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Solder Ball Packaging Material-Global Market Insights and Sales Trends 2024
Synopsis
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Solder Ball Packaging Material market size is expected to reach US$ 346.5 million by 2029, growing at a CAGR of 6.5% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Ball Packaging Material in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Solder Ball Packaging Material market. Lead Solder Ball, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Ball segment is estimated at % CAGR for the next seven-year period.
Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Ball Packaging Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Ball Packaging Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Ball Packaging Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Ball Packaging Material covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc.
The global Solder Ball Packaging Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Global Solder Ball Packaging Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Ball Packaging Material market, Segment by Type:
Lead Solder Ball
Lead Free Solder Ball
Global Solder Ball Packaging Material market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Ball Packaging Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The global Solder Ball Packaging Material market size is expected to reach US$ 346.5 million by 2029, growing at a CAGR of 6.5% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Ball Packaging Material in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Solder Ball Packaging Material market. Lead Solder Ball, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Ball segment is estimated at % CAGR for the next seven-year period.
Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Ball Packaging Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Ball Packaging Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Ball Packaging Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Ball Packaging Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Ball Packaging Material covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc.
The global Solder Ball Packaging Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Global Solder Ball Packaging Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Ball Packaging Material market, Segment by Type:
Lead Solder Ball
Lead Free Solder Ball
Global Solder Ball Packaging Material market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Ball Packaging Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Ball Packaging Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Solder Ball Packaging Material Market Overview
1.1 Solder Ball Packaging Material Product Overview
1.2 Solder Ball Packaging Material Market Segment by Type
1.2.1 Lead Solder Ball
1.2.2 Lead Free Solder Ball
1.3 Global Solder Ball Packaging Material Market Size by Type
1.3.1 Global Solder Ball Packaging Material Market Size Overview by Type (2018-2029)
1.3.2 Global Solder Ball Packaging Material Historic Market Size Review by Type (2018-2023)
1.3.3 Global Solder Ball Packaging Material Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Solder Ball Packaging Material Sales Breakdown by Type (2018-2023)
1.4.2 Europe Solder Ball Packaging Material Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Solder Ball Packaging Material Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Solder Ball Packaging Material Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Solder Ball Packaging Material Sales Breakdown by Type (2018-2023)
2 Global Solder Ball Packaging Material Market Competition by Company
2.1 Global Top Players by Solder Ball Packaging Material Sales (2018-2023)
2.2 Global Top Players by Solder Ball Packaging Material Revenue (2018-2023)
2.3 Global Top Players by Solder Ball Packaging Material Price (2018-2023)
2.4 Global Top Manufacturers Solder Ball Packaging Material Manufacturing Base Distribution, Sales Area, Product Type
2.5 Solder Ball Packaging Material Market Competitive Situation and Trends
2.5.1 Solder Ball Packaging Material Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Solder Ball Packaging Material Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Solder Ball Packaging Material as of 2022)
2.7 Date of Key Manufacturers Enter into Solder Ball Packaging Material Market
2.8 Key Manufacturers Solder Ball Packaging Material Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Solder Ball Packaging Material Status and Outlook by Region
3.1 Global Solder Ball Packaging Material Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Solder Ball Packaging Material Historic Market Size by Region
3.2.1 Global Solder Ball Packaging Material Sales in Volume by Region (2018-2023)
3.2.2 Global Solder Ball Packaging Material Sales in Value by Region (2018-2023)
3.2.3 Global Solder Ball Packaging Material Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Solder Ball Packaging Material Forecasted Market Size by Region
3.3.1 Global Solder Ball Packaging Material Sales in Volume by Region (2024-2029)
3.3.2 Global Solder Ball Packaging Material Sales in Value by Region (2024-2029)
3.3.3 Global Solder Ball Packaging Material Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Solder Ball Packaging Material by Application
4.1 Solder Ball Packaging Material Market Segment by Application
4.1.1 BGA
4.1.2 CSP & WLCSP
4.1.3 Flip-Chip & Others
4.2 Global Solder Ball Packaging Material Market Size by Application
4.2.1 Global Solder Ball Packaging Material Market Size Overview by Application (2018-2029)
4.2.2 Global Solder Ball Packaging Material Historic Market Size Review by Application (2018-2023)
4.2.3 Global Solder Ball Packaging Material Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Solder Ball Packaging Material Sales Breakdown by Application (2018-2023)
4.3.2 Europe Solder Ball Packaging Material Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Solder Ball Packaging Material Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Solder Ball Packaging Material Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Solder Ball Packaging Material Sales Breakdown by Application (2018-2023)
5 North America Solder Ball Packaging Material by Country
5.1 North America Solder Ball Packaging Material Historic Market Size by Country
5.1.1 North America Solder Ball Packaging Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Solder Ball Packaging Material Sales in Volume by Country (2018-2023)
5.1.3 North America Solder Ball Packaging Material Sales in Value by Country (2018-2023)
