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Pastes for Die Bonding-Global Market Insights and Sales Trends 2024
Synopsis
The global Pastes for Die Bonding market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Pastes for Die Bonding in various end use industries. The expanding demands from the Lead Frame Package and Area Alley Package, are propelling Pastes for Die Bonding market. Conductive Die Bonding Pastes, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-Conductive Die Bonding Pastes segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Pastes for Die Bonding, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Pastes for Die Bonding market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Pastes for Die Bonding market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Pastes for Die Bonding sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Pastes for Die Bonding covered in this report include Sumitomo Bakelite, Showa Denko Materials, Henkel Adhesives, Heraeus, TANAKA Precious Metals, AI Technology, Alpha Advanced Materials, SMIC and Shenmao Technology, etc.
The global Pastes for Die Bonding market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Sumitomo Bakelite
Showa Denko Materials
Henkel Adhesives
Heraeus
TANAKA Precious Metals
AI Technology
Alpha Advanced Materials
SMIC
Shenmao Technology
Shenzhen Weite New Material
Tongfang Tech
AIM
Namics
Global Pastes for Die Bonding market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Pastes for Die Bonding market, Segment by Type:
Conductive Die Bonding Pastes
Non-Conductive Die Bonding Pastes
Full Sintering Conductive Die Bonding Pastes
Semi-Sintering Conductive Die Bonding Pastes
Global Pastes for Die Bonding market, by Application
Lead Frame Package
Area Alley Package
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Pastes for Die Bonding manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Pastes for Die Bonding in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Pastes for Die Bonding market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Pastes for Die Bonding in various end use industries. The expanding demands from the Lead Frame Package and Area Alley Package, are propelling Pastes for Die Bonding market. Conductive Die Bonding Pastes, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-Conductive Die Bonding Pastes segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Pastes for Die Bonding, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Pastes for Die Bonding market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Pastes for Die Bonding market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Pastes for Die Bonding sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Pastes for Die Bonding covered in this report include Sumitomo Bakelite, Showa Denko Materials, Henkel Adhesives, Heraeus, TANAKA Precious Metals, AI Technology, Alpha Advanced Materials, SMIC and Shenmao Technology, etc.
The global Pastes for Die Bonding market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Sumitomo Bakelite
Showa Denko Materials
Henkel Adhesives
Heraeus
TANAKA Precious Metals
AI Technology
Alpha Advanced Materials
SMIC
Shenmao Technology
Shenzhen Weite New Material
Tongfang Tech
AIM
Namics
Global Pastes for Die Bonding market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Pastes for Die Bonding market, Segment by Type:
Conductive Die Bonding Pastes
Non-Conductive Die Bonding Pastes
Full Sintering Conductive Die Bonding Pastes
Semi-Sintering Conductive Die Bonding Pastes
Global Pastes for Die Bonding market, by Application
Lead Frame Package
Area Alley Package
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Pastes for Die Bonding manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Pastes for Die Bonding in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Pastes for Die Bonding Market Overview
1.1 Pastes for Die Bonding Product Overview
1.2 Pastes for Die Bonding Market Segment by Type
1.2.1 Conductive Die Bonding Pastes
1.2.2 Non-Conductive Die Bonding Pastes
1.2.3 Full Sintering Conductive Die Bonding Pastes
1.2.4 Semi-Sintering Conductive Die Bonding Pastes
1.3 Global Pastes for Die Bonding Market Size by Type
1.3.1 Global Pastes for Die Bonding Market Size Overview by Type (2018-2029)
1.3.2 Global Pastes for Die Bonding Historic Market Size Review by Type (2018-2023)
1.3.3 Global Pastes for Die Bonding Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Pastes for Die Bonding Sales Breakdown by Type (2018-2023)
1.4.2 Europe Pastes for Die Bonding Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Pastes for Die Bonding Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Pastes for Die Bonding Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Pastes for Die Bonding Sales Breakdown by Type (2018-2023)
2 Global Pastes for Die Bonding Market Competition by Company
