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Plating for Microelectronics-Global Market Insights and Sales Trends 2024
Synopsis
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The global Plating for Microelectronics market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Plating for Microelectronics in various end use industries. The expanding demands from the MEMS, PCB, IC and Photoelectron, are propelling Plating for Microelectronics market. Gold, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Zinc segment is estimated at % CAGR for the next seven-year period.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Plating for Microelectronics, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Plating for Microelectronics market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Plating for Microelectronics market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Plating for Microelectronics sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Plating for Microelectronics covered in this report include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical and Raschig GmbH, etc.
The global Plating for Microelectronics market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Global Plating for Microelectronics market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Plating for Microelectronics market, Segment by Type:
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Global Plating for Microelectronics market, by Application
MEMS
PCB
IC
Photoelectron
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Plating for Microelectronics companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The global Plating for Microelectronics market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Plating for Microelectronics in various end use industries. The expanding demands from the MEMS, PCB, IC and Photoelectron, are propelling Plating for Microelectronics market. Gold, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Zinc segment is estimated at % CAGR for the next seven-year period.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Plating for Microelectronics, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Plating for Microelectronics market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Plating for Microelectronics market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Plating for Microelectronics sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Plating for Microelectronics covered in this report include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical and Raschig GmbH, etc.
The global Plating for Microelectronics market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Global Plating for Microelectronics market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Plating for Microelectronics market, Segment by Type:
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Global Plating for Microelectronics market, by Application
MEMS
PCB
IC
Photoelectron
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Plating for Microelectronics companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Plating for Microelectronics
1.1 Plating for Microelectronics Market Overview
1.1.1 Plating for Microelectronics Product Scope
1.1.2 Plating for Microelectronics Market Status and Outlook
1.2 Global Plating for Microelectronics Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Plating for Microelectronics Market Size by Region (2018-2029)
1.4 Global Plating for Microelectronics Historic Market Size by Region (2018-2023)
1.5 Global Plating for Microelectronics Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Plating for Microelectronics Market Size (2018-2029)
1.6.1 North America Plating for Microelectronics Market Size (2018-2029)
1.6.2 Europe Plating for Microelectronics Market Size (2018-2029)
1.6.3 Asia-Pacific Plating for Microelectronics Market Size (2018-2029)
1.6.4 Latin America Plating for Microelectronics Market Size (2018-2029)
1.6.5 Middle East & Africa Plating for Microelectronics Market Size (2018-2029)
2 Plating for Microelectronics Market by Type
2.1 Introduction
2.1.1 Gold
2.1.2 Zinc
2.1.3 Nickel
2.1.4 Bronze
2.1.5 Tin
2.1.6 Copper
2.1.7 Others
2.2 Global Plating for Microelectronics Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Plating for Microelectronics Historic Market Size by Type (2018-2023)
2.2.2 Global Plating for Microelectronics Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Plating for Microelectronics Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Plating for Microelectronics Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Plating for Microelectronics Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Plating for Microelectronics Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Plating for Microelectronics Revenue Breakdown by Type (2018-2029)
3 Plating for Microelectronics Market Overview by Application
3.1 Introduction
3.1.1 MEMS
3.1.2 PCB
3.1.3 IC
3.1.4 Photoelectron
3.1.5 Others
3.2 Global Plating for Microelectronics Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Plating for Microelectronics Historic Market Size by Application (2018-2023)
3.2.2 Global Plating for Microelectronics Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Plating for Microelectronics Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Plating for Microelectronics Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Plating for Microelectronics Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Plating for Microelectronics Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Plating for Microelectronics Revenue Breakdown by Application (2018-2029)
