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Radiation-Hardened Electronic Components-Global Market Insights and Sales Trends 2024
Synopsis
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components.
The global Radiation-Hardened Electronic Components market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Radiation-Hardened Electronic Components in various end use industries. The expanding demands from the Satellite, Launch Vehicle and Other, are propelling Radiation-Hardened Electronic Components market. MOSFET, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Bipolar Junction Transistor (BJT) segment is estimated at % CAGR for the next seven-year period.
Geographically, North America is the largest market for radiation hardened electronics market. Europe is the second largest global market followed by Asia-Pacific.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Radiation-Hardened Electronic Components, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Radiation-Hardened Electronic Components market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Radiation-Hardened Electronic Components market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Radiation-Hardened Electronic Components sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Radiation-Hardened Electronic Components covered in this report include STMicroelectronics, Infineon, Renesas Electronics, Texas Instruments, Microchip Technology, Efficient Power Conversion (EPC), GaN Systems, Teledyne e2v and Intersil, etc.
The global Radiation-Hardened Electronic Components market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
STMicroelectronics
Infineon
Renesas Electronics
Texas Instruments
Microchip Technology
Efficient Power Conversion (EPC)
GaN Systems
Teledyne e2v
Intersil
VPT, Inc.
Global Radiation-Hardened Electronic Components market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Radiation-Hardened Electronic Components market, Segment by Type:
MOSFET
Bipolar Junction Transistor (BJT)
Rectifier Diode
Other
Global Radiation-Hardened Electronic Components market, by Application
Satellite
Launch Vehicle
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Radiation-Hardened Electronic Components manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Radiation-Hardened Electronic Components in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. These devices are primarily used in high altitude applications where radiation could damage functioning of electronic components.
The global Radiation-Hardened Electronic Components market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Radiation-Hardened Electronic Components in various end use industries. The expanding demands from the Satellite, Launch Vehicle and Other, are propelling Radiation-Hardened Electronic Components market. MOSFET, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Bipolar Junction Transistor (BJT) segment is estimated at % CAGR for the next seven-year period.
Geographically, North America is the largest market for radiation hardened electronics market. Europe is the second largest global market followed by Asia-Pacific.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Radiation-Hardened Electronic Components, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Radiation-Hardened Electronic Components market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Radiation-Hardened Electronic Components market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Radiation-Hardened Electronic Components sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Radiation-Hardened Electronic Components covered in this report include STMicroelectronics, Infineon, Renesas Electronics, Texas Instruments, Microchip Technology, Efficient Power Conversion (EPC), GaN Systems, Teledyne e2v and Intersil, etc.
The global Radiation-Hardened Electronic Components market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
STMicroelectronics
Infineon
Renesas Electronics
Texas Instruments
Microchip Technology
Efficient Power Conversion (EPC)
GaN Systems
Teledyne e2v
Intersil
VPT, Inc.
Global Radiation-Hardened Electronic Components market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Radiation-Hardened Electronic Components market, Segment by Type:
MOSFET
Bipolar Junction Transistor (BJT)
Rectifier Diode
Other
Global Radiation-Hardened Electronic Components market, by Application
Satellite
Launch Vehicle
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Radiation-Hardened Electronic Components manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Radiation-Hardened Electronic Components in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Radiation-Hardened Electronic Components Market Overview
1.1 Radiation-Hardened Electronic Components Product Overview
1.2 Radiation-Hardened Electronic Components Market Segment by Type
1.2.1 MOSFET
1.2.2 Bipolar Junction Transistor (BJT)
1.2.3 Rectifier Diode
1.2.4 Other
1.3 Global Radiation-Hardened Electronic Components Market Size by Type
1.3.1 Global Radiation-Hardened Electronic Components Market Size Overview by Type (2018-2029)
1.3.2 Global Radiation-Hardened Electronic Components Historic Market Size Review by Type (2018-2023)
1.3.3 Global Radiation-Hardened Electronic Components Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Radiation-Hardened Electronic Components Sales Breakdown by Type (2018-2023)
