The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Wafer Thinning Machine-Global Market Insights and Sales Trends 2024
Synopsis
Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
The global Wafer Thinning Machine market size is expected to reach US$ 994 million by 2029, growing at a CAGR of 5.3% from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Thinning Machine in various end use industries. The expanding demands from the Silicon Wafer and Compound Semiconductors, are propelling Wafer Thinning Machine market. Edge Thinning, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Surface Thinning segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Thinning Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Thinning Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Thinning Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Thinning Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Thinning Machine covered in this report include ASM Pacific, Tokyo Seimitsu, DISCO Corporation, CETC Beijing Electronic Equipment, Arnold Gruppe, Hunan Yujing Machine Industrial, WAIDA MFG, GigaMat and Strasbaugh, etc.
The global Wafer Thinning Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASM Pacific
Tokyo Seimitsu
DISCO Corporation
CETC Beijing Electronic Equipment
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
GigaMat
Strasbaugh
Daitron
MAT Inc
Dikema Presicion Machinery
Dynavest
Komatsu NTC
Global Wafer Thinning Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Thinning Machine market, Segment by Type:
Edge Thinning
Surface Thinning
Global Wafer Thinning Machine market, by Application
Silicon Wafer
Compound Semiconductors
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Thinning Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Thinning Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.
The global Wafer Thinning Machine market size is expected to reach US$ 994 million by 2029, growing at a CAGR of 5.3% from 2023 to 2029. The market is mainly driven by the significant applications of Wafer Thinning Machine in various end use industries. The expanding demands from the Silicon Wafer and Compound Semiconductors, are propelling Wafer Thinning Machine market. Edge Thinning, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Surface Thinning segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Wafer Thinning Machine, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Wafer Thinning Machine market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Wafer Thinning Machine market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Wafer Thinning Machine sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Wafer Thinning Machine covered in this report include ASM Pacific, Tokyo Seimitsu, DISCO Corporation, CETC Beijing Electronic Equipment, Arnold Gruppe, Hunan Yujing Machine Industrial, WAIDA MFG, GigaMat and Strasbaugh, etc.
The global Wafer Thinning Machine market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ASM Pacific
Tokyo Seimitsu
DISCO Corporation
CETC Beijing Electronic Equipment
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
GigaMat
Strasbaugh
Daitron
MAT Inc
Dikema Presicion Machinery
Dynavest
Komatsu NTC
Global Wafer Thinning Machine market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Wafer Thinning Machine market, Segment by Type:
Edge Thinning
Surface Thinning
Global Wafer Thinning Machine market, by Application
Silicon Wafer
Compound Semiconductors
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Wafer Thinning Machine manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Wafer Thinning Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Wafer Thinning Machine Market Overview
1.1 Wafer Thinning Machine Product Overview
1.2 Wafer Thinning Machine Market Segment by Type
1.2.1 Edge Thinning
1.2.2 Surface Thinning
1.3 Global Wafer Thinning Machine Market Size by Type
1.3.1 Global Wafer Thinning Machine Market Size Overview by Type (2018-2029)
1.3.2 Global Wafer Thinning Machine Historic Market Size Review by Type (2018-2023)
1.3.3 Global Wafer Thinning Machine Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Wafer Thinning Machine Sales Breakdown by Type (2018-2023)
1.4.2 Europe Wafer Thinning Machine Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Wafer Thinning Machine Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Wafer Thinning Machine Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Wafer Thinning Machine Sales Breakdown by Type (2018-2023)
2 Global Wafer Thinning Machine Market Competition by Company
2.1 Global Top Players by Wafer Thinning Machine Sales (2018-2023)
2.2 Global Top Players by Wafer Thinning Machine Revenue (2018-2023)
2.3 Global Top Players by Wafer Thinning Machine Price (2018-2023)
