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Thin Shrink Small Outline Package (TSSOP)-Global Market Insights and Sales Trends 2024
Synopsis
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads.
The global Thin Shrink Small Outline Package (TSSOP) market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Thin Shrink Small Outline Package (TSSOP) in various end use industries. The expanding demands from the Industrial, Auto Industry, Electronic and Others, are propelling Thin Shrink Small Outline Package (TSSOP) market. QSOP, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the VSOP segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Thin Shrink Small Outline Package (TSSOP), with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Thin Shrink Small Outline Package (TSSOP) market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Thin Shrink Small Outline Package (TSSOP) market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Thin Shrink Small Outline Package (TSSOP) sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Thin Shrink Small Outline Package (TSSOP) covered in this report include Amkor, Nexperia, Analog Devices, Microchip Technology Inc, Orient Semiconductor Electronics, Texas Instruments, Renesas, ON Semiconductor and Jameco Electronics, etc.
The global Thin Shrink Small Outline Package (TSSOP) market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Amkor
Nexperia
Analog Devices
Microchip Technology Inc
Orient Semiconductor Electronics
Texas Instruments
Renesas
ON Semiconductor
Jameco Electronics
Global Thin Shrink Small Outline Package (TSSOP) market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Thin Shrink Small Outline Package (TSSOP) market, Segment by Type:
QSOP
VSOP
Global Thin Shrink Small Outline Package (TSSOP) market, by Application
Industrial
Auto Industry
Electronic
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Thin Shrink Small Outline Package (TSSOP) companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads.
The global Thin Shrink Small Outline Package (TSSOP) market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Thin Shrink Small Outline Package (TSSOP) in various end use industries. The expanding demands from the Industrial, Auto Industry, Electronic and Others, are propelling Thin Shrink Small Outline Package (TSSOP) market. QSOP, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the VSOP segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Thin Shrink Small Outline Package (TSSOP), with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Thin Shrink Small Outline Package (TSSOP) market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Thin Shrink Small Outline Package (TSSOP) market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Thin Shrink Small Outline Package (TSSOP) sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Thin Shrink Small Outline Package (TSSOP) covered in this report include Amkor, Nexperia, Analog Devices, Microchip Technology Inc, Orient Semiconductor Electronics, Texas Instruments, Renesas, ON Semiconductor and Jameco Electronics, etc.
The global Thin Shrink Small Outline Package (TSSOP) market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Amkor
Nexperia
Analog Devices
Microchip Technology Inc
Orient Semiconductor Electronics
Texas Instruments
Renesas
ON Semiconductor
Jameco Electronics
Global Thin Shrink Small Outline Package (TSSOP) market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Thin Shrink Small Outline Package (TSSOP) market, Segment by Type:
QSOP
VSOP
Global Thin Shrink Small Outline Package (TSSOP) market, by Application
Industrial
Auto Industry
Electronic
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Thin Shrink Small Outline Package (TSSOP) companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Thin Shrink Small Outline Package (TSSOP)
1.1 Thin Shrink Small Outline Package (TSSOP) Market Overview
1.1.1 Thin Shrink Small Outline Package (TSSOP) Product Scope
1.1.2 Thin Shrink Small Outline Package (TSSOP) Market Status and Outlook
1.2 Global Thin Shrink Small Outline Package (TSSOP) Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2018-2029)
1.4 Global Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Region (2018-2023)
1.5 Global Thin Shrink Small Outline Package (TSSOP) Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
1.6.1 North America Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
1.6.2 Europe Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
1.6.3 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
1.6.4 Latin America Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
1.6.5 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size (2018-2029)
2 Thin Shrink Small Outline Package (TSSOP) Market by Type
2.1 Introduction
2.1.1 QSOP
2.1.2 VSOP
2.2 Global Thin Shrink Small Outline Package (TSSOP) Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Type (2018-2023)
2.2.2 Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Type (2018-2029)
3 Thin Shrink Small Outline Package (TSSOP) Market Overview by Application
3.1 Introduction
3.1.1 Industrial
3.1.2 Auto Industry
3.1.3 Electronic
3.1.4 Others
3.2 Global Thin Shrink Small Outline Package (TSSOP) Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Application (2018-2023)
3.2.2 Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Thin Shrink Small Outline Package (TSSOP) Revenue Breakdown by Application (2018-2029)
4 Thin Shrink Small Outline Package (TSSOP) Competition Analysis by Players
4.1 Global Thin Shrink Small Outline Package (TSSOP) Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Thin Shrink Small Outline Package (TSSOP) as of 2022)
4.3 Date of Key Players Enter into Thin Shrink Small Outline Package (TSSOP) Market
4.4 Global Top Players Thin Shrink Small Outline Package (TSSOP) Headquarters and Area Served
4.5 Key Players Thin Shrink Small Outline Package (TSSOP) Product Solution and Service
4.6 Competitive Status
4.6.1 Thin Shrink Small Outline Package (TSSOP) Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Amkor
5.1.1 Amkor Profile
5.1.2 Amkor Main Business
5.1.3 Amkor Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.1.4 Amkor Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.1.5 Amkor Recent Developments
5.2 Nexperia
5.2.1 Nexperia Profile
5.2.2 Nexperia Main Business
5.2.3 Nexperia Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.2.4 Nexperia Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.2.5 Nexperia Recent Developments
5.3 Analog Devices
5.3.1 Analog Devices Profile
5.3.2 Analog Devices Main Business
5.3.3 Analog Devices Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.3.4 Analog Devices Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.3.5 Microchip Technology Inc Recent Developments
5.4 Microchip Technology Inc
5.4.1 Microchip Technology Inc Profile
5.4.2 Microchip Technology Inc Main Business
5.4.3 Microchip Technology Inc Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.4.4 Microchip Technology Inc Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.4.5 Microchip Technology Inc Recent Developments
5.5 Orient Semiconductor Electronics
5.5.1 Orient Semiconductor Electronics Profile
5.5.2 Orient Semiconductor Electronics Main Business
5.5.3 Orient Semiconductor Electronics Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.5.4 Orient Semiconductor Electronics Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.5.5 Orient Semiconductor Electronics Recent Developments
5.6 Texas Instruments
5.6.1 Texas Instruments Profile
5.6.2 Texas Instruments Main Business
5.6.3 Texas Instruments Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.6.4 Texas Instruments Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.6.5 Texas Instruments Recent Developments
5.7 Renesas
5.7.1 Renesas Profile
5.7.2 Renesas Main Business
5.7.3 Renesas Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.7.4 Renesas Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.7.5 Renesas Recent Developments
5.8 ON Semiconductor
5.8.1 ON Semiconductor Profile
5.8.2 ON Semiconductor Main Business
5.8.3 ON Semiconductor Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.8.4 ON Semiconductor Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.8.5 ON Semiconductor Recent Developments
5.9 Jameco Electronics
5.9.1 Jameco Electronics Profile
5.9.2 Jameco Electronics Main Business
5.9.3 Jameco Electronics Thin Shrink Small Outline Package (TSSOP) Products, Services and Solutions
5.9.4 Jameco Electronics Thin Shrink Small Outline Package (TSSOP) Revenue (US$ Million) & (2018-2023)
5.9.5 Jameco Electronics Recent Developments
6 North America
6.1 North America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Thin Shrink Small Outline Package (TSSOP) Market Dynamics
11.1 Thin Shrink Small Outline Package (TSSOP) Industry Trends
11.2 Thin Shrink Small Outline Package (TSSOP) Market Drivers
11.3 Thin Shrink Small Outline Package (TSSOP) Market Challenges
11.4 Thin Shrink Small Outline Package (TSSOP) Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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