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Wafer Grinding Machine-Global Market Insights and Sales Trends 2024
Synopsis
Wafer Grinding Machine can reduce the size of the wafer in the production of integrated circuits, and make the wafer meet the requirements of more complex integrated circuits. The wafer substrate is thinned by thinning / lapping to improve the heat dissipation effect of the chip, which is also conducive to the later packaging process.
The global Wafer Grinding Machine market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Grinding Machine in various end use industries. The expanding demands from the Below 4 inch, 4-8 inch, 8-12 inch and Others, are propelling Wafer Grinding Machine market. Semi-automatic, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Full-automatic segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Grinding Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Grinding Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Grinding Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Grinding Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Grinding Machine covered in this report include DISCO, ACCRETECH, CETGC, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Limited, Plasma-Therm LLC, Han's Laser Technology Industry Group Co. Ltd., ASM Laser Separation International (ALSI) B.V. and N-TEC Corp, etc.
The global Wafer Grinding Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DISCO
ACCRETECH
CETGC
Suzhou Delphi Laser Co. Ltd.
SPTS Technologies Limited
Plasma-Therm LLC
Han's Laser Technology Industry Group Co. Ltd.
ASM Laser Separation International (ALSI) B.V.
N-TEC Corp
Global Wafer Grinding Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Grinding Machine market, Segment by Type:
Semi-automatic
Full-automatic
Global Wafer Grinding Machine market, by Application
Below 4 inch
4-8 inch
8-12 inch
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Grinding Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Grinding Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Wafer Grinding Machine can reduce the size of the wafer in the production of integrated circuits, and make the wafer meet the requirements of more complex integrated circuits. The wafer substrate is thinned by thinning / lapping to improve the heat dissipation effect of the chip, which is also conducive to the later packaging process.
The global Wafer Grinding Machine market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Grinding Machine in various end use industries. The expanding demands from the Below 4 inch, 4-8 inch, 8-12 inch and Others, are propelling Wafer Grinding Machine market. Semi-automatic, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Full-automatic segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Grinding Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Grinding Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Grinding Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Grinding Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Grinding Machine covered in this report include DISCO, ACCRETECH, CETGC, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Limited, Plasma-Therm LLC, Han's Laser Technology Industry Group Co. Ltd., ASM Laser Separation International (ALSI) B.V. and N-TEC Corp, etc.
The global Wafer Grinding Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
DISCO
ACCRETECH
CETGC
Suzhou Delphi Laser Co. Ltd.
SPTS Technologies Limited
Plasma-Therm LLC
Han's Laser Technology Industry Group Co. Ltd.
ASM Laser Separation International (ALSI) B.V.
N-TEC Corp
Global Wafer Grinding Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Grinding Machine market, Segment by Type:
Semi-automatic
Full-automatic
Global Wafer Grinding Machine market, by Application
Below 4 inch
4-8 inch
8-12 inch
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Grinding Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Grinding Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Wafer Grinding Machine Market Overview
1.1 Wafer Grinding Machine Product Overview
1.2 Wafer Grinding Machine Market Segment by Type
1.2.1 Semi-automatic
1.2.2 Full-automatic
1.3 Global Wafer Grinding Machine Market Size by Type
1.3.1 Global Wafer Grinding Machine Market Size Overview by Type (2018-2029)
1.3.2 Global Wafer Grinding Machine Historic Market Size Review by Type (2018-2023)
1.3.3 Global Wafer Grinding Machine Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Wafer Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.2 Europe Wafer Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Wafer Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Wafer Grinding Machine Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Wafer Grinding Machine Sales Breakdown by Type (2018-2023)
2 Global Wafer Grinding Machine Market Competition by Company
2.1 Global Top Players by Wafer Grinding Machine Sales (2018-2023)
2.2 Global Top Players by Wafer Grinding Machine Revenue (2018-2023)