2.4 Global Top Manufacturers Wafer Thinning Machine Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wafer Thinning Machine Market Competitive Situation and Trends
2.5.1 Wafer Thinning Machine Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Wafer Thinning Machine Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Thinning Machine as of 2022)
2.7 Date of Key Manufacturers Enter into Wafer Thinning Machine Market
2.8 Key Manufacturers Wafer Thinning Machine Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Wafer Thinning Machine Status and Outlook by Region
3.1 Global Wafer Thinning Machine Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Thinning Machine Historic Market Size by Region
3.2.1 Global Wafer Thinning Machine Sales in Volume by Region (2018-2023)
3.2.2 Global Wafer Thinning Machine Sales in Value by Region (2018-2023)
3.2.3 Global Wafer Thinning Machine Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Wafer Thinning Machine Forecasted Market Size by Region
3.3.1 Global Wafer Thinning Machine Sales in Volume by Region (2024-2029)
3.3.2 Global Wafer Thinning Machine Sales in Value by Region (2024-2029)
3.3.3 Global Wafer Thinning Machine Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Wafer Thinning Machine by Application
4.1 Wafer Thinning Machine Market Segment by Application
4.1.1 Silicon Wafer
4.1.2 Compound Semiconductors
4.2 Global Wafer Thinning Machine Market Size by Application
4.2.1 Global Wafer Thinning Machine Market Size Overview by Application (2018-2029)
4.2.2 Global Wafer Thinning Machine Historic Market Size Review by Application (2018-2023)
4.2.3 Global Wafer Thinning Machine Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Wafer Thinning Machine Sales Breakdown by Application (2018-2023)
4.3.2 Europe Wafer Thinning Machine Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Wafer Thinning Machine Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Wafer Thinning Machine Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Wafer Thinning Machine Sales Breakdown by Application (2018-2023)
5 North America Wafer Thinning Machine by Country
5.1 North America Wafer Thinning Machine Historic Market Size by Country
5.1.1 North America Wafer Thinning Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Wafer Thinning Machine Sales in Volume by Country (2018-2023)
5.1.3 North America Wafer Thinning Machine Sales in Value by Country (2018-2023)
5.2 North America Wafer Thinning Machine Forecasted Market Size by Country
5.2.1 North America Wafer Thinning Machine Sales in Volume by Country (2024-2029)
5.2.2 North America Wafer Thinning Machine Sales in Value by Country (2024-2029)
6 Europe Wafer Thinning Machine by Country
6.1 Europe Wafer Thinning Machine Historic Market Size by Country
6.1.1 Europe Wafer Thinning Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Wafer Thinning Machine Sales in Volume by Country (2018-2023)
6.1.3 Europe Wafer Thinning Machine Sales in Value by Country (2018-2023)
6.2 Europe Wafer Thinning Machine Forecasted Market Size by Country
6.2.1 Europe Wafer Thinning Machine Sales in Volume by Country (2024-2029)
6.2.2 Europe Wafer Thinning Machine Sales in Value by Country (2024-2029)
7 Asia-Pacific Wafer Thinning Machine by Region
7.1 Asia-Pacific Wafer Thinning Machine Historic Market Size by Region
7.1.1 Asia-Pacific Wafer Thinning Machine Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Wafer Thinning Machine Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Wafer Thinning Machine Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Wafer Thinning Machine Forecasted Market Size by Region
7.2.1 Asia-Pacific Wafer Thinning Machine Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Wafer Thinning Machine Sales in Value by Region (2024-2029)
8 Latin America Wafer Thinning Machine by Country
8.1 Latin America Wafer Thinning Machine Historic Market Size by Country
8.1.1 Latin America Wafer Thinning Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Wafer Thinning Machine Sales in Volume by Country (2018-2023)
8.1.3 Latin America Wafer Thinning Machine Sales in Value by Country (2018-2023)
8.2 Latin America Wafer Thinning Machine Forecasted Market Size by Country
8.2.1 Latin America Wafer Thinning Machine Sales in Volume by Country (2024-2029)
8.2.2 Latin America Wafer Thinning Machine Sales in Value by Country (2024-2029)
9 Middle East and Africa Wafer Thinning Machine by Country
9.1 Middle East and Africa Wafer Thinning Machine Historic Market Size by Country
9.1.1 Middle East and Africa Wafer Thinning Machine Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Wafer Thinning Machine Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Wafer Thinning Machine Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Wafer Thinning Machine Forecasted Market Size by Country
9.2.1 Middle East and Africa Wafer Thinning Machine Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Wafer Thinning Machine Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 ASM Pacific
