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Wafer Saw Machines-Global Market Insights and Sales Trends 2025
Synopsis
Dicing machine cut wafers into individual semiconductor chips with blades.
The global Wafer Saw Machines market size is expected to reach US$ 1227.2 million by 2029, growing at a CAGR of 5.8% from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Saw Machines in various end use industries. The expanding demands from the Solar, Semiconductor and Others,, are propelling Wafer Saw Machines market. Laser Dicing Machines, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Blades Dicing Machine segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Saw Machines, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Saw Machines market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Saw Machines market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Saw Machines sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Saw Machines covered in this report include Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex International, 3D-Micromac AG, Shenzhen tensun industrial equipment, Beijing Dianke Electronic Equipment and HEYAN TECHNOLOGY, etc.
The global Wafer Saw Machines market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Accretech
DISCO Corporation
Advanced Dicing Technology
Loadpoint
Dynatex International
3D-Micromac AG
Shenzhen tensun industrial equipment
Beijing Dianke Electronic Equipment
HEYAN TECHNOLOGY
SUNIC SOLAR
HGLASER
Global Wafer Saw Machines market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Saw Machines market, Segment by Type:
Laser Dicing Machines
Blades Dicing Machine
Global Wafer Saw Machines market, by Application
Solar
Semiconductor
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Saw Machines manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Saw Machines in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Dicing machine cut wafers into individual semiconductor chips with blades.
The global Wafer Saw Machines market size is expected to reach US$ 1227.2 million by 2029, growing at a CAGR of 5.8% from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Saw Machines in various end use industries. The expanding demands from the Solar, Semiconductor and Others,, are propelling Wafer Saw Machines market. Laser Dicing Machines, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Blades Dicing Machine segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Saw Machines, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Saw Machines market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Saw Machines market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Saw Machines sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Saw Machines covered in this report include Accretech, DISCO Corporation, Advanced Dicing Technology, Loadpoint, Dynatex International, 3D-Micromac AG, Shenzhen tensun industrial equipment, Beijing Dianke Electronic Equipment and HEYAN TECHNOLOGY, etc.
The global Wafer Saw Machines market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Accretech
DISCO Corporation
Advanced Dicing Technology
Loadpoint
Dynatex International
3D-Micromac AG
Shenzhen tensun industrial equipment
Beijing Dianke Electronic Equipment
HEYAN TECHNOLOGY
SUNIC SOLAR
HGLASER
Global Wafer Saw Machines market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Saw Machines market, Segment by Type:
Laser Dicing Machines
Blades Dicing Machine
Global Wafer Saw Machines market, by Application
Solar
Semiconductor
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Saw Machines manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Saw Machines in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Wafer Saw Machines Market Overview
1.1 Wafer Saw Machines Product Overview
1.2 Wafer Saw Machines Market Segment by Type
1.2.1 Laser Dicing Machines
1.2.2 Blades Dicing Machine
1.3 Global Wafer Saw Machines Market Size by Type
1.3.1 Global Wafer Saw Machines Market Size Overview by Type (2018-2029)
1.3.2 Global Wafer Saw Machines Historic Market Size Review by Type (2018-2023)
1.3.3 Global Wafer Saw Machines Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Wafer Saw Machines Sales Breakdown by Type (2018-2023)
1.4.2 Europe Wafer Saw Machines Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Wafer Saw Machines Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Wafer Saw Machines Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Wafer Saw Machines Sales Breakdown by Type (2018-2023)