2.3 Global Top Players by Wafer Grinding Machine Price (2018-2023)
2.4 Global Top Manufacturers Wafer Grinding Machine Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wafer Grinding Machine Market Competitive Situation and Trends
2.5.1 Wafer Grinding Machine Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Wafer Grinding Machine Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Grinding Machine as of 2022)
2.7 Date of Key Manufacturers Enter into Wafer Grinding Machine Market
2.8 Key Manufacturers Wafer Grinding Machine Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Wafer Grinding Machine Status and Outlook by Region
3.1 Global Wafer Grinding Machine Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Grinding Machine Historic Market Size by Region
3.2.1 Global Wafer Grinding Machine Sales in Volume by Region (2018-2023)
3.2.2 Global Wafer Grinding Machine Sales in Value by Region (2018-2023)
3.2.3 Global Wafer Grinding Machine Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Wafer Grinding Machine Forecasted Market Size by Region
3.3.1 Global Wafer Grinding Machine Sales in Volume by Region (2024-2029)
3.3.2 Global Wafer Grinding Machine Sales in Value by Region (2024-2029)
3.3.3 Global Wafer Grinding Machine Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Wafer Grinding Machine by Application
4.1 Wafer Grinding Machine Market Segment by Application
4.1.1 Below 4 inch
4.1.2 4-8 inch
4.1.3 8-12 inch
4.1.4 Others
4.2 Global Wafer Grinding Machine Market Size by Application
4.2.1 Global Wafer Grinding Machine Market Size Overview by Application (2018-2029)
4.2.2 Global Wafer Grinding Machine Historic Market Size Review by Application (2018-2023)
4.2.3 Global Wafer Grinding Machine Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Wafer Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.2 Europe Wafer Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Wafer Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Wafer Grinding Machine Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Wafer Grinding Machine Sales Breakdown by Application (2018-2023)
5 North America Wafer Grinding Machine by Country
5.1 North America Wafer Grinding Machine Historic Market Size by Country
5.1.1 North America Wafer Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Wafer Grinding Machine Sales in Volume by Country (2018-2023)
5.1.3 North America Wafer Grinding Machine Sales in Value by Country (2018-2023)
5.2 North America Wafer Grinding Machine Forecasted Market Size by Country
5.2.1 North America Wafer Grinding Machine Sales in Volume by Country (2024-2029)
5.2.2 North America Wafer Grinding Machine Sales in Value by Country (2024-2029)
6 Europe Wafer Grinding Machine by Country
6.1 Europe Wafer Grinding Machine Historic Market Size by Country
6.1.1 Europe Wafer Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Wafer Grinding Machine Sales in Volume by Country (2018-2023)
6.1.3 Europe Wafer Grinding Machine Sales in Value by Country (2018-2023)
6.2 Europe Wafer Grinding Machine Forecasted Market Size by Country
6.2.1 Europe Wafer Grinding Machine Sales in Volume by Country (2024-2029)
6.2.2 Europe Wafer Grinding Machine Sales in Value by Country (2024-2029)
7 Asia-Pacific Wafer Grinding Machine by Region
7.1 Asia-Pacific Wafer Grinding Machine Historic Market Size by Region
7.1.1 Asia-Pacific Wafer Grinding Machine Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Wafer Grinding Machine Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Wafer Grinding Machine Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Wafer Grinding Machine Forecasted Market Size by Region
7.2.1 Asia-Pacific Wafer Grinding Machine Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Wafer Grinding Machine Sales in Value by Region (2024-2029)
8 Latin America Wafer Grinding Machine by Country
8.1 Latin America Wafer Grinding Machine Historic Market Size by Country
8.1.1 Latin America Wafer Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Wafer Grinding Machine Sales in Volume by Country (2018-2023)
8.1.3 Latin America Wafer Grinding Machine Sales in Value by Country (2018-2023)
8.2 Latin America Wafer Grinding Machine Forecasted Market Size by Country
8.2.1 Latin America Wafer Grinding Machine Sales in Volume by Country (2024-2029)
8.2.2 Latin America Wafer Grinding Machine Sales in Value by Country (2024-2029)
9 Middle East and Africa Wafer Grinding Machine by Country
9.1 Middle East and Africa Wafer Grinding Machine Historic Market Size by Country
9.1.1 Middle East and Africa Wafer Grinding Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Wafer Grinding Machine Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Wafer Grinding Machine Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Wafer Grinding Machine Forecasted Market Size by Country
9.2.1 Middle East and Africa Wafer Grinding Machine Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Wafer Grinding Machine Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 DISCO
