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Wafer Dicing Blade-Global Market Insights and Sales Trends 2024
Synopsis
In the preliminary work of semiconductor wafer packaging, the dicing blade is an important tool for cutting wafers and manufacturing chips. It has a direct impact on the quality and life of the chips.
The global Wafer Dicing Blade market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Dicing Blade in various end use industries. The expanding demands from the IC, Discrete Devices and LED,, are propelling Wafer Dicing Blade market. Hub Dicing Blades, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Hubless Dicing Blades segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Dicing Blade, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Dicing Blade market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Dicing Blade market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Dicing Blade sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Dicing Blade covered in this report include DISCO, ADT, K&S, UKAM, Ceiba and Shanghai Sinyang Semiconductor Materials, etc.
The global Wafer Dicing Blade market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DISCO
ADT
K&S
UKAM
Ceiba
Shanghai Sinyang Semiconductor Materials
Global Wafer Dicing Blade market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Dicing Blade market, Segment by Type:
Hub Dicing Blades
Hubless Dicing Blades
Other
Global Wafer Dicing Blade market, by Application
IC
Discrete Devices
LED
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Dicing Blade manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Dicing Blade in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
In the preliminary work of semiconductor wafer packaging, the dicing blade is an important tool for cutting wafers and manufacturing chips. It has a direct impact on the quality and life of the chips.
The global Wafer Dicing Blade market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Dicing Blade in various end use industries. The expanding demands from the IC, Discrete Devices and LED,, are propelling Wafer Dicing Blade market. Hub Dicing Blades, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Hubless Dicing Blades segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Dicing Blade, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Dicing Blade market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Dicing Blade market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Dicing Blade sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Dicing Blade covered in this report include DISCO, ADT, K&S, UKAM, Ceiba and Shanghai Sinyang Semiconductor Materials, etc.
The global Wafer Dicing Blade market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DISCO
ADT
K&S
UKAM
Ceiba
Shanghai Sinyang Semiconductor Materials
Global Wafer Dicing Blade market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Dicing Blade market, Segment by Type:
Hub Dicing Blades
Hubless Dicing Blades
Other
Global Wafer Dicing Blade market, by Application
IC
Discrete Devices
LED
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Dicing Blade manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Dicing Blade in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Wafer Dicing Blade Market Overview
1.1 Wafer Dicing Blade Product Overview
1.2 Wafer Dicing Blade Market Segment by Type
1.2.1 Hub Dicing Blades
1.2.2 Hubless Dicing Blades
1.2.3 Other
1.3 Global Wafer Dicing Blade Market Size by Type
1.3.1 Global Wafer Dicing Blade Market Size Overview by Type (2018-2029)
1.3.2 Global Wafer Dicing Blade Historic Market Size Review by Type (2018-2023)
1.3.3 Global Wafer Dicing Blade Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Wafer Dicing Blade Sales Breakdown by Type (2018-2023)
1.4.2 Europe Wafer Dicing Blade Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Wafer Dicing Blade Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Wafer Dicing Blade Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Wafer Dicing Blade Sales Breakdown by Type (2018-2023)
2 Global Wafer Dicing Blade Market Competition by Company
2.1 Global Top Players by Wafer Dicing Blade Sales (2018-2023)
2.2 Global Top Players by Wafer Dicing Blade Revenue (2018-2023)
2.3 Global Top Players by Wafer Dicing Blade Price (2018-2023)
2.4 Global Top Manufacturers Wafer Dicing Blade Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wafer Dicing Blade Market Competitive Situation and Trends
2.5.1 Wafer Dicing Blade Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Wafer Dicing Blade Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Dicing Blade as of 2022)
2.7 Date of Key Manufacturers Enter into Wafer Dicing Blade Market
2.8 Key Manufacturers Wafer Dicing Blade Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Wafer Dicing Blade Status and Outlook by Region
3.1 Global Wafer Dicing Blade Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Dicing Blade Historic Market Size by Region
3.2.1 Global Wafer Dicing Blade Sales in Volume by Region (2018-2023)
3.2.2 Global Wafer Dicing Blade Sales in Value by Region (2018-2023)
3.2.3 Global Wafer Dicing Blade Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Wafer Dicing Blade Forecasted Market Size by Region
3.3.1 Global Wafer Dicing Blade Sales in Volume by Region (2024-2029)
3.3.2 Global Wafer Dicing Blade Sales in Value by Region (2024-2029)
3.3.3 Global Wafer Dicing Blade Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Wafer Dicing Blade by Application
4.1 Wafer Dicing Blade Market Segment by Application
4.1.1 IC
4.1.2 Discrete Devices