1.4.2 Europe Radiation-Hardened Electronic Components Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Radiation-Hardened Electronic Components Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Radiation-Hardened Electronic Components Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Radiation-Hardened Electronic Components Sales Breakdown by Type (2018-2023)
2 Global Radiation-Hardened Electronic Components Market Competition by Company
2.1 Global Top Players by Radiation-Hardened Electronic Components Sales (2018-2023)
2.2 Global Top Players by Radiation-Hardened Electronic Components Revenue (2018-2023)
2.3 Global Top Players by Radiation-Hardened Electronic Components Price (2018-2023)
2.4 Global Top Manufacturers Radiation-Hardened Electronic Components Manufacturing Base Distribution, Sales Area, Product Type
2.5 Radiation-Hardened Electronic Components Market Competitive Situation and Trends
2.5.1 Radiation-Hardened Electronic Components Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Radiation-Hardened Electronic Components Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Radiation-Hardened Electronic Components as of 2022)
2.7 Date of Key Manufacturers Enter into Radiation-Hardened Electronic Components Market
2.8 Key Manufacturers Radiation-Hardened Electronic Components Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Radiation-Hardened Electronic Components Status and Outlook by Region
3.1 Global Radiation-Hardened Electronic Components Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Radiation-Hardened Electronic Components Historic Market Size by Region
3.2.1 Global Radiation-Hardened Electronic Components Sales in Volume by Region (2018-2023)
3.2.2 Global Radiation-Hardened Electronic Components Sales in Value by Region (2018-2023)
3.2.3 Global Radiation-Hardened Electronic Components Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Radiation-Hardened Electronic Components Forecasted Market Size by Region
3.3.1 Global Radiation-Hardened Electronic Components Sales in Volume by Region (2024-2029)
3.3.2 Global Radiation-Hardened Electronic Components Sales in Value by Region (2024-2029)
3.3.3 Global Radiation-Hardened Electronic Components Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Radiation-Hardened Electronic Components by Application
4.1 Radiation-Hardened Electronic Components Market Segment by Application
4.1.1 Satellite
4.1.2 Launch Vehicle
4.1.3 Other
4.2 Global Radiation-Hardened Electronic Components Market Size by Application
4.2.1 Global Radiation-Hardened Electronic Components Market Size Overview by Application (2018-2029)
4.2.2 Global Radiation-Hardened Electronic Components Historic Market Size Review by Application (2018-2023)
4.2.3 Global Radiation-Hardened Electronic Components Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Radiation-Hardened Electronic Components Sales Breakdown by Application (2018-2023)
4.3.2 Europe Radiation-Hardened Electronic Components Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Radiation-Hardened Electronic Components Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Radiation-Hardened Electronic Components Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Radiation-Hardened Electronic Components Sales Breakdown by Application (2018-2023)
5 North America Radiation-Hardened Electronic Components by Country
5.1 North America Radiation-Hardened Electronic Components Historic Market Size by Country
5.1.1 North America Radiation-Hardened Electronic Components Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Radiation-Hardened Electronic Components Sales in Volume by Country (2018-2023)
5.1.3 North America Radiation-Hardened Electronic Components Sales in Value by Country (2018-2023)
5.2 North America Radiation-Hardened Electronic Components Forecasted Market Size by Country
5.2.1 North America Radiation-Hardened Electronic Components Sales in Volume by Country (2024-2029)
5.2.2 North America Radiation-Hardened Electronic Components Sales in Value by Country (2024-2029)
6 Europe Radiation-Hardened Electronic Components by Country
6.1 Europe Radiation-Hardened Electronic Components Historic Market Size by Country
6.1.1 Europe Radiation-Hardened Electronic Components Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Radiation-Hardened Electronic Components Sales in Volume by Country (2018-2023)
6.1.3 Europe Radiation-Hardened Electronic Components Sales in Value by Country (2018-2023)
6.2 Europe Radiation-Hardened Electronic Components Forecasted Market Size by Country
6.2.1 Europe Radiation-Hardened Electronic Components Sales in Volume by Country (2024-2029)
6.2.2 Europe Radiation-Hardened Electronic Components Sales in Value by Country (2024-2029)
7 Asia-Pacific Radiation-Hardened Electronic Components by Region
7.1 Asia-Pacific Radiation-Hardened Electronic Components Historic Market Size by Region
7.1.1 Asia-Pacific Radiation-Hardened Electronic Components Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Radiation-Hardened Electronic Components Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Radiation-Hardened Electronic Components Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Radiation-Hardened Electronic Components Forecasted Market Size by Region
7.2.1 Asia-Pacific Radiation-Hardened Electronic Components Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Radiation-Hardened Electronic Components Sales in Value by Region (2024-2029)