4 Plating for Microelectronics Competition Analysis by Players
4.1 Global Plating for Microelectronics Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Plating for Microelectronics as of 2022)
4.3 Date of Key Players Enter into Plating for Microelectronics Market
4.4 Global Top Players Plating for Microelectronics Headquarters and Area Served
4.5 Key Players Plating for Microelectronics Product Solution and Service
4.6 Competitive Status
4.6.1 Plating for Microelectronics Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 DOW
5.1.1 DOW Profile
5.1.2 DOW Main Business
5.1.3 DOW Plating for Microelectronics Products, Services and Solutions
5.1.4 DOW Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.1.5 DOW Recent Developments
5.2 Mitsubishi Materials Corporation
5.2.1 Mitsubishi Materials Corporation Profile
5.2.2 Mitsubishi Materials Corporation Main Business
5.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Products, Services and Solutions
5.2.4 Mitsubishi Materials Corporation Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.2.5 Mitsubishi Materials Corporation Recent Developments
5.3 Heraeus
5.3.1 Heraeus Profile
5.3.2 Heraeus Main Business
5.3.3 Heraeus Plating for Microelectronics Products, Services and Solutions
5.3.4 Heraeus Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.3.5 XiLong Scientific Recent Developments
5.4 XiLong Scientific
5.4.1 XiLong Scientific Profile
5.4.2 XiLong Scientific Main Business
5.4.3 XiLong Scientific Plating for Microelectronics Products, Services and Solutions
5.4.4 XiLong Scientific Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.4.5 XiLong Scientific Recent Developments
5.5 Atotech
5.5.1 Atotech Profile
5.5.2 Atotech Main Business
5.5.3 Atotech Plating for Microelectronics Products, Services and Solutions
5.5.4 Atotech Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.5.5 Atotech Recent Developments
5.6 Yamato Denki
5.6.1 Yamato Denki Profile
5.6.2 Yamato Denki Main Business
5.6.3 Yamato Denki Plating for Microelectronics Products, Services and Solutions
5.6.4 Yamato Denki Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.6.5 Yamato Denki Recent Developments
5.7 Meltex
5.7.1 Meltex Profile
5.7.2 Meltex Main Business
5.7.3 Meltex Plating for Microelectronics Products, Services and Solutions
5.7.4 Meltex Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.7.5 Meltex Recent Developments
5.8 Ishihara Chemical
5.8.1 Ishihara Chemical Profile
5.8.2 Ishihara Chemical Main Business
5.8.3 Ishihara Chemical Plating for Microelectronics Products, Services and Solutions
5.8.4 Ishihara Chemical Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.8.5 Ishihara Chemical Recent Developments
5.9 Raschig GmbH
5.9.1 Raschig GmbH Profile
5.9.2 Raschig GmbH Main Business
5.9.3 Raschig GmbH Plating for Microelectronics Products, Services and Solutions
5.9.4 Raschig GmbH Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.9.5 Raschig GmbH Recent Developments
5.10 Japan Pure Chemical
5.10.1 Japan Pure Chemical Profile
5.10.2 Japan Pure Chemical Main Business
5.10.3 Japan Pure Chemical Plating for Microelectronics Products, Services and Solutions
5.10.4 Japan Pure Chemical Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.10.5 Japan Pure Chemical Recent Developments
5.11 Coatech
5.11.1 Coatech Profile
5.11.2 Coatech Main Business
5.11.3 Coatech Plating for Microelectronics Products, Services and Solutions
5.11.4 Coatech Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.11.5 Coatech Recent Developments
5.12 MAGNETO special anodes
5.12.1 MAGNETO special anodes Profile
5.12.2 MAGNETO special anodes Main Business
5.12.3 MAGNETO special anodes Plating for Microelectronics Products, Services and Solutions
5.12.4 MAGNETO special anodes Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.12.5 MAGNETO special anodes Recent Developments
5.13 Vopelius Chemie AG
5.13.1 Vopelius Chemie AG Profile
5.13.2 Vopelius Chemie AG Main Business
5.13.3 Vopelius Chemie AG Plating for Microelectronics Products, Services and Solutions
5.13.4 Vopelius Chemie AG Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.13.5 Vopelius Chemie AG Recent Developments
5.14 Moses Lake Industries
5.14.1 Moses Lake Industries Profile
5.14.2 Moses Lake Industries Main Business
5.14.3 Moses Lake Industries Plating for Microelectronics Products, Services and Solutions
5.14.4 Moses Lake Industries Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.14.5 Moses Lake Industries Recent Developments
5.15 JCU International
5.15.1 JCU International Profile
5.15.2 JCU International Main Business
5.15.3 JCU International Plating for Microelectronics Products, Services and Solutions
5.15.4 JCU International Plating for Microelectronics Revenue (US$ Million) & (2018-2023)
5.15.5 JCU International Recent Developments
6 North America
6.1 North America Plating for Microelectronics Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Plating for Microelectronics Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Plating for Microelectronics Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Plating for Microelectronics Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Plating for Microelectronics Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Plating for Microelectronics Market Dynamics
11.1 Plating for Microelectronics Industry Trends
11.2 Plating for Microelectronics Market Drivers
11.3 Plating for Microelectronics Market Challenges
11.4 Plating for Microelectronics Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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