4.1.3 LED
4.2 Global Wafer Dicing Blade Market Size by Application
4.2.1 Global Wafer Dicing Blade Market Size Overview by Application (2018-2029)
4.2.2 Global Wafer Dicing Blade Historic Market Size Review by Application (2018-2023)
4.2.3 Global Wafer Dicing Blade Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Wafer Dicing Blade Sales Breakdown by Application (2018-2023)
4.3.2 Europe Wafer Dicing Blade Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Wafer Dicing Blade Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Wafer Dicing Blade Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Wafer Dicing Blade Sales Breakdown by Application (2018-2023)
5 North America Wafer Dicing Blade by Country
5.1 North America Wafer Dicing Blade Historic Market Size by Country
5.1.1 North America Wafer Dicing Blade Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Wafer Dicing Blade Sales in Volume by Country (2018-2023)
5.1.3 North America Wafer Dicing Blade Sales in Value by Country (2018-2023)
5.2 North America Wafer Dicing Blade Forecasted Market Size by Country
5.2.1 North America Wafer Dicing Blade Sales in Volume by Country (2024-2029)
5.2.2 North America Wafer Dicing Blade Sales in Value by Country (2024-2029)
6 Europe Wafer Dicing Blade by Country
6.1 Europe Wafer Dicing Blade Historic Market Size by Country
6.1.1 Europe Wafer Dicing Blade Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Wafer Dicing Blade Sales in Volume by Country (2018-2023)
6.1.3 Europe Wafer Dicing Blade Sales in Value by Country (2018-2023)
6.2 Europe Wafer Dicing Blade Forecasted Market Size by Country
6.2.1 Europe Wafer Dicing Blade Sales in Volume by Country (2024-2029)
6.2.2 Europe Wafer Dicing Blade Sales in Value by Country (2024-2029)
7 Asia-Pacific Wafer Dicing Blade by Region
7.1 Asia-Pacific Wafer Dicing Blade Historic Market Size by Region
7.1.1 Asia-Pacific Wafer Dicing Blade Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Wafer Dicing Blade Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Wafer Dicing Blade Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Wafer Dicing Blade Forecasted Market Size by Region
7.2.1 Asia-Pacific Wafer Dicing Blade Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Wafer Dicing Blade Sales in Value by Region (2024-2029)
8 Latin America Wafer Dicing Blade by Country
8.1 Latin America Wafer Dicing Blade Historic Market Size by Country
8.1.1 Latin America Wafer Dicing Blade Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Wafer Dicing Blade Sales in Volume by Country (2018-2023)
8.1.3 Latin America Wafer Dicing Blade Sales in Value by Country (2018-2023)
8.2 Latin America Wafer Dicing Blade Forecasted Market Size by Country
8.2.1 Latin America Wafer Dicing Blade Sales in Volume by Country (2024-2029)
8.2.2 Latin America Wafer Dicing Blade Sales in Value by Country (2024-2029)
9 Middle East and Africa Wafer Dicing Blade by Country
9.1 Middle East and Africa Wafer Dicing Blade Historic Market Size by Country
9.1.1 Middle East and Africa Wafer Dicing Blade Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Wafer Dicing Blade Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Wafer Dicing Blade Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Wafer Dicing Blade Forecasted Market Size by Country
9.2.1 Middle East and Africa Wafer Dicing Blade Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Wafer Dicing Blade Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 DISCO
10.1.1 DISCO Company Information
10.1.2 DISCO Introduction and Business Overview
10.1.3 DISCO Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.1.4 DISCO Wafer Dicing Blade Products Offered
10.1.5 DISCO Recent Development
10.2 ADT
10.2.1 ADT Company Information
10.2.2 ADT Introduction and Business Overview
10.2.3 ADT Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ADT Wafer Dicing Blade Products Offered
10.2.5 ADT Recent Development
10.3 K&S
10.3.1 K&S Company Information
10.3.2 K&S Introduction and Business Overview
10.3.3 K&S Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.3.4 K&S Wafer Dicing Blade Products Offered
10.3.5 K&S Recent Development
10.4 UKAM
10.4.1 UKAM Company Information
10.4.2 UKAM Introduction and Business Overview
10.4.3 UKAM Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.4.4 UKAM Wafer Dicing Blade Products Offered
10.4.5 UKAM Recent Development
10.5 Ceiba
10.5.1 Ceiba Company Information
10.5.2 Ceiba Introduction and Business Overview
10.5.3 Ceiba Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Ceiba Wafer Dicing Blade Products Offered
10.5.5 Ceiba Recent Development
10.6 Shanghai Sinyang Semiconductor Materials
10.6.1 Shanghai Sinyang Semiconductor Materials Company Information
10.6.2 Shanghai Sinyang Semiconductor Materials Introduction and Business Overview
10.6.3 Shanghai Sinyang Semiconductor Materials Wafer Dicing Blade Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Shanghai Sinyang Semiconductor Materials Wafer Dicing Blade Products Offered
10.6.5 Shanghai Sinyang Semiconductor Materials Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Wafer Dicing Blade Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Wafer Dicing Blade Industrial Chain Analysis
11.4 Wafer Dicing Blade Market Dynamics
11.4.1 Wafer Dicing Blade Industry Trends
11.4.2 Wafer Dicing Blade Market Drivers
11.4.3 Wafer Dicing Blade Market Challenges
11.4.4 Wafer Dicing Blade Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Wafer Dicing Blade Distributors
12.3 Wafer Dicing Blade Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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