2 Global Wafer Saw Machines Market Competition by Company
2.1 Global Top Players by Wafer Saw Machines Sales (2018-2023)
2.2 Global Top Players by Wafer Saw Machines Revenue (2018-2023)
2.3 Global Top Players by Wafer Saw Machines Price (2018-2023)
2.4 Global Top Manufacturers Wafer Saw Machines Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wafer Saw Machines Market Competitive Situation and Trends
2.5.1 Wafer Saw Machines Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Wafer Saw Machines Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Saw Machines as of 2022)
2.7 Date of Key Manufacturers Enter into Wafer Saw Machines Market
2.8 Key Manufacturers Wafer Saw Machines Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Wafer Saw Machines Status and Outlook by Region
3.1 Global Wafer Saw Machines Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Saw Machines Historic Market Size by Region
3.2.1 Global Wafer Saw Machines Sales in Volume by Region (2018-2023)
3.2.2 Global Wafer Saw Machines Sales in Value by Region (2018-2023)
3.2.3 Global Wafer Saw Machines Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Wafer Saw Machines Forecasted Market Size by Region
3.3.1 Global Wafer Saw Machines Sales in Volume by Region (2024-2029)
3.3.2 Global Wafer Saw Machines Sales in Value by Region (2024-2029)
3.3.3 Global Wafer Saw Machines Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Wafer Saw Machines by Application
4.1 Wafer Saw Machines Market Segment by Application
4.1.1 Solar
4.1.2 Semiconductor
4.1.3 Others
4.2 Global Wafer Saw Machines Market Size by Application
4.2.1 Global Wafer Saw Machines Market Size Overview by Application (2018-2029)
4.2.2 Global Wafer Saw Machines Historic Market Size Review by Application (2018-2023)
4.2.3 Global Wafer Saw Machines Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Wafer Saw Machines Sales Breakdown by Application (2018-2023)
4.3.2 Europe Wafer Saw Machines Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Wafer Saw Machines Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Wafer Saw Machines Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Wafer Saw Machines Sales Breakdown by Application (2018-2023)
5 North America Wafer Saw Machines by Country
5.1 North America Wafer Saw Machines Historic Market Size by Country
5.1.1 North America Wafer Saw Machines Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Wafer Saw Machines Sales in Volume by Country (2018-2023)
5.1.3 North America Wafer Saw Machines Sales in Value by Country (2018-2023)
5.2 North America Wafer Saw Machines Forecasted Market Size by Country
5.2.1 North America Wafer Saw Machines Sales in Volume by Country (2024-2029)
5.2.2 North America Wafer Saw Machines Sales in Value by Country (2024-2029)
6 Europe Wafer Saw Machines by Country
6.1 Europe Wafer Saw Machines Historic Market Size by Country
6.1.1 Europe Wafer Saw Machines Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Wafer Saw Machines Sales in Volume by Country (2018-2023)
6.1.3 Europe Wafer Saw Machines Sales in Value by Country (2018-2023)
6.2 Europe Wafer Saw Machines Forecasted Market Size by Country
6.2.1 Europe Wafer Saw Machines Sales in Volume by Country (2024-2029)
6.2.2 Europe Wafer Saw Machines Sales in Value by Country (2024-2029)
7 Asia-Pacific Wafer Saw Machines by Region
7.1 Asia-Pacific Wafer Saw Machines Historic Market Size by Region
7.1.1 Asia-Pacific Wafer Saw Machines Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Wafer Saw Machines Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Wafer Saw Machines Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Wafer Saw Machines Forecasted Market Size by Region
7.2.1 Asia-Pacific Wafer Saw Machines Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Wafer Saw Machines Sales in Value by Region (2024-2029)
8 Latin America Wafer Saw Machines by Country
8.1 Latin America Wafer Saw Machines Historic Market Size by Country
8.1.1 Latin America Wafer Saw Machines Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Wafer Saw Machines Sales in Volume by Country (2018-2023)
8.1.3 Latin America Wafer Saw Machines Sales in Value by Country (2018-2023)
8.2 Latin America Wafer Saw Machines Forecasted Market Size by Country
8.2.1 Latin America Wafer Saw Machines Sales in Volume by Country (2024-2029)
8.2.2 Latin America Wafer Saw Machines Sales in Value by Country (2024-2029)
9 Middle East and Africa Wafer Saw Machines by Country
9.1 Middle East and Africa Wafer Saw Machines Historic Market Size by Country