10.1.1 ASM Pacific Company Information
10.1.2 ASM Pacific Introduction and Business Overview
10.1.3 ASM Pacific Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.1.4 ASM Pacific Wafer Thinning Machine Products Offered
10.1.5 ASM Pacific Recent Development
10.2 Tokyo Seimitsu
10.2.1 Tokyo Seimitsu Company Information
10.2.2 Tokyo Seimitsu Introduction and Business Overview
10.2.3 Tokyo Seimitsu Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Tokyo Seimitsu Wafer Thinning Machine Products Offered
10.2.5 Tokyo Seimitsu Recent Development
10.3 DISCO Corporation
10.3.1 DISCO Corporation Company Information
10.3.2 DISCO Corporation Introduction and Business Overview
10.3.3 DISCO Corporation Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.3.4 DISCO Corporation Wafer Thinning Machine Products Offered
10.3.5 DISCO Corporation Recent Development
10.4 CETC Beijing Electronic Equipment
10.4.1 CETC Beijing Electronic Equipment Company Information
10.4.2 CETC Beijing Electronic Equipment Introduction and Business Overview
10.4.3 CETC Beijing Electronic Equipment Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.4.4 CETC Beijing Electronic Equipment Wafer Thinning Machine Products Offered
10.4.5 CETC Beijing Electronic Equipment Recent Development
10.5 Arnold Gruppe
10.5.1 Arnold Gruppe Company Information
10.5.2 Arnold Gruppe Introduction and Business Overview
10.5.3 Arnold Gruppe Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Arnold Gruppe Wafer Thinning Machine Products Offered
10.5.5 Arnold Gruppe Recent Development
10.6 Hunan Yujing Machine Industrial
10.6.1 Hunan Yujing Machine Industrial Company Information
10.6.2 Hunan Yujing Machine Industrial Introduction and Business Overview
10.6.3 Hunan Yujing Machine Industrial Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Hunan Yujing Machine Industrial Wafer Thinning Machine Products Offered
10.6.5 Hunan Yujing Machine Industrial Recent Development
10.7 WAIDA MFG
10.7.1 WAIDA MFG Company Information
10.7.2 WAIDA MFG Introduction and Business Overview
10.7.3 WAIDA MFG Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.7.4 WAIDA MFG Wafer Thinning Machine Products Offered
10.7.5 WAIDA MFG Recent Development
10.8 GigaMat
10.8.1 GigaMat Company Information
10.8.2 GigaMat Introduction and Business Overview
10.8.3 GigaMat Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.8.4 GigaMat Wafer Thinning Machine Products Offered
10.8.5 GigaMat Recent Development
10.9 Strasbaugh
10.9.1 Strasbaugh Company Information
10.9.2 Strasbaugh Introduction and Business Overview
10.9.3 Strasbaugh Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Strasbaugh Wafer Thinning Machine Products Offered
10.9.5 Strasbaugh Recent Development
10.10 Daitron
10.10.1 Daitron Company Information
10.10.2 Daitron Introduction and Business Overview
10.10.3 Daitron Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Daitron Wafer Thinning Machine Products Offered
10.10.5 Daitron Recent Development
10.11 MAT Inc
10.11.1 MAT Inc Company Information
10.11.2 MAT Inc Introduction and Business Overview
10.11.3 MAT Inc Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.11.4 MAT Inc Wafer Thinning Machine Products Offered
10.11.5 MAT Inc Recent Development
10.12 Dikema Presicion Machinery
10.12.1 Dikema Presicion Machinery Company Information
10.12.2 Dikema Presicion Machinery Introduction and Business Overview
10.12.3 Dikema Presicion Machinery Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.12.4 Dikema Presicion Machinery Wafer Thinning Machine Products Offered
10.12.5 Dikema Presicion Machinery Recent Development
10.13 Dynavest
10.13.1 Dynavest Company Information
10.13.2 Dynavest Introduction and Business Overview
10.13.3 Dynavest Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Dynavest Wafer Thinning Machine Products Offered
10.13.5 Dynavest Recent Development
10.14 Komatsu NTC
10.14.1 Komatsu NTC Company Information
10.14.2 Komatsu NTC Introduction and Business Overview
10.14.3 Komatsu NTC Wafer Thinning Machine Sales, Revenue and Gross Margin (2018-2023)
10.14.4 Komatsu NTC Wafer Thinning Machine Products Offered
10.14.5 Komatsu NTC Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Wafer Thinning Machine Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Wafer Thinning Machine Industrial Chain Analysis
11.4 Wafer Thinning Machine Market Dynamics
11.4.1 Wafer Thinning Machine Industry Trends
11.4.2 Wafer Thinning Machine Market Drivers
11.4.3 Wafer Thinning Machine Market Challenges
11.4.4 Wafer Thinning Machine Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Wafer Thinning Machine Distributors
12.3 Wafer Thinning Machine Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest Industrial Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
