.4.1 TE Connectivity Company Information
10.4.2 TE Connectivity Introduction and Business Overview
10.4.3 TE Connectivity Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.4.4 TE Connectivity Molded Interconnect Devices (MID) Products Offered
10.4.5 TE Connectivity Recent Development
10.5 Harting Mitronics AG
10.5.1 Harting Mitronics AG Company Information
10.5.2 Harting Mitronics AG Introduction and Business Overview
10.5.3 Harting Mitronics AG Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Harting Mitronics AG Molded Interconnect Devices (MID) Products Offered
10.5.5 Harting Mitronics AG Recent Development
10.6 SelectConnect Technologies
10.6.1 SelectConnect Technologies Company Information
10.6.2 SelectConnect Technologies Introduction and Business Overview
10.6.3 SelectConnect Technologies Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.6.4 SelectConnect Technologies Molded Interconnect Devices (MID) Products Offered
10.6.5 SelectConnect Technologies Recent Development
10.7 RTP company
10.7.1 RTP company Company Information
10.7.2 RTP company Introduction and Business Overview
10.7.3 RTP company Molded Interconnect Devices (MID) Sales, Revenue and Gross Margin (2018-2023)
10.7.4 RTP company Molded Interconnect Devices (MID) Products Offered
10.7.5 RTP company Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Molded Interconnect Devices (MID) Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Molded Interconnect Devices (MID) Industrial Chain Analysis
11.4 Molded Interconnect Devices (MID) Market Dynamics
11.4.1 Molded Interconnect Devices (MID) Industry Trends
11.4.2 Molded Interconnect Devices (MID) Market Drivers
11.4.3 Molded Interconnect Devices (MID) Market Challenges
11.4.4 Molded Interconnect Devices (MID) Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Molded Interconnect Devices (MID) Distributors
12.3 Molded Interconnect Devices (MID) Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer

Published By : QY Research

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