9.1.1 Middle East and Africa Wafer Saw Machines Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Wafer Saw Machines Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Wafer Saw Machines Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Wafer Saw Machines Forecasted Market Size by Country
9.2.1 Middle East and Africa Wafer Saw Machines Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Wafer Saw Machines Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Accretech
10.1.1 Accretech Company Information
10.1.2 Accretech Introduction and Business Overview
10.1.3 Accretech Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Accretech Wafer Saw Machines Products Offered
10.1.5 Accretech Recent Development
10.2 DISCO Corporation
10.2.1 DISCO Corporation Company Information
10.2.2 DISCO Corporation Introduction and Business Overview
10.2.3 DISCO Corporation Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.2.4 DISCO Corporation Wafer Saw Machines Products Offered
10.2.5 DISCO Corporation Recent Development
10.3 Advanced Dicing Technology
10.3.1 Advanced Dicing Technology Company Information
10.3.2 Advanced Dicing Technology Introduction and Business Overview
10.3.3 Advanced Dicing Technology Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Advanced Dicing Technology Wafer Saw Machines Products Offered
10.3.5 Advanced Dicing Technology Recent Development
10.4 Loadpoint
10.4.1 Loadpoint Company Information
10.4.2 Loadpoint Introduction and Business Overview
10.4.3 Loadpoint Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Loadpoint Wafer Saw Machines Products Offered
10.4.5 Loadpoint Recent Development
10.5 Dynatex International
10.5.1 Dynatex International Company Information
10.5.2 Dynatex International Introduction and Business Overview
10.5.3 Dynatex International Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Dynatex International Wafer Saw Machines Products Offered
10.5.5 Dynatex International Recent Development
10.6 3D-Micromac AG
10.6.1 3D-Micromac AG Company Information
10.6.2 3D-Micromac AG Introduction and Business Overview
10.6.3 3D-Micromac AG Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.6.4 3D-Micromac AG Wafer Saw Machines Products Offered
10.6.5 3D-Micromac AG Recent Development
10.7 Shenzhen tensun industrial equipment
10.7.1 Shenzhen tensun industrial equipment Company Information
10.7.2 Shenzhen tensun industrial equipment Introduction and Business Overview
10.7.3 Shenzhen tensun industrial equipment Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shenzhen tensun industrial equipment Wafer Saw Machines Products Offered
10.7.5 Shenzhen tensun industrial equipment Recent Development
10.8 Beijing Dianke Electronic Equipment
10.8.1 Beijing Dianke Electronic Equipment Company Information
10.8.2 Beijing Dianke Electronic Equipment Introduction and Business Overview
10.8.3 Beijing Dianke Electronic Equipment Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Beijing Dianke Electronic Equipment Wafer Saw Machines Products Offered
10.8.5 Beijing Dianke Electronic Equipment Recent Development
10.9 HEYAN TECHNOLOGY
10.9.1 HEYAN TECHNOLOGY Company Information
10.9.2 HEYAN TECHNOLOGY Introduction and Business Overview
10.9.3 HEYAN TECHNOLOGY Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.9.4 HEYAN TECHNOLOGY Wafer Saw Machines Products Offered
10.9.5 HEYAN TECHNOLOGY Recent Development
10.10 SUNIC SOLAR
10.10.1 SUNIC SOLAR Company Information
10.10.2 SUNIC SOLAR Introduction and Business Overview
10.10.3 SUNIC SOLAR Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.10.4 SUNIC SOLAR Wafer Saw Machines Products Offered
10.10.5 SUNIC SOLAR Recent Development
10.11 HGLASER
10.11.1 HGLASER Company Information
10.11.2 HGLASER Introduction and Business Overview
10.11.3 HGLASER Wafer Saw Machines Sales, Revenue and Gross Margin (2018-2023)
10.11.4 HGLASER Wafer Saw Machines Products Offered
10.11.5 HGLASER Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Wafer Saw Machines Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Wafer Saw Machines Industrial Chain Analysis
11.4 Wafer Saw Machines Market Dynamics
11.4.1 Wafer Saw Machines Industry Trends
11.4.2 Wafer Saw Machines Market Drivers
11.4.3 Wafer Saw Machines Market Challenges
11.4.4 Wafer Saw Machines Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Wafer Saw Machines Distributors
12.3 Wafer Saw Machines Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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