8 Latin America Radiation-Hardened Electronic Components by Country
8.1 Latin America Radiation-Hardened Electronic Components Historic Market Size by Country
8.1.1 Latin America Radiation-Hardened Electronic Components Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Radiation-Hardened Electronic Components Sales in Volume by Country (2018-2023)
8.1.3 Latin America Radiation-Hardened Electronic Components Sales in Value by Country (2018-2023)
8.2 Latin America Radiation-Hardened Electronic Components Forecasted Market Size by Country
8.2.1 Latin America Radiation-Hardened Electronic Components Sales in Volume by Country (2024-2029)
8.2.2 Latin America Radiation-Hardened Electronic Components Sales in Value by Country (2024-2029)
9 Middle East and Africa Radiation-Hardened Electronic Components by Country
9.1 Middle East and Africa Radiation-Hardened Electronic Components Historic Market Size by Country
9.1.1 Middle East and Africa Radiation-Hardened Electronic Components Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Radiation-Hardened Electronic Components Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Radiation-Hardened Electronic Components Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Radiation-Hardened Electronic Components Forecasted Market Size by Country
9.2.1 Middle East and Africa Radiation-Hardened Electronic Components Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Radiation-Hardened Electronic Components Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 STMicroelectronics
10.1.1 STMicroelectronics Company Information
10.1.2 STMicroelectronics Introduction and Business Overview
10.1.3 STMicroelectronics Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.1.4 STMicroelectronics Radiation-Hardened Electronic Components Products Offered
10.1.5 STMicroelectronics Recent Development
10.2 Infineon
10.2.1 Infineon Company Information
10.2.2 Infineon Introduction and Business Overview
10.2.3 Infineon Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Infineon Radiation-Hardened Electronic Components Products Offered
10.2.5 Infineon Recent Development
10.3 Renesas Electronics
10.3.1 Renesas Electronics Company Information
10.3.2 Renesas Electronics Introduction and Business Overview
10.3.3 Renesas Electronics Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Renesas Electronics Radiation-Hardened Electronic Components Products Offered
10.3.5 Renesas Electronics Recent Development
10.4 Texas Instruments
10.4.1 Texas Instruments Company Information
10.4.2 Texas Instruments Introduction and Business Overview
10.4.3 Texas Instruments Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Texas Instruments Radiation-Hardened Electronic Components Products Offered
10.4.5 Texas Instruments Recent Development
10.5 Microchip Technology
10.5.1 Microchip Technology Company Information
10.5.2 Microchip Technology Introduction and Business Overview
10.5.3 Microchip Technology Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Microchip Technology Radiation-Hardened Electronic Components Products Offered
10.5.5 Microchip Technology Recent Development
10.6 Efficient Power Conversion (EPC)
10.6.1 Efficient Power Conversion (EPC) Company Information
10.6.2 Efficient Power Conversion (EPC) Introduction and Business Overview
10.6.3 Efficient Power Conversion (EPC) Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Efficient Power Conversion (EPC) Radiation-Hardened Electronic Components Products Offered
10.6.5 Efficient Power Conversion (EPC) Recent Development
10.7 GaN Systems
10.7.1 GaN Systems Company Information
10.7.2 GaN Systems Introduction and Business Overview
10.7.3 GaN Systems Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.7.4 GaN Systems Radiation-Hardened Electronic Components Products Offered
10.7.5 GaN Systems Recent Development
10.8 Teledyne e2v
10.8.1 Teledyne e2v Company Information
10.8.2 Teledyne e2v Introduction and Business Overview
10.8.3 Teledyne e2v Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Teledyne e2v Radiation-Hardened Electronic Components Products Offered
10.8.5 Teledyne e2v Recent Development
10.9 Intersil
10.9.1 Intersil Company Information
10.9.2 Intersil Introduction and Business Overview
10.9.3 Intersil Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Intersil Radiation-Hardened Electronic Components Products Offered
10.9.5 Intersil Recent Development
10.10 VPT, Inc.
10.10.1 VPT, Inc. Company Information
10.10.2 VPT, Inc. Introduction and Business Overview
10.10.3 VPT, Inc. Radiation-Hardened Electronic Components Sales, Revenue and Gross Margin (2018-2023)
10.10.4 VPT, Inc. Radiation-Hardened Electronic Components Products Offered
10.10.5 VPT, Inc. Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Radiation-Hardened Electronic Components Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Radiation-Hardened Electronic Components Industrial Chain Analysis
11.4 Radiation-Hardened Electronic Components Market Dynamics
11.4.1 Radiation-Hardened Electronic Components Industry Trends
11.4.2 Radiation-Hardened Electronic Components Market Drivers
11.4.3 Radiation-Hardened Electronic Components Market Challenges
11.4.4 Radiation-Hardened Electronic Components Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Radiation-Hardened Electronic Components Distributors
12.3 Radiation-Hardened Electronic Components Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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