2.1 Global Top Players by Pastes for Die Bonding Sales (2018-2023)
2.2 Global Top Players by Pastes for Die Bonding Revenue (2018-2023)
2.3 Global Top Players by Pastes for Die Bonding Price (2018-2023)
2.4 Global Top Manufacturers Pastes for Die Bonding Manufacturing Base Distribution, Sales Area, Product Type
2.5 Pastes for Die Bonding Market Competitive Situation and Trends
2.5.1 Pastes for Die Bonding Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Pastes for Die Bonding Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Pastes for Die Bonding as of 2022)
2.7 Date of Key Manufacturers Enter into Pastes for Die Bonding Market
2.8 Key Manufacturers Pastes for Die Bonding Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Pastes for Die Bonding Status and Outlook by Region
3.1 Global Pastes for Die Bonding Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Pastes for Die Bonding Historic Market Size by Region
3.2.1 Global Pastes for Die Bonding Sales in Volume by Region (2018-2023)
3.2.2 Global Pastes for Die Bonding Sales in Value by Region (2018-2023)
3.2.3 Global Pastes for Die Bonding Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Pastes for Die Bonding Forecasted Market Size by Region
3.3.1 Global Pastes for Die Bonding Sales in Volume by Region (2024-2029)
3.3.2 Global Pastes for Die Bonding Sales in Value by Region (2024-2029)
3.3.3 Global Pastes for Die Bonding Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Pastes for Die Bonding by Application
4.1 Pastes for Die Bonding Market Segment by Application
4.1.1 Lead Frame Package
4.1.2 Area Alley Package
4.2 Global Pastes for Die Bonding Market Size by Application
4.2.1 Global Pastes for Die Bonding Market Size Overview by Application (2018-2029)
4.2.2 Global Pastes for Die Bonding Historic Market Size Review by Application (2018-2023)
4.2.3 Global Pastes for Die Bonding Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Pastes for Die Bonding Sales Breakdown by Application (2018-2023)
4.3.2 Europe Pastes for Die Bonding Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Pastes for Die Bonding Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Pastes for Die Bonding Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Pastes for Die Bonding Sales Breakdown by Application (2018-2023)
5 North America Pastes for Die Bonding by Country
5.1 North America Pastes for Die Bonding Historic Market Size by Country
5.1.1 North America Pastes for Die Bonding Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Pastes for Die Bonding Sales in Volume by Country (2018-2023)
5.1.3 North America Pastes for Die Bonding Sales in Value by Country (2018-2023)
5.2 North America Pastes for Die Bonding Forecasted Market Size by Country
5.2.1 North America Pastes for Die Bonding Sales in Volume by Country (2024-2029)
5.2.2 North America Pastes for Die Bonding Sales in Value by Country (2024-2029)
6 Europe Pastes for Die Bonding by Country
6.1 Europe Pastes for Die Bonding Historic Market Size by Country
6.1.1 Europe Pastes for Die Bonding Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Pastes for Die Bonding Sales in Volume by Country (2018-2023)
6.1.3 Europe Pastes for Die Bonding Sales in Value by Country (2018-2023)
6.2 Europe Pastes for Die Bonding Forecasted Market Size by Country
6.2.1 Europe Pastes for Die Bonding Sales in Volume by Country (2024-2029)
6.2.2 Europe Pastes for Die Bonding Sales in Value by Country (2024-2029)
7 Asia-Pacific Pastes for Die Bonding by Region
7.1 Asia-Pacific Pastes for Die Bonding Historic Market Size by Region
7.1.1 Asia-Pacific Pastes for Die Bonding Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Pastes for Die Bonding Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Pastes for Die Bonding Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Pastes for Die Bonding Forecasted Market Size by Region
7.2.1 Asia-Pacific Pastes for Die Bonding Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Pastes for Die Bonding Sales in Value by Region (2024-2029)
8 Latin America Pastes for Die Bonding by Country
8.1 Latin America Pastes for Die Bonding Historic Market Size by Country
8.1.1 Latin America Pastes for Die Bonding Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Pastes for Die Bonding Sales in Volume by Country (2018-2023)
8.1.3 Latin America Pastes for Die Bonding Sales in Value by Country (2018-2023)
8.2 Latin America Pastes for Die Bonding Forecasted Market Size by Country
8.2.1 Latin America Pastes for Die Bonding Sales in Volume by Country (2024-2029)
8.2.2 Latin America Pastes for Die Bonding Sales in Value by Country (2024-2029)
9 Middle East and Africa Pastes for Die Bonding by Country
9.1 Middle East and Africa Pastes for Die Bonding Historic Market Size by Country
