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Wafer Edge Grinding Machine-Global Market Insights and Sales Trends 2025
Synopsis
It grinds the substrate and the edge part of the wafer.
The global Wafer Edge Grinding Machine market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Edge Grinding Machine in various end use industries. The expanding demands from the Semiconductor Manufacturing Plants and Research Institutes, are propelling Wafer Edge Grinding Machine market. Below 8 Inches, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 8-12 Inches segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Edge Grinding Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Edge Grinding Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Edge Grinding Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Edge Grinding Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Edge Grinding Machine covered in this report include ACCRETECH, SpeedFam, Revasum, AxusTech, Peter Wolters, Daitron, MAT Inc, Dikema Presicion Machinery and Dynavest, etc.
The global Wafer Edge Grinding Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ACCRETECH
SpeedFam
Revasum
AxusTech
Peter Wolters
Daitron
MAT Inc
Dikema Presicion Machinery
Dynavest
Global Wafer Edge Grinding Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Edge Grinding Machine market, Segment by Type:
Below 8 Inches
8-12 Inches
Above 12 Inches
Global Wafer Edge Grinding Machine market, by Application
Semiconductor Manufacturing Plants
Research Institutes
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Edge Grinding Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Edge Grinding Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
It grinds the substrate and the edge part of the wafer.
The global Wafer Edge Grinding Machine market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Edge Grinding Machine in various end use industries. The expanding demands from the Semiconductor Manufacturing Plants and Research Institutes, are propelling Wafer Edge Grinding Machine market. Below 8 Inches, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 8-12 Inches segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Edge Grinding Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Edge Grinding Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Edge Grinding Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Edge Grinding Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Edge Grinding Machine covered in this report include ACCRETECH, SpeedFam, Revasum, AxusTech, Peter Wolters, Daitron, MAT Inc, Dikema Presicion Machinery and Dynavest, etc.
The global Wafer Edge Grinding Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ACCRETECH
SpeedFam
Revasum
AxusTech
Peter Wolters
Daitron
MAT Inc
Dikema Presicion Machinery
Dynavest
Global Wafer Edge Grinding Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Edge Grinding Machine market, Segment by Type:
Below 8 Inches
8-12 Inches
Above 12 Inches
Global Wafer Edge Grinding Machine market, by Application
Semiconductor Manufacturing Plants
Research Institutes
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Edge Grinding Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Edge Grinding Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Wafer Edge Grinding Machine Market Overview
1.1 Wafer Edge Grinding Machine Product Overview
1.2 Wafer Edge Grinding Machine Market Segment by Type
1.2.1 Below 8 Inches
1.2.2 8-12 Inches
1.2.3 Above 12 Inches
1.3 Global Wafer Edge Grinding Machine Market Size by Type
1.3.1 Global Wafer Edge Grinding Machine Market Size Overview by Type (2018-2029)
1.3.2 Global Wafer Edge Grinding Machine Historic Market Size Review by Type (2018-2023)
1.3.3 Global Wafer Edge Grinding Machine Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Wafer Edge Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.2 Europe Wafer Edge Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Wafer Edge Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Wafer Edge Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Wafer Edge Grinding Machine Sales Breakdown by Type (2018-2023)
2 Global Wafer Edge Grinding Machine Market Competition by Company
2.1 Global Top Players by Wafer Edge Grinding Machine Sales (2018-2023)
2.2 Global Top Players by Wafer Edge Grinding Machine Revenue (2018-2023)
2.3 Global Top Players by Wafer Edge Grinding Machine Price (2018-2023)
2.4 Global Top Manufacturers Wafer Edge Grinding Machine Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wafer Edge Grinding Machine Market Competitive Situation and Trends
2.5.1 Wafer Edge Grinding Machine Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Wafer Edge Grinding Machine Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Edge Grinding Machine as of 2022)
2.7 Date of Key Manufacturers Enter into Wafer Edge Grinding Machine Market
2.8 Key Manufacturers Wafer Edge Grinding Machine Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Wafer Edge Grinding Machine Status and Outlook by Region
3.1 Global Wafer Edge Grinding Machine Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Edge Grinding Machine Historic Market Size by Region
3.2.1 Global Wafer Edge Grinding Machine Sales in Volume by Region (2018-2023)
3.2.2 Global Wafer Edge Grinding Machine Sales in Value by Region (2018-2023)
3.2.3 Global Wafer Edge Grinding Machine Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Wafer Edge Grinding Machine Forecasted Market Size by Region
3.3.1 Global Wafer Edge Grinding Machine Sales in Volume by Region (2024-2029)
3.3.2 Global Wafer Edge Grinding Machine Sales in Value by Region (2024-2029)
3.3.3 Global Wafer Edge Grinding Machine Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Wafer Edge Grinding Machine by Application
4.1 Wafer Edge Grinding Machine Market Segment by Application
4.1.1 Semiconductor Manufacturing Plants
4.1.2 Research Institutes
4.2 Global Wafer Edge Grinding Machine Market Size by Application
4.2.1 Global Wafer Edge Grinding Machine Market Size Overview by Application (2018-2029)
4.2.2 Global Wafer Edge Grinding Machine Historic Market Size Review by Application (2018-2023)
4.2.3 Global Wafer Edge Grinding Machine Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Wafer Edge Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.2 Europe Wafer Edge Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Wafer Edge Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Wafer Edge Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Wafer Edge Grinding Machine Sales Breakdown by Application (2018-2023)