10.1.1 DISCO Company Information
10.1.2 DISCO Introduction and Business Overview
10.1.3 DISCO Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.1.4 DISCO Wafer Grinding Machine Products Offered
10.1.5 DISCO Recent Development
10.2 ACCRETECH
10.2.1 ACCRETECH Company Information
10.2.2 ACCRETECH Introduction and Business Overview
10.2.3 ACCRETECH Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ACCRETECH Wafer Grinding Machine Products Offered
10.2.5 ACCRETECH Recent Development
10.3 CETGC
10.3.1 CETGC Company Information
10.3.2 CETGC Introduction and Business Overview
10.3.3 CETGC Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.3.4 CETGC Wafer Grinding Machine Products Offered
10.3.5 CETGC Recent Development
10.4 Suzhou Delphi Laser Co. Ltd.
10.4.1 Suzhou Delphi Laser Co. Ltd. Company Information
10.4.2 Suzhou Delphi Laser Co. Ltd. Introduction and Business Overview
10.4.3 Suzhou Delphi Laser Co. Ltd. Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Suzhou Delphi Laser Co. Ltd. Wafer Grinding Machine Products Offered
10.4.5 Suzhou Delphi Laser Co. Ltd. Recent Development
10.5 SPTS Technologies Limited
10.5.1 SPTS Technologies Limited Company Information
10.5.2 SPTS Technologies Limited Introduction and Business Overview
10.5.3 SPTS Technologies Limited Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.5.4 SPTS Technologies Limited Wafer Grinding Machine Products Offered
10.5.5 SPTS Technologies Limited Recent Development
10.6 Plasma-Therm LLC
10.6.1 Plasma-Therm LLC Company Information
10.6.2 Plasma-Therm LLC Introduction and Business Overview
10.6.3 Plasma-Therm LLC Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Plasma-Therm LLC Wafer Grinding Machine Products Offered
10.6.5 Plasma-Therm LLC Recent Development
10.7 Han's Laser Technology Industry Group Co. Ltd.
10.7.1 Han's Laser Technology Industry Group Co. Ltd. Company Information
10.7.2 Han's Laser Technology Industry Group Co. Ltd. Introduction and Business Overview
10.7.3 Han's Laser Technology Industry Group Co. Ltd. Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Han's Laser Technology Industry Group Co. Ltd. Wafer Grinding Machine Products Offered
10.7.5 Han's Laser Technology Industry Group Co. Ltd. Recent Development
10.8 ASM Laser Separation International (ALSI) B.V.
10.8.1 ASM Laser Separation International (ALSI) B.V. Company Information
10.8.2 ASM Laser Separation International (ALSI) B.V. Introduction and Business Overview
10.8.3 ASM Laser Separation International (ALSI) B.V. Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.8.4 ASM Laser Separation International (ALSI) B.V. Wafer Grinding Machine Products Offered
10.8.5 ASM Laser Separation International (ALSI) B.V. Recent Development
10.9 N-TEC Corp
10.9.1 N-TEC Corp Company Information
10.9.2 N-TEC Corp Introduction and Business Overview
10.9.3 N-TEC Corp Wafer Grinding Machine Sales, Revenue and Gross Margin (2018-2023)
10.9.4 N-TEC Corp Wafer Grinding Machine Products Offered
10.9.5 N-TEC Corp Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Wafer Grinding Machine Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Wafer Grinding Machine Industrial Chain Analysis
11.4 Wafer Grinding Machine Market Dynamics
11.4.1 Wafer Grinding Machine Industry Trends
11.4.2 Wafer Grinding Machine Market Drivers
11.4.3 Wafer Grinding Machine Market Challenges
11.4.4 Wafer Grinding Machine Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Wafer Grinding Machine Distributors
12.3 Wafer Grinding Machine Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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