The Market Reports

Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com

Semiconductor Die Attach Materials-Global Market Insights and Sales Trends 2024

Semiconductor Die Attach Materials-Global Market Insights and Sales Trends 2024

Publishing Date : Dec, 2023

License Type :
 

Report Code : 1879094

No of Pages : 114

Ask Your Query
Synopsis
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.

Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to QYR's investigation, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The global Semiconductor Die Attach Materials market size is expected to reach US$ 853.2 million by 2029, growing at a CAGR of 5.8% from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Die Attach Materials in various end use industries. The expanding demands from the Consumer Electronics, Automotive, Medical and Telecommunications, are propelling Semiconductor Die Attach Materials market. Die Attach Paste, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Die Attach Wire segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Die Attach Materials, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Die Attach Materials market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Die Attach Materials market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Die Attach Materials sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Die Attach Materials covered in this report include SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore, Heraeu and AIM, etc.
The global Semiconductor Die Attach Materials market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Global Semiconductor Die Attach Materials market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Die Attach Materials market, Segment by Type:
Die Attach Paste
Die Attach Wire
Others
Global Semiconductor Die Attach Materials market, by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Semiconductor Die Attach Materials manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Semiconductor Die Attach Materials in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index
1 Semiconductor Die Attach Materials Market Overview
1.1 Semiconductor Die Attach Materials Product Overview
1.2 Semiconductor Die Attach Materials Market Segment by Type
1.2.1 Die Attach Paste
1.2.2 Die Attach Wire
1.2.3 Others
1.3 Global Semiconductor Die Attach Materials Market Size by Type
1.3.1 Global Semiconductor Die Attach Materials Market Size Overview by Type (2018-2029)
1.3.2 Global Semiconductor Die Attach Materials Historic Market Size Review by Type (2018-2023)
1.3.3 Global Semiconductor Die Attach Materials Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Semiconductor Die Attach Materials Sales Breakdown by Type (2018-2023)
1.4.2 Europe Semiconductor Die Attach Materials Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Semiconductor Die Attach Materials Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Semiconductor Die Attach Materials Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Semiconductor Die Attach Materials Sales Breakdown by Type (2018-2023)
2 Global Semiconductor Die Attach Materials Market Competition by Company
2.1 Global Top Players by Semiconductor Die Attach Materials Sales (2018-2023)
2.2 Global Top Players by Semiconductor Die Attach Materials Revenue (2018-2023)
2.3 Global Top Players by Semiconductor Die Attach Materials Price (2018-2023)
2.4 Global Top Manufacturers Semiconductor Die Attach Materials Manufacturing Base Distribution, Sales Area, Product Type
2.5 Semiconductor Die Attach Materials Market Competitive Situation and Trends
2.5.1 Semiconductor Die Attach Materials Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Semiconductor Die Attach Materials Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Die Attach Materials as of 2022)
2.7 Date of Key Manufacturers Enter into Semiconductor Die Attach Materials Market
2.8 Key Manufacturers Semiconductor Die Attach Materials Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Semiconductor Die Attach Materials Status and Outlook by Region
3.1 Global Semiconductor Die Attach Materials Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Die Attach Materials Historic Market Size by Region
3.2.1 Global Semiconductor Die Attach Materials Sales in Volume by Region (2018-2023)
3.2.2 Global Semiconductor Die Attach Materials Sales in Value by Region (2018-2023)
3.2.3 Global Semiconductor Die Attach Materials Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Semiconductor Die Attach Materials Forecasted Market Size by Region
3.3.1 Global Semiconductor Die Attach Materials Sales in Volume by Region (2024-2029)
3.3.2 Global Semiconductor Die Attach Materials Sales in Value by Region (2024-2029)
3.3.3 Global Semiconductor Die Attach Materials Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Semiconductor Die Attach Materials by Application