5 North America Wafer Edge Grinding Machine by Country
5.1 North America Wafer Edge Grinding Machine Historic Market Size by Country
5.1.1 North America Wafer Edge Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Wafer Edge Grinding Machine Sales in Volume by Country (2018-2023)
5.1.3 North America Wafer Edge Grinding Machine Sales in Value by Country (2018-2023)
5.2 North America Wafer Edge Grinding Machine Forecasted Market Size by Country
5.2.1 North America Wafer Edge Grinding Machine Sales in Volume by Country (2024-2029)
5.2.2 North America Wafer Edge Grinding Machine Sales in Value by Country (2024-2029)
6 Europe Wafer Edge Grinding Machine by Country
6.1 Europe Wafer Edge Grinding Machine Historic Market Size by Country
6.1.1 Europe Wafer Edge Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Wafer Edge Grinding Machine Sales in Volume by Country (2018-2023)
6.1.3 Europe Wafer Edge Grinding Machine Sales in Value by Country (2018-2023)
6.2 Europe Wafer Edge Grinding Machine Forecasted Market Size by Country
6.2.1 Europe Wafer Edge Grinding Machine Sales in Volume by Country (2024-2029)
6.2.2 Europe Wafer Edge Grinding Machine Sales in Value by Country (2024-2029)
7 Asia-Pacific Wafer Edge Grinding Machine by Region
7.1 Asia-Pacific Wafer Edge Grinding Machine Historic Market Size by Region
7.1.1 Asia-Pacific Wafer Edge Grinding Machine Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Wafer Edge Grinding Machine Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Wafer Edge Grinding Machine Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Wafer Edge Grinding Machine Forecasted Market Size by Region
7.2.1 Asia-Pacific Wafer Edge Grinding Machine Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Wafer Edge Grinding Machine Sales in Value by Region (2024-2029)
8 Latin America Wafer Edge Grinding Machine by Country
8.1 Latin America Wafer Edge Grinding Machine Historic Market Size by Country
8.1.1 Latin America Wafer Edge Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Wafer Edge Grinding Machine Sales in Volume by Country (2018-2023)
8.1.3 Latin America Wafer Edge Grinding Machine Sales in Value by Country (2018-2023)
8.2 Latin America Wafer Edge Grinding Machine Forecasted Market Size by Country
8.2.1 Latin America Wafer Edge Grinding Machine Sales in Volume by Country (2024-2029)
8.2.2 Latin America Wafer Edge Grinding Machine Sales in Value by Country (2024-2029)
9 Middle East and Africa Wafer Edge Grinding Machine by Country
9.1 Middle East and Africa Wafer Edge Grinding Machine Historic Market Size by Country
9.1.1 Middle East and Africa Wafer Edge Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Wafer Edge Grinding Machine Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Wafer Edge Grinding Machine Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Wafer Edge Grinding Machine Forecasted Market Size by Country
9.2.1 Middle East and Africa Wafer Edge Grinding Machine Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Wafer Edge Grinding Machine Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 ACCRETECH
10.1.1 ACCRETECH Company Information
10.1.2 ACCRETECH Introduction and Business Overview
10.1.3 ACCRETECH Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.1.4 ACCRETECH Wafer Edge Grinding Machine Products Offered
10.1.5 ACCRETECH Recent Development
10.2 SpeedFam
10.2.1 SpeedFam Company Information
10.2.2 SpeedFam Introduction and Business Overview
10.2.3 SpeedFam Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.2.4 SpeedFam Wafer Edge Grinding Machine Products Offered
10.2.5 SpeedFam Recent Development
10.3 Revasum
10.3.1 Revasum Company Information
10.3.2 Revasum Introduction and Business Overview
10.3.3 Revasum Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Revasum Wafer Edge Grinding Machine Products Offered
10.3.5 Revasum Recent Development
10.4 AxusTech
10.4.1 AxusTech Company Information
10.4.2 AxusTech Introduction and Business Overview
10.4.3 AxusTech Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.4.4 AxusTech Wafer Edge Grinding Machine Products Offered
10.4.5 AxusTech Recent Development
10.5 Peter Wolters
10.5.1 Peter Wolters Company Information
10.5.2 Peter Wolters Introduction and Business Overview
10.5.3 Peter Wolters Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Peter Wolters Wafer Edge Grinding Machine Products Offered
10.5.5 Peter Wolters Recent Development
10.6 Daitron
10.6.1 Daitron Company Information
10.6.2 Daitron Introduction and Business Overview
10.6.3 Daitron Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Daitron Wafer Edge Grinding Machine Products Offered
10.6.5 Daitron Recent Development
10.7 MAT Inc
10.7.1 MAT Inc Company Information
10.7.2 MAT Inc Introduction and Business Overview
10.7.3 MAT Inc Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.7.4 MAT Inc Wafer Edge Grinding Machine Products Offered
10.7.5 MAT Inc Recent Development
10.8 Dikema Presicion Machinery
10.8.1 Dikema Presicion Machinery Company Information
10.8.2 Dikema Presicion Machinery Introduction and Business Overview
10.8.3 Dikema Presicion Machinery Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Dikema Presicion Machinery Wafer Edge Grinding Machine Products Offered
10.8.5 Dikema Presicion Machinery Recent Development
10.9 Dynavest
10.9.1 Dynavest Company Information
10.9.2 Dynavest Introduction and Business Overview
10.9.3 Dynavest Wafer Edge Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Dynavest Wafer Edge Grinding Machine Products Offered
10.9.5 Dynavest Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Wafer Edge Grinding Machine Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Wafer Edge Grinding Machine Industrial Chain Analysis
11.4 Wafer Edge Grinding Machine Market Dynamics
11.4.1 Wafer Edge Grinding Machine Industry Trends
11.4.2 Wafer Edge Grinding Machine Market Drivers
11.4.3 Wafer Edge Grinding Machine Market Challenges
11.4.4 Wafer Edge Grinding Machine Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Wafer Edge Grinding Machine Distributors
12.3 Wafer Edge Grinding Machine Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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