5.2 North America Solder Ball Packaging Material Forecasted Market Size by Country
5.2.1 North America Solder Ball Packaging Material Sales in Volume by Country (2024-2029)
5.2.2 North America Solder Ball Packaging Material Sales in Value by Country (2024-2029)
6 Europe Solder Ball Packaging Material by Country
6.1 Europe Solder Ball Packaging Material Historic Market Size by Country
6.1.1 Europe Solder Ball Packaging Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Solder Ball Packaging Material Sales in Volume by Country (2018-2023)
6.1.3 Europe Solder Ball Packaging Material Sales in Value by Country (2018-2023)
6.2 Europe Solder Ball Packaging Material Forecasted Market Size by Country
6.2.1 Europe Solder Ball Packaging Material Sales in Volume by Country (2024-2029)
6.2.2 Europe Solder Ball Packaging Material Sales in Value by Country (2024-2029)
7 Asia-Pacific Solder Ball Packaging Material by Region
7.1 Asia-Pacific Solder Ball Packaging Material Historic Market Size by Region
7.1.1 Asia-Pacific Solder Ball Packaging Material Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Solder Ball Packaging Material Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Solder Ball Packaging Material Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Solder Ball Packaging Material Forecasted Market Size by Region
7.2.1 Asia-Pacific Solder Ball Packaging Material Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Solder Ball Packaging Material Sales in Value by Region (2024-2029)
8 Latin America Solder Ball Packaging Material by Country
8.1 Latin America Solder Ball Packaging Material Historic Market Size by Country
8.1.1 Latin America Solder Ball Packaging Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Solder Ball Packaging Material Sales in Volume by Country (2018-2023)
8.1.3 Latin America Solder Ball Packaging Material Sales in Value by Country (2018-2023)
8.2 Latin America Solder Ball Packaging Material Forecasted Market Size by Country
8.2.1 Latin America Solder Ball Packaging Material Sales in Volume by Country (2024-2029)
8.2.2 Latin America Solder Ball Packaging Material Sales in Value by Country (2024-2029)
9 Middle East and Africa Solder Ball Packaging Material by Country
9.1 Middle East and Africa Solder Ball Packaging Material Historic Market Size by Country
9.1.1 Middle East and Africa Solder Ball Packaging Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Solder Ball Packaging Material Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Solder Ball Packaging Material Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Solder Ball Packaging Material Forecasted Market Size by Country
9.2.1 Middle East and Africa Solder Ball Packaging Material Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Solder Ball Packaging Material Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Senju Metal
10.1.1 Senju Metal Company Information
10.1.2 Senju Metal Introduction and Business Overview
10.1.3 Senju Metal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Senju Metal Solder Ball Packaging Material Products Offered
10.1.5 Senju Metal Recent Development
10.2 DS HiMetal
10.2.1 DS HiMetal Company Information
10.2.2 DS HiMetal Introduction and Business Overview
10.2.3 DS HiMetal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.2.4 DS HiMetal Solder Ball Packaging Material Products Offered
10.2.5 DS HiMetal Recent Development
10.3 MKE
10.3.1 MKE Company Information
10.3.2 MKE Introduction and Business Overview
10.3.3 MKE Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.3.4 MKE Solder Ball Packaging Material Products Offered
10.3.5 MKE Recent Development
10.4 YCTC
10.4.1 YCTC Company Information
10.4.2 YCTC Introduction and Business Overview
10.4.3 YCTC Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.4.4 YCTC Solder Ball Packaging Material Products Offered
10.4.5 YCTC Recent Development
10.5 Nippon Micrometal
10.5.1 Nippon Micrometal Company Information
10.5.2 Nippon Micrometal Introduction and Business Overview
10.5.3 Nippon Micrometal Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Nippon Micrometal Solder Ball Packaging Material Products Offered
10.5.5 Nippon Micrometal Recent Development
10.6 Accurus
10.6.1 Accurus Company Information
10.6.2 Accurus Introduction and Business Overview
10.6.3 Accurus Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Accurus Solder Ball Packaging Material Products Offered
10.6.5 Accurus Recent Development
10.7 PMTC
10.7.1 PMTC Company Information
10.7.2 PMTC Introduction and Business Overview
10.7.3 PMTC Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.7.4 PMTC Solder Ball Packaging Material Products Offered
10.7.5 PMTC Recent Development
10.8 Shanghai hiking solder material
10.8.1 Shanghai hiking solder material Company Information
10.8.2 Shanghai hiking solder material Introduction and Business Overview
10.8.3 Shanghai hiking solder material Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Shanghai hiking solder material Solder Ball Packaging Material Products Offered
10.8.5 Shanghai hiking solder material Recent Development
10.9 Shenmao Technology
10.9.1 Shenmao Technology Company Information
10.9.2 Shenmao Technology Introduction and Business Overview
10.9.3 Shenmao Technology Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Shenmao Technology Solder Ball Packaging Material Products Offered
10.9.5 Shenmao Technology Recent Development
10.10 Indium Corporation
10.10.1 Indium Corporation Company Information
10.10.2 Indium Corporation Introduction and Business Overview
10.10.3 Indium Corporation Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Indium Corporation Solder Ball Packaging Material Products Offered
10.10.5 Indium Corporation Recent Development
10.11 Jovy Systems
10.11.1 Jovy Systems Company Information
10.11.2 Jovy Systems Introduction and Business Overview
10.11.3 Jovy Systems Solder Ball Packaging Material Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Jovy Systems Solder Ball Packaging Material Products Offered
10.11.5 Jovy Systems Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Solder Ball Packaging Material Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Solder Ball Packaging Material Industrial Chain Analysis
11.4 Solder Ball Packaging Material Market Dynamics
11.4.1 Solder Ball Packaging Material Industry Trends
11.4.2 Solder Ball Packaging Material Market Drivers
11.4.3 Solder Ball Packaging Material Market Challenges
11.4.4 Solder Ball Packaging Material Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Solder Ball Packaging Material Distributors
12.3 Solder Ball Packaging Material Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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