4.1 Semiconductor Die Attach Materials Market Segment by Application
4.1.1 Consumer Electronics
4.1.2 Automotive
4.1.3 Medical
4.1.4 Telecommunications
4.1.5 Others
4.2 Global Semiconductor Die Attach Materials Market Size by Application
4.2.1 Global Semiconductor Die Attach Materials Market Size Overview by Application (2018-2029)
4.2.2 Global Semiconductor Die Attach Materials Historic Market Size Review by Application (2018-2023)
4.2.3 Global Semiconductor Die Attach Materials Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Semiconductor Die Attach Materials Sales Breakdown by Application (2018-2023)
4.3.2 Europe Semiconductor Die Attach Materials Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Semiconductor Die Attach Materials Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Semiconductor Die Attach Materials Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Semiconductor Die Attach Materials Sales Breakdown by Application (2018-2023)
5 North America Semiconductor Die Attach Materials by Country
5.1 North America Semiconductor Die Attach Materials Historic Market Size by Country
5.1.1 North America Semiconductor Die Attach Materials Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Semiconductor Die Attach Materials Sales in Volume by Country (2018-2023)
5.1.3 North America Semiconductor Die Attach Materials Sales in Value by Country (2018-2023)
5.2 North America Semiconductor Die Attach Materials Forecasted Market Size by Country
5.2.1 North America Semiconductor Die Attach Materials Sales in Volume by Country (2024-2029)
5.2.2 North America Semiconductor Die Attach Materials Sales in Value by Country (2024-2029)
6 Europe Semiconductor Die Attach Materials by Country
6.1 Europe Semiconductor Die Attach Materials Historic Market Size by Country
6.1.1 Europe Semiconductor Die Attach Materials Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Semiconductor Die Attach Materials Sales in Volume by Country (2018-2023)
6.1.3 Europe Semiconductor Die Attach Materials Sales in Value by Country (2018-2023)
6.2 Europe Semiconductor Die Attach Materials Forecasted Market Size by Country
6.2.1 Europe Semiconductor Die Attach Materials Sales in Volume by Country (2024-2029)
6.2.2 Europe Semiconductor Die Attach Materials Sales in Value by Country (2024-2029)
7 Asia-Pacific Semiconductor Die Attach Materials by Region
7.1 Asia-Pacific Semiconductor Die Attach Materials Historic Market Size by Region
7.1.1 Asia-Pacific Semiconductor Die Attach Materials Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Semiconductor Die Attach Materials Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Semiconductor Die Attach Materials Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Semiconductor Die Attach Materials Forecasted Market Size by Region
7.2.1 Asia-Pacific Semiconductor Die Attach Materials Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Semiconductor Die Attach Materials Sales in Value by Region (2024-2029)
8 Latin America Semiconductor Die Attach Materials by Country
8.1 Latin America Semiconductor Die Attach Materials Historic Market Size by Country
8.1.1 Latin America Semiconductor Die Attach Materials Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Semiconductor Die Attach Materials Sales in Volume by Country (2018-2023)
8.1.3 Latin America Semiconductor Die Attach Materials Sales in Value by Country (2018-2023)
8.2 Latin America Semiconductor Die Attach Materials Forecasted Market Size by Country
8.2.1 Latin America Semiconductor Die Attach Materials Sales in Volume by Country (2024-2029)
8.2.2 Latin America Semiconductor Die Attach Materials Sales in Value by Country (2024-2029)
9 Middle East and Africa Semiconductor Die Attach Materials by Country
9.1 Middle East and Africa Semiconductor Die Attach Materials Historic Market Size by Country
9.1.1 Middle East and Africa Semiconductor Die Attach Materials Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Semiconductor Die Attach Materials Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Semiconductor Die Attach Materials Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Semiconductor Die Attach Materials Forecasted Market Size by Country
9.2.1 Middle East and Africa Semiconductor Die Attach Materials Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Semiconductor Die Attach Materials Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 SMIC
10.1.1 SMIC Company Information
10.1.2 SMIC Introduction and Business Overview
10.1.3 SMIC Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.1.4 SMIC Semiconductor Die Attach Materials Products Offered
10.1.5 SMIC Recent Development
10.2 Henkel
10.2.1 Henkel Company Information
10.2.2 Henkel Introduction and Business Overview
10.2.3 Henkel Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Henkel Semiconductor Die Attach Materials Products Offered