9.1.1 Middle East and Africa Pastes for Die Bonding Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Pastes for Die Bonding Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Pastes for Die Bonding Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Pastes for Die Bonding Forecasted Market Size by Country
9.2.1 Middle East and Africa Pastes for Die Bonding Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Pastes for Die Bonding Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Sumitomo Bakelite
10.1.1 Sumitomo Bakelite Company Information
10.1.2 Sumitomo Bakelite Introduction and Business Overview
10.1.3 Sumitomo Bakelite Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Sumitomo Bakelite Pastes for Die Bonding Products Offered
10.1.5 Sumitomo Bakelite Recent Development
10.2 Showa Denko Materials
10.2.1 Showa Denko Materials Company Information
10.2.2 Showa Denko Materials Introduction and Business Overview
10.2.3 Showa Denko Materials Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Showa Denko Materials Pastes for Die Bonding Products Offered
10.2.5 Showa Denko Materials Recent Development
10.3 Henkel Adhesives
10.3.1 Henkel Adhesives Company Information
10.3.2 Henkel Adhesives Introduction and Business Overview
10.3.3 Henkel Adhesives Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Henkel Adhesives Pastes for Die Bonding Products Offered
10.3.5 Henkel Adhesives Recent Development
10.4 Heraeus
10.4.1 Heraeus Company Information
10.4.2 Heraeus Introduction and Business Overview
10.4.3 Heraeus Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Heraeus Pastes for Die Bonding Products Offered
10.4.5 Heraeus Recent Development
10.5 TANAKA Precious Metals
10.5.1 TANAKA Precious Metals Company Information
10.5.2 TANAKA Precious Metals Introduction and Business Overview
10.5.3 TANAKA Precious Metals Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.5.4 TANAKA Precious Metals Pastes for Die Bonding Products Offered
10.5.5 TANAKA Precious Metals Recent Development
10.6 AI Technology
10.6.1 AI Technology Company Information
10.6.2 AI Technology Introduction and Business Overview
10.6.3 AI Technology Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.6.4 AI Technology Pastes for Die Bonding Products Offered
10.6.5 AI Technology Recent Development
10.7 Alpha Advanced Materials
10.7.1 Alpha Advanced Materials Company Information
10.7.2 Alpha Advanced Materials Introduction and Business Overview
10.7.3 Alpha Advanced Materials Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Alpha Advanced Materials Pastes for Die Bonding Products Offered
10.7.5 Alpha Advanced Materials Recent Development
10.8 SMIC
10.8.1 SMIC Company Information
10.8.2 SMIC Introduction and Business Overview
10.8.3 SMIC Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.8.4 SMIC Pastes for Die Bonding Products Offered
10.8.5 SMIC Recent Development
10.9 Shenmao Technology
10.9.1 Shenmao Technology Company Information
10.9.2 Shenmao Technology Introduction and Business Overview
10.9.3 Shenmao Technology Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Shenmao Technology Pastes for Die Bonding Products Offered
10.9.5 Shenmao Technology Recent Development
10.10 Shenzhen Weite New Material
10.10.1 Shenzhen Weite New Material Company Information
10.10.2 Shenzhen Weite New Material Introduction and Business Overview
10.10.3 Shenzhen Weite New Material Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Shenzhen Weite New Material Pastes for Die Bonding Products Offered
10.10.5 Shenzhen Weite New Material Recent Development
10.11 Tongfang Tech
10.11.1 Tongfang Tech Company Information
10.11.2 Tongfang Tech Introduction and Business Overview
10.11.3 Tongfang Tech Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Tongfang Tech Pastes for Die Bonding Products Offered
10.11.5 Tongfang Tech Recent Development
10.12 AIM
10.12.1 AIM Company Information
10.12.2 AIM Introduction and Business Overview
10.12.3 AIM Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.12.4 AIM Pastes for Die Bonding Products Offered
10.12.5 AIM Recent Development
10.13 Namics
10.13.1 Namics Company Information
10.13.2 Namics Introduction and Business Overview
10.13.3 Namics Pastes for Die Bonding Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Namics Pastes for Die Bonding Products Offered
10.13.5 Namics Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Pastes for Die Bonding Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Pastes for Die Bonding Industrial Chain Analysis
11.4 Pastes for Die Bonding Market Dynamics
11.4.1 Pastes for Die Bonding Industry Trends
11.4.2 Pastes for Die Bonding Market Drivers
11.4.3 Pastes for Die Bonding Market Challenges
11.4.4 Pastes for Die Bonding Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Pastes for Die Bonding Distributors
12.3 Pastes for Die Bonding Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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