10.2.5 Henkel Recent Development
10.3 Shenzhen Vital New Material
10.3.1 Shenzhen Vital New Material Company Information
10.3.2 Shenzhen Vital New Material Introduction and Business Overview
10.3.3 Shenzhen Vital New Material Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Shenzhen Vital New Material Semiconductor Die Attach Materials Products Offered
10.3.5 Shenzhen Vital New Material Recent Development
10.4 Indium
10.4.1 Indium Company Information
10.4.2 Indium Introduction and Business Overview
10.4.3 Indium Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Indium Semiconductor Die Attach Materials Products Offered
10.4.5 Indium Recent Development
10.5 Alpha Assembly Solutions
10.5.1 Alpha Assembly Solutions Company Information
10.5.2 Alpha Assembly Solutions Introduction and Business Overview
10.5.3 Alpha Assembly Solutions Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Alpha Assembly Solutions Semiconductor Die Attach Materials Products Offered
10.5.5 Alpha Assembly Solutions Recent Development
10.6 TONGFANG TECH
10.6.1 TONGFANG TECH Company Information
10.6.2 TONGFANG TECH Introduction and Business Overview
10.6.3 TONGFANG TECH Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.6.4 TONGFANG TECH Semiconductor Die Attach Materials Products Offered
10.6.5 TONGFANG TECH Recent Development
10.7 Umicore
10.7.1 Umicore Company Information
10.7.2 Umicore Introduction and Business Overview
10.7.3 Umicore Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Umicore Semiconductor Die Attach Materials Products Offered
10.7.5 Umicore Recent Development
10.8 Heraeu
10.8.1 Heraeu Company Information
10.8.2 Heraeu Introduction and Business Overview
10.8.3 Heraeu Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Heraeu Semiconductor Die Attach Materials Products Offered
10.8.5 Heraeu Recent Development
10.9 AIM
10.9.1 AIM Company Information
10.9.2 AIM Introduction and Business Overview
10.9.3 AIM Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.9.4 AIM Semiconductor Die Attach Materials Products Offered
10.9.5 AIM Recent Development
10.10 TAMURA RADIO
10.10.1 TAMURA RADIO Company Information
10.10.2 TAMURA RADIO Introduction and Business Overview
10.10.3 TAMURA RADIO Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.10.4 TAMURA RADIO Semiconductor Die Attach Materials Products Offered
10.10.5 TAMURA RADIO Recent Development
10.11 Kyocera
10.11.1 Kyocera Company Information
10.11.2 Kyocera Introduction and Business Overview
10.11.3 Kyocera Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Kyocera Semiconductor Die Attach Materials Products Offered
10.11.5 Kyocera Recent Development
10.12 Shanghai Jinji
10.12.1 Shanghai Jinji Company Information
10.12.2 Shanghai Jinji Introduction and Business Overview
10.12.3 Shanghai Jinji Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.12.4 Shanghai Jinji Semiconductor Die Attach Materials Products Offered
10.12.5 Shanghai Jinji Recent Development
10.13 Palomar Technologies
10.13.1 Palomar Technologies Company Information
10.13.2 Palomar Technologies Introduction and Business Overview
10.13.3 Palomar Technologies Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Palomar Technologies Semiconductor Die Attach Materials Products Offered
10.13.5 Palomar Technologies Recent Development
10.14 Nordson EFD
10.14.1 Nordson EFD Company Information
10.14.2 Nordson EFD Introduction and Business Overview
10.14.3 Nordson EFD Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.14.4 Nordson EFD Semiconductor Die Attach Materials Products Offered
10.14.5 Nordson EFD Recent Development
10.15 DuPont
10.15.1 DuPont Company Information
10.15.2 DuPont Introduction and Business Overview
10.15.3 DuPont Semiconductor Die Attach Materials Sales, Revenue and Gross Margin (2018-2023)
10.15.4 DuPont Semiconductor Die Attach Materials Products Offered
10.15.5 DuPont Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Semiconductor Die Attach Materials Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Semiconductor Die Attach Materials Industrial Chain Analysis
11.4 Semiconductor Die Attach Materials Market Dynamics
11.4.1 Semiconductor Die Attach Materials Industry Trends
11.4.2 Semiconductor Die Attach Materials Market Drivers
11.4.3 Semiconductor Die Attach Materials Market Challenges
11.4.4 Semiconductor Die Attach Materials Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Semiconductor Die Attach Materials Distributors
12.3 Semiconductor Die Attach Materials Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer

Published By : QY Research

Why ‘The Market Reports’

In Business: Pre Sales Support: Post Sales Support: Turn Around Time: Clients Served: Clients Assisted: Client Types: Payment: Partners with: Number of reports: Custom Research: Report Availability: Report Delivery Format: Security:

Payments Accepted From

Connect with us at

Complete Secure